Abstract: An EUV multi-mirror arrangement comprises a multiplicity of mirror units arranged one next to the other in a grid arrangement on a carrier structure. Each mirror unit has a base element and, opposite the base element, an individually tiltable mirror element which has a mirror substrate that carries on a front face facing away from the base element a reflection coating for forming a mirror surface that reflects EUV radiation. Arranged between its base element and the mirror element, each mirror unit includes components of a suspension system for movably mounting the mirror element on the base element, actuators of an actuator system for producing movements of the mirror element in relation to the base element as a reaction to the reception of control signals, and sensors of a sensor system for capturing the position of the mirror elements. The actuator system has piezoelectric actuators. The sensor system has capacitive sensors.

Abstract: A multi-mirror array comprises a carrier structure and a multiplicity of mirror units arranged next to one another in a grid arrangement on the carrier structure. Each mirror unit comprises a base element and a mirror element. Each mirror element is mounted individually movably relative to the base element. Each mirror element has a mirror substrate, which, on a front surface facing away from the base element, bears a reflection coating, which can be designed for EUV radiation or for DUV radiation. The mirror surfaces are arranged next to one another to substantially fill the surface area. Between directly adjacent mirror elements there is a gap delimited by side surfaces of the adjoining mirror substrates to ensure a collision-free relative movement of the adjacent mirror elements.

Abstract: In a method of post-processing MEMS chips comprising MEMS structures arranged on a carrier material and having at least one projection region of projecting material protruding laterally beyond the region of the MEMS chip provided with MEMS structures, at least one projection region is removed by separating the projecting material from the carrier material of the MEMS chip. For handling MEMS chips without regions projecting beyond the MEMS structures arranged on a carrier material, for example after post-processing according to the disclosure has been carried out, at least one lateral depression is provided in the carrier material and the MEMS chips are handled by way of a tool engaging in the lateral depression(s).

Abstract: A method for producing a MEMS mirror array such as can be used, e.g. in photolithography, and a corresponding MEMS mirror array, can reduce issues possibly resulting from environmental influences.

Abstract: An EUV multi-mirror arrangement comprises a multiplicity of mirror units arranged one next to the other in a grid arrangement on a carrier structure. Each mirror unit has a base element and, opposite the base element, an individually tiltable mirror element which has a mirror substrate that carries on a front face facing away from the base element a reflection coating for forming a mirror surface that reflects EUV radiation. Arranged between its base element and the mirror element, each mirror unit includes components of a suspension system for movably mounting the mirror element on the base element, actuators of an actuator system for producing movements of the mirror element in relation to the base element as a reaction to the reception of control signals, and sensors of a sensor system for capturing the position of the mirror elements. The actuator system has piezoelectric actuators. The sensor system has capacitive sensors.

Abstract: An apparatus for stress-reduced mounting of MEMS-based micromirrors on a metallic support structure comprises a plate extending in a main plane of extent and a plurality of compensation elements which are connected to the plate and have connecting elements which extend across the main plane of extent and a plurality of base elements. A respective group with a plurality of connecting elements is connected to a common base element. The apparatus is produced using MEMS technology.

Abstract: An optical device, such as for a lithography system, comprises: at least one optical element having at least one optical surface; one or more actuators to tilt the optical surface of the optical element; and a measuring device to detect a tilt of the optical surface from an idle position. The measuring device has at least one waveguide which forms a closed measuring section. The waveguide is designed for coupling in and propagating one or more modes of a measuring beam. The waveguide is arranged such that a tilt of the optical surface influences the measuring beam propagating through the waveguide. The measuring device is designed to detect an influencing of the measuring beam caused by the tilt of the optical surface.

Abstract: A multi-mirror array comprises a carrier structure and a multiplicity of mirror units arranged next to one another in a grid arrangement on the carrier structure. Each mirror unit comprises a base element and a mirror element. Each mirror element is mounted individually movably relative to the base element. Each mirror element has a mirror substrate, which, on a front surface facing away from the base element, bears a reflection coating, which can be designed for EUV radiation or for DUV radiation. The mirror surfaces are arranged next to one another to substantially fill the surface area. Between directly adjacent mirror elements there is a gap delimited by side surfaces of the adjoining mirror substrates to ensure a collision-free relative movement of the adjacent mirror elements.

Abstract: A method for illuminating an object field of a projection exposure apparatus includes providing a subset of first facets to be positioned in park positions, which are each spaced apart from an associated target position, but at most by a maximum distance.

Abstract: A mirror device includes at least one electrically conductive shielding element, which forms a mechanism for producing an electric field in a region adjacent to at least one side surface and/or a rear side of a mirror body.

Abstract: A mirror array includes a multiplicity of displaceable individual mirrors which are subdivided into at least two groups. The individual mirrors of the first group are displaceable in a very precise manner, and the individual mirrors of the second group are displaceable in a very quick manner.

Abstract: An optical component includes at least one micro-opto-electro-mechanical system (MOEMS) with a front side and a rear side. The optical component also includes at least one printed circuit board arranged on the rear side of the at least one MOEMS. The at least one printed circuit board has lateral contacts. The at least one printed circuit board may be equipped with electronic parts and cooling elements. The at least one MOEMS projects laterally beyond the at least one printed circuit board.

Abstract: A mirror device includes at least one electrically conductive shielding element, which forms a mechanism for producing an electric field in a region adjacent to at least one side surface and/or a rear side of a mirror body.

Abstract: A mirror array includes a multiplicity of displaceable individual mirrors which are subdivided into at least two groups. The individual mirrors of the first group are displaceable in a very precise manner, and the individual mirrors of the second group are displaceable in a very quick manner.

Abstract: A method for illuminating an object field of a projection exposure apparatus includes providing a subset of first facets to be positioned in park positions, which are each spaced apart from an associated target position, but at most by a maximum distance.