Patents by Inventor Fabian EVERS

Fabian EVERS has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20260054436
    Abstract: An injection molding tool for molding a molding element to an insert element that is insertable in the injection molding tool includes a first mold part with a first mold surface for delimiting a mold cavity and a second mold part with a second mold surface for delimiting the mold cavity. The first mold part and the second mold part form the mold cavity in the closed state of the injection molding tool. A first restriction element is arranged on the first mold surface for restricting a mold flow during an injection process of the molding element and/or a second restriction element is arranged on the second mold surface for restricting the mold flow during the injection process of the molding element.
    Type: Application
    Filed: September 12, 2025
    Publication date: February 26, 2026
    Inventors: Fabian Evers, Heinz-Peter Kleeschulte, Feng Li
  • Patent number: 12267944
    Abstract: The present invention relates to a support assembly for an electronic component, at least including a metallic heat sink, and a plastic element with a receiving section for accommodating the electronic component. The plastic element is connected to the heat sink in a form-fit manner. The receiving section of the plastic element covers a heat input side of the heat sink. The plastic element includes a thermosetting plastic with fillers for increasing the thermal conductivity.
    Type: Grant
    Filed: May 6, 2024
    Date of Patent: April 1, 2025
    Assignee: Hella GmbH & Co. KGaA
    Inventors: Sebastian Bartscher, Fabian Evers, Heinz-Peter Kleeschulte, Werner Koesters, Michael Lakenbrink, Konrad Schuerhoff, Thomas Wiese
  • Publication number: 20240373542
    Abstract: The present invention relates to a support assembly for an electronic component, at least including a metallic heat sink, and a plastic element with a receiving section for accommodating the electronic component. The plastic element is connected to the heat sink in a form-fit manner. The receiving section of the plastic element covers a heat input side of the heat sink. The plastic element includes a thermosetting plastic with fillers for increasing the thermal conductivity.
    Type: Application
    Filed: May 6, 2024
    Publication date: November 7, 2024
    Applicant: HELLA GmbH & Co. KGaA
    Inventors: Sebastian BARTSCHER, Fabian EVERS, Heinz-Peter KLEESCHULTE, Werner KOESTERS, Michael LAKENBRINK, Konrad SCHUERHOFF, Thomas WIESE