Patents by Inventor Fabian KIMMIG

Fabian KIMMIG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11813061
    Abstract: The invention relates to an implantable electric multi-pole connection between an electric implant and an electric feed and discharge structure. The invention is characterised in that a flexible, film-like, electrically non-conductive, strip-shaped surface element is arranged between the implant and the feed and discharge structure. The surface element comprises at least one first surface, on which a number of electrodes n greater than of equal to two is arranged, which are respectively connected to the electric implant by means of electric connection conductors extending at least in parts inside the surface element. The electric feed and discharge structure comprises at least n lines which are electrically insulated from each other and which are electrically connected to one of the n electrodes.
    Type: Grant
    Filed: November 17, 2017
    Date of Patent: November 14, 2023
    Assignee: NEUROLOOP GMBH
    Inventors: Fabian Kimmig, Tim Boretius, Dennis Plachta
  • Patent number: 11815543
    Abstract: The invention is an assembly for checking the functionality of a measuring object, that is a DUT, in a medical implant or at least one part of the medical implant. The assembly comprises a test signal generator, a test module that is connected to the test signal generator. The assembly has a first receiving structure with at least one contact electrode, into which an adapter rigidly connects to the DUT in a releasable manner which is inserted to form least one electrical contact. A control and analysis unit is connected to the test signal generator and to the test module in a wired or wireless manner.
    Type: Grant
    Filed: October 1, 2020
    Date of Patent: November 14, 2023
    Assignee: NEUROLOOP GMBH
    Inventors: Fabian Kimmig, Tim Boretius, Daniel Kempter, Janosch Dobler, Christian Goslich
  • Publication number: 20230293894
    Abstract: Described is a medical handling set for connecting two implants, which are arranged spatially separated from each other, by means a flexible connecting line, along which a mechanical interface in the form of a plug-socket connection is provided. The handling set comprises a tube and a mandrin which is internally guided therein and provides a mandrin tip, which is fixedly attached to the distal mandrin region in a releasable manner by means of a first joint and in the joined state projects beyond the distal tube end, a first joining contour, which is part of a second joint, as well as an adapter element with a counter joining contour which is contoured counter to the first joint for forming the second joint, and with a second joining contour which is contoured counter to the plug or socket part of the mechanical interface and is part of a third joint.
    Type: Application
    Filed: June 9, 2021
    Publication date: September 21, 2023
    Inventors: Daniel KEMPTER, Fabian KIMMIG, Tim BORETIUS
  • Patent number: 11712558
    Abstract: The invention is a medical implant which is a wrap-around cuff comprising a flexible, biocompatible, film carrier substrate, that has a carrier substrate region which is wrapped around a wrap axis to form a tube. The invention has a protective structure directly or indirectly attached to the carrier substrate, which can be transformed from a first, open state into a second closed state that encloses the carrier substrate region that is wrapped to form a tube at least axially around a wrapping axis extending in the peripheral direction of the tube.
    Type: Grant
    Filed: August 5, 2019
    Date of Patent: August 1, 2023
    Assignee: NEUROLOOP GMBH
    Inventors: Dennis Plachta, Fabian Kimmig, Tim Boretius
  • Publication number: 20230211166
    Abstract: The invention is a head part of an implantable device, method of production thereof and a plug which can be fitted into the head part. The head part comprises a housing which has at least one blind hole plug contact socket with a socket opening as well as a socket base axially opposite the socket opening, along which at least one electrically conductive contact ring element and an electrically insulating, elastically deformable sealing ring, which are enclosed by a solidified casting compound, are joined together coaxially axially. Arranged within the head part is at least one second blind hole plug contact socket with a socket opening as a socket base axially opposite the socket opening, along which at least one electrically conductive contact ring element and an electrically insulating, elastically deformable sealing ring is located, which are enclosed by the solidified casting compound, are joined together in a coaxial arrangement and in an axially serial sequence.
    Type: Application
    Filed: May 4, 2021
    Publication date: July 6, 2023
    Inventors: Fabian KIMMIG, Tim BORETIUS
  • Patent number: 11691004
    Abstract: A device for the extravasal or extraneuronal fastening of a medical implant has a biocompatible surface substrate including a first substrate portion which is a compression sleeve and a free end portion. By winding the first substrate portion about a spatial axis, the axis is loosely radially covered in at least one layer by the wound first substrate portion. A second substrate portion, which is attached integrally to the first substrate portion which is not wound about the spatial axis, has a connection extending away from the medical implant.
    Type: Grant
    Filed: May 7, 2019
    Date of Patent: July 4, 2023
    Assignee: NEUROLOOP GMBH
    Inventors: Dennis Plachta, Tim Boretius, Fabian Kimmig, Christina Hassler
  • Publication number: 20230106271
    Abstract: The invention pertains to a head part of an implantable device, its method of production and a plug assembly which can be fitted into the head part. The head part comprises a head part housing which has at least one blind hole plug contact socket with a socket opening and a socket base axially opposite the socket opening, along which at least one electrically conductive contact ring element and an electrically insulating, elastically deformable seal ring is positioned and which are enclosed by a solidified casting compound, are joined together in a coaxial arrangement and in an axially serial sequence.
    Type: Application
    Filed: April 9, 2021
    Publication date: April 6, 2023
    Inventors: Fabian KIMMIG, Tim BORETIUS
  • Patent number: 11541230
    Abstract: The invention is an implantable electrical connection between an electrical implant which has at least one electrical conductor and at least one electrical feed line. The invention further relates to a method for producing an implantable electrical connection between an electrical implant. The invention comprises at least one electrical cable having a cable end, to which an electrically conductive flat piece is unsupportedly fined, and that the at least one implant-side electrical conductor is joined to the flat piece.
    Type: Grant
    Filed: May 28, 2018
    Date of Patent: January 3, 2023
    Assignee: NEUROLOOP GMBH
    Inventors: Dennis Plachta, Fabian Kimmig, Tim Boretius
  • Publication number: 20220341988
    Abstract: The invention is an assembly for checking the functionality of a measuring object, that is a DUT, in a medical implant or at least one part of the medical implant. The assembly comprises a test signal generator, a test module that is connected to the test signal generator. The assembly has a first receiving structure with at least one contact electrode, into which an adapter rigidly connects to the DUT in a releasable manner which is inserted to form least one electrical contact. A control and analysis unit is connected to the test signal generator and to the test module in a wired or wireless manner.
    Type: Application
    Filed: October 1, 2020
    Publication date: October 27, 2022
    Inventors: Fabian KIMMIG, Tim BORETIUS, Daniel KEMPTER, Janosch DOBLER, Christian GOSLICH
  • Patent number: 11478635
    Abstract: The invention has a contact assembly including a spatial longitudinal extension which is orientated parallel to the winding axis. The contact assembly is fixedly joined to the carrier substrate along a joining region which has a joining region length orientated in parallel to the winding axis. The orthogonal projection relative to the winding axis overlaps with a first region of the carrier substrate which is wound into a tube.
    Type: Grant
    Filed: February 26, 2019
    Date of Patent: October 25, 2022
    Assignee: NEUROLOOP GMBH
    Inventors: Tim Boretius, Dennis Plachta, Fabian Kimmig
  • Patent number: 11471690
    Abstract: A method for producing a head part of an implantable medical device is described, with a head part housing, which has a recess in the form of a blind hole, along which at least one electrically conducting contact ring element, together with an electrically insulating, elastically deformable sealing ring, are joined together in a force fit in a coaxial arrangement and an axial serial sequence under an axial joining force. The method is characterized in that the generation of the joining force between the at least one contact ring element and the sealing ring is executed along the assembly tool by use of means of attachment fitted on both sides of the at least one contact ring element and the sealing ring along the assembly tool, of which at least one means of attachment is axially movably and detachably fixed in an axially secure manner to the assembly tool.
    Type: Grant
    Filed: November 20, 2018
    Date of Patent: October 18, 2022
    Assignee: NEUROLOOP GMBH
    Inventors: Fabian Kimmig, Tim Boretius
  • Publication number: 20220212000
    Abstract: An implantable electrical contact arrangement comprising at least one electrode element entirely integrated into a carrier substrate of a biocompatible, electrically insulating material, and at least one freely accessible electrode surface enclosed by the biocompatible, electrically insulating carrier substrate. Within a sub-space which does not contain an electrode element, the carrier substrate surrounds at least one space containing at least one material with a modulus of elasticity differing from a modulus of elasticity of the material of the carrier substrate.
    Type: Application
    Filed: April 30, 2020
    Publication date: July 7, 2022
    Inventors: Fabian KIMMIG, Tim BORETIUS
  • Publication number: 20220143413
    Abstract: A method for the production of a medical implant, comprising a head section, which has at least one blind hole-type recess of an electrical plug-in contact socket, along which is arranged at least one electrically conductive contact element, together with a supply section, which is fixedly connected to the head section, and which comprises at least one electrical component, which is one of at least one microcontroller, and an electrical energy source, which are electrically connected to the at least one electrically conductive contact element by way of at least one electrical conductor structure.
    Type: Application
    Filed: March 2, 2020
    Publication date: May 12, 2022
    Inventors: Fabian KIMMIG, Tim BORETIUS, Florian ADAMI
  • Patent number: 11247042
    Abstract: An implantable electrical contact arrangement is described which has at least one electrode body arrangement composed otherwise entirely of biocompatible, electrically insulating material, with at least one freely accessible electrode surface enclosed directly or indirectly by the biocompatible electrically insulating material. The invention is characterized in that the electrode body arrangement has a stack-shaped layer composite which provides at least one gold layer connected to an iridium layer via a diffusion barrier layer. The stack-shaped layer composite by being completely encapsulated by an SiC layer, with the exception of at least one surface region of the iridium layer facing to be directed away from the layer composite. The SiC layer has an SiC layer surface which is facing to be directed away from the stack-shaped layer composite and which is adjoined directly or indirectly by the biocompatible, electrically insulating material.
    Type: Grant
    Filed: November 17, 2017
    Date of Patent: February 15, 2022
    Assignee: NEUROLOOP GMBH
    Inventors: Tim Boretius, Fabian Kimmig, Christina Sebastian Hassler, Dennis Plachta
  • Publication number: 20210316138
    Abstract: The invention is a medical implant which is a wrap-around cuff, comprising a flexible, biocompatible, film-like carrier substrate, that has a carrier substrate region which upon wrapping around a wrap axis forms a tube. The invention has a protective structure is directly or indirectly attached to the carrier substrate, which can be transformed from a first, open state into a second, closed state enclosing the carrier substrate region wrapped to form a tube at least axially around a wrap axis completely in the peripheral direction of the tube.
    Type: Application
    Filed: August 5, 2019
    Publication date: October 14, 2021
    Inventors: Dennis PLACHTA, Fabian KIMMIG, Tim BORETIUS
  • Publication number: 20210282660
    Abstract: A device is described for the transcutaneous location of an intracorporeally, subcutaneously located medical implant, which has an implant surface on which at least one electrical coil is arranged. The coil has at least one coil winding enclosing a region of the implant surface, together with an extracorporeally operable unit, to which at least one electrical coil is fitted, which is adapted in shape and size to the electrical coil arranged on the implant, and which is connected to an electrical control unit and to a signalling means, which generates a perceptible signal, at least in the case of maximum inductive coupling between the two electrical coils.
    Type: Application
    Filed: June 26, 2019
    Publication date: September 16, 2021
    Inventors: Dennis PLACHTA, Tim BORETIUS, Fabian KIMMIG
  • Publication number: 20210162208
    Abstract: A device for the extravasal or extraneuronal fastening of a medical implant has a biocompatible surface substrate having a first substrate portion which is a compression sleeve and has a free end portion which by winding the first substrate portion about a spatial axis which is loosely radially covered in at least one layer by the wound first substrate portion. A second substrate portion which is attached integrally to the first substrate portion which is not wound about the spatial axis and is with a connection extending away from the medical implant.
    Type: Application
    Filed: May 7, 2019
    Publication date: June 3, 2021
    Inventors: Dennis PLACHTA, Tim BORETIUS, Fabian KIMMIG, Christina HASSLER
  • Publication number: 20210100507
    Abstract: A device for the sensory detection of at least one human vital parameter comprises a support, which is shaped and dimensioned to be at least partly removably placed in the human outer ear canal, and to which at least one sensor for the detection of a vital parameter is attached. The support is a planar substrate, which is a hollow cylinder defining a continuously open hollow channel. A hollow cylindrical outer wall region at least partly contacts a surface of the inner wall of the ear canal when the support is at least partly placed in the human outer ear canal.
    Type: Application
    Filed: May 28, 2018
    Publication date: April 8, 2021
    Inventors: Fabian KIMMIG, Tim BORETIUS, Dennis PLACHTA
  • Publication number: 20210016081
    Abstract: The invention has a contact assembly including a spatial longitudinal extension which is orientated parallel to the winding axis. The contact assembly is fixedly joined to the carrier substrate along a joining region which has a joining region length orientated in parallel to the winding axis. The orthogonal projection relative to the winding axis overlaps with a first region of the carrier substrate which is wound into a tube.
    Type: Application
    Filed: February 26, 2019
    Publication date: January 21, 2021
    Inventors: Tim BORETIUS, Dennis Plachta, Fabian KIMMIG
  • Publication number: 20200360701
    Abstract: A method for producing a head part of an implantable medical device is described, with a head part housing, which has a recess in the form of a blind hole, along which at least one electrically conducting contact ring element, together with an electrically insulating, elastically deformable sealing ring, are joined together in a force fit in a coaxial arrangement and an axial serial sequence under an axial joining force. The method is characterized in that the generation of the joining force between the at least one contact ring element and the sealing ring is executed along the assembly tool by use of means of attachment fitted on both sides of the at least one contact ring element and the sealing ring along the assembly tool, of which at least one means of attachment is axially movably and detachably fixed in an axially secure manner to the assembly tool.
    Type: Application
    Filed: November 20, 2018
    Publication date: November 19, 2020
    Inventors: Fabian KIMMIG, Tim BORETIUS