Patents by Inventor FABIAN DIEPOLD

FABIAN DIEPOLD has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11916545
    Abstract: A method for operating a normally off or normally on power semiconductor element. A threshold voltage change in a threshold voltage of the power semiconductor element in relation to a reference threshold voltage is determined. A switch-on gate voltage is applied between a gate terminal and a source terminal of the power semiconductor element for the purpose of switching on the power semiconductor element is changed by the threshold voltage change in relation to a reference switch-on gate voltage corresponding to the reference threshold voltage.
    Type: Grant
    Filed: December 19, 2019
    Date of Patent: February 27, 2024
    Assignee: Siemens Aktiengesellschaft
    Inventors: Benno Weis, Fabian Diepold
  • Patent number: 11337299
    Abstract: An electronic assembly has a printed circuit board with first and second component sides. A cooling element on the first component side is cooled by forced convection produced by a convection unit. A majority of electronic components are arranged on the second component side. Non-current-conducting plated-through holes are used to transport thermal energy generated by an electronic component from the second component side to the first component side. The thermal energy can be transported away from the printed circuit board and dissipated by means of the forced convection. A corresponding method for dissipating heat from an electronic assembly is also disclosed.
    Type: Grant
    Filed: January 29, 2020
    Date of Patent: May 17, 2022
    Assignee: Siemens Aktiengesellschaft
    Inventors: Fabian Diepold, Alexander Kiesel, Benno Weis, Johannes Fürst
  • Publication number: 20220046786
    Abstract: An electronic assembly has a printed circuit board with first and second component sides. A cooling element on the first component side is cooled by forced convection produced by a convection unit. A majority of electronic components are arranged on the second component side. Non-current-conducting plated-through holes are used to transport thermal energy generated by an electronic component from the second component side to the first component side. The thermal energy can be transported away from the printed circuit board and dissipated by means of the forced convection. A corresponding method for dissipating heat from an electronic assembly is also disclosed.
    Type: Application
    Filed: January 29, 2020
    Publication date: February 10, 2022
    Applicant: Siemens Aktiengesellschaft
    Inventors: FABIAN DIEPOLD, ALEXANDER KIESEL, BENNO WEIS, JOHANNES FÜRST
  • Patent number: 11233461
    Abstract: A modular converter includes an inverter having power semiconductor switches made of GaN or InGaN and being operated with a blocking voltage of at least 400V and with a clock frequency of at least 40 kHz. A connection assembly distributes input and output signals and input and output AC voltages. A control assembly generates control signals for the inverter, a supply assembly with a rectifier converts the input alternating voltage into an intermediate circuit voltage, a rear wall assembly distributes the intermediate circuit voltage and the control signals for the inverter, and a load assembly converts the intermediate circuit voltage into the output alternating voltage for a load or for a secondary network. The connection assembly and the rear wall assembly are electrically connected to the other assemblies by way of releasable mechanical connections. A modular converter system that uses the modular inverter is also described.
    Type: Grant
    Filed: September 13, 2018
    Date of Patent: January 25, 2022
    Assignee: Siemens Aktiengesellschaft
    Inventors: Johannes Fürst, Fabian Diepold
  • Publication number: 20220021383
    Abstract: A method for operating a normally off or normally on power semiconductor element. A threshold voltage change in a threshold voltage of the power semiconductor element in relation to a reference threshold voltage is determined. A switch-on gate voltage is applied between a gate terminal and a source terminal of the power semiconductor element for the purpose of switching on the power semiconductor element is changed by the threshold voltage change in relation to a reference switch-on gate voltage corresponding to the reference threshold voltage.
    Type: Application
    Filed: December 19, 2019
    Publication date: January 20, 2022
    Applicant: Siemens Aktiengesellschaft
    Inventors: BENNO WEIS, FABIAN DIEPOLD
  • Publication number: 20200321883
    Abstract: A modular converter includes an inverter having power semiconductor switches made of GaN or InGaN and being operated with a blocking voltage of at least 400V and with a clock frequency of at least 40 kHz. A connection assembly distributes input and output signals and input and output AC voltages. A control assembly generates control signals for the inverter, a supply assembly with a rectifier converts the input alternating voltage into an intermediate circuit voltage, a rear wall assembly distributes the intermediate circuit voltage and the control signals for the inverter, and a load assembly converts the intermediate circuit voltage into the output alternating voltage for a load or for a secondary network. The connection assembly and the rear wall assembly are electrically connected to the other assemblies by way of releasable mechanical connections. A modular converter system that uses the modular inverter is also described.
    Type: Application
    Filed: September 13, 2018
    Publication date: October 8, 2020
    Applicant: Siemens Aktiengesellschaft
    Inventors: Johannes Fürst, FABIAN DIEPOLD