Abstract: An inkjet printhead and a manufacturing method thereof. In the manufacturing method, a chip and a porous material are provided. A heating layer is formed on the chip. A conductive layer is formed on the heating layer, and includes a notch therein to define a heating area. A chamber for storing liquid is formed on the heating area, and includes a first side and a second side. The first side faces the heating area, and the second side is connected to the first side. The chamber is formed with an exit, from which the liquid is dispensed, on the second side. The porous material is disposed on the chamber, and the liquid flows to the chamber through the porous material.

Abstract: An inkjet printhead and a manufacturing method thereof. In the manufacturing method, a chip and a porous material are provided. A heating layer is formed on the chip. A conductive layer is formed on the heating layer, and includes a notch therein to define a heating area. A chamber for storing liquid is formed on the heating area, and includes a first side and a second side. The first side faces the heating area, and the second side is connected to the first side. The chamber is formed with an exit, from which the liquid is dispensed, on the second side. The porous material is disposed on the chamber, and the liquid flows to the chamber through the porous material.

Abstract: An inkjet printhead and a manufacturing method thereof. In the manufacturing method, a chip and a porous material are provided. A heating layer is formed on the chip. A conductive layer is formed on the heating layer, and includes a notch therein to define a heating area. A chamber for storing liquid is formed on the heating area, and includes a first side and a second side. The first side faces the heating area, and the second side is connected to the first side. The chamber is formed with an exit, from which the liquid is dispensed, on the second side. The porous material is disposed on the chamber, and the liquid flows to the chamber through the porous material.

Abstract: A structure of the stacked inkjet head is composed of a stacked fluid structure and an actuator. At least one of the several plates in the stacked fluid structure has a junction with a tuning hole for enhancing the connection strength of the junction, accommodating overflown adhesive, and reducing structural deformation resulted from the temperature. The invention also avoids the troubles of inhomogeneous etching speeds when making nozzles or channels.

Abstract: An inkjet printhead and a manufacturing method thereof. In the manufacturing method, a chip and a porous material are provided. A heating layer is formed on the chip. A conductive layer is formed on the heating layer, and includes a notch therein to define a heating area. A chamber for storing liquid is formed on the heating area, and includes a first side and a second side. The first side faces the heating area, and the second side is connected to the first side. The chamber is formed with an exit, from which the liquid is dispensed, on the second side. The porous material is disposed on the chamber, and the liquid flows to the chamber through the porous material.

Abstract: A structure of the stacked inkjet head is composed of a stacked fluid structure and an actuator. At least one of the several plates in the stacked fluid structure has a junction with a tuning hole for enhancing the connection strength of the junction, accommodating overflown adhesive, and reducing structural deformation resulted from the temperature. The invention also avoids the troubles of inhomogeneous etching speeds when making nozzles or channels.

Abstract: A packaging structure for inkjet print head chips and the method for manufacturing them are disclosed. An inkjet print head chip with several contact nodes on its surface is mounted onto a substrate through chip bonding to form a packaging structure. Since the contact nodes are not limited to the border of the chip, the number of pins on the chip can be increased. The packaging method can be combined with the semiconductor processes to lower the cost. Moreover, the chip mounting packaging structure has the advantages of self-alignment and high reliability.