Abstract: An integrated circuit package that includes a first die with a memory positioned physically at a predetermined memory location in the first die; a second die positioned in covering relationship with at least the predetermined memory location in the first die; penetration detection circuitry, positioned at least partially in said second die, that generates a penetration detection signal in response to physical penetration of the second die; and memory circuitry operatively associated with the memory in the first die and the penetration detection circuitry, which is adapted to perform an operation on the memory, such as data erasure, in response to the penetration detection signal.

Abstract: A method of making a wafer level chip size package (WCSP) comprising providing a die having a first face with a plurality of bond pads thereon, a second face opposite the first face and a plurality of side faces extending between the first face and the second face, at least one of the plurality of side faces having saw induced microcracks therein; and coating at least one of the plurality of side faces with a thin veneer of adhesive that penetrates the microcracks. A WCSP produced by the method is also disclosed.

Abstract: An integrated circuit (IC) device includes a substrate having a top surface including active circuitry including a plurality of I/O nodes, and a plurality of die pads coupled to the plurality of I/O nodes. A first dielectric layer including first dielectric vias is over the plurality of die pads. A redirect layer (RDL) including a plurality of RDL capture pads is coupled to the plurality of die pads over the first dielectric vias. A second dielectric layer including second dielectric vias is over the plurality of RDL capture pads. At least one of the second dielectric vias is a crack arrest via that has a via shape that includes an apex that faces away from a neutral stress point of the IC die and is oriented along a line from the neutral stress point to the crack arrest via to face in a range of ±30 degrees from the line. Under bump metallization (UBM) pads are coupled to the plurality of RDL capture pads over the second dielectric vias, and metal bonding connectors are on the UBM pads.

Abstract: The systems and methods provide or use a brace for patient's limb that includes, among other things, a non-inflatable, rigid, lower housing for supporting the sole of a patient's foot, and an inflatable load-bearing upper housing that is affixed to the lower housing. The brace may be adjustable and configured to be fitted to patients having limbs of differing sizes, to allow the patient to obtain a more closely fitted brace.

Abstract: An integrated circuit (IC) device includes a substrate having a top surface including active circuitry including a plurality of I/O nodes, and a plurality of die pads coupled to the plurality of I/O nodes. A first dielectric layer including first dielectric vias is over the plurality of die pads. A redirect layer (RDL) including a plurality of RDL capture pads is coupled to the plurality of die pads over the first dielectric vias. A second dielectric layer including second dielectric vias is over the plurality of RDL capture pads. At least one of the second dielectric vias is a crack arrest via that has a via shape that includes an apex that faces away from a neutral stress point of the IC die and is oriented along a line from the neutral stress point to the crack arrest via to face in a range of ±30 degrees from the line. Under bump metallization (UBM) pads are coupled to the plurality of RDL capture pads over the second dielectric vias, and metal bonding connectors are on the UBM pads.

Abstract: An integrated circuit package includes a die, a bump, an underbump metallization layer formed between the bump and the die, a portion of the underbump metallization layer under the bump having a first radius, and a redistribution layer formed between the underbump metallization layer and the die. The redistribution layer has a pad positioned under the underbump metallization layer. The pad has a second radius, and makes contact with the underbump metallization layer. The second radius is less than or equal to the first radius. The integrated circuit package also includes a first dielectric layer disposed between the die and the redistributing layer.

Abstract: The pneumatic Achilles sleeve assembly comprises a sleeve and at least one strap for fastening the sleeve around the ankle. The sleeve assembly positions an arch cell which contains a dynamic volume of air within the sleeve under a human foot. The arch cell is fabricated from a flexible material and is in communication with a conduit member. Upon application of external pressure to the arch cell, air is expelled from said air cell through said conduit member. The sleeve assembly also positions a tendon cell which contains a dynamic volume of air within the sleeve against the Achilles tendon. The tendon cell is in communication with the arch cell via the conduit member. The tendon cell is also fabricated from a flexible material. Upon the expelling of air from said arch cell, the air enters through the conduit member into the tendon cell which exerts a greater pressure against the Achilles tendon.

Abstract: An integrated circuit device includes a functional circuit die with a patterned rewiring layer defining a first rewiring pad and one or more second rewiring pads on opposite sides of a neutral point of the die. The device also includes at least one dielectric layer having bump opening features over the rewiring pads. The device further includes electrically conductive bump pad features formed on the dielectric layer over the bump opening features. The bump pad features make contact with the rewiring pads via the bump opening features. In the device, a center of the bump opening features are laterally offset from a center of the bump pad feature towards a neutral point of the die.

Abstract: A brace worn by a user has side shell portions disposed in or on the lateral and medial sides portions of the brace to support the medial and lateral sides of the user's ankle. The shell may include a connecting center portion that extends under the foot of the user and couples the medial and lateral side shell portions. In certain embodiments, the connecting portion includes a plurality of flexible fingers oriented substantially towards the user's toes for yielding to the movement of the user's foot while maintaining the stability and orientation of the lateral and medial supports with respect to the user's ankle.

Abstract: An integrated circuit package includes a die, a bump, an underbump metallization layer formed between the bump and the die, a portion of the underbump metallization layer under the bump having a first radius, and a redistribution layer formed between the underbump metallization layer and the die. The redistribution layer has a pad positioned under the underbump metallization layer. The pad has a second radius, and makes contact with the underbump metallization layer. The second radius is less than or equal to the first radius. The integrated circuit package also includes a first dielectric layer disposed between the die and the redistributing layer.

Abstract: The systems and methods described herein provide a soft, light-weight brace for a patient's limb that, among other things, provides prophylactic support to a patient while allowing the patient mobility. The brace may be adjustable and configured to be fitted to patients having limbs of differing sizes, to allow the patient to obtain a more closely fitted brace.

Abstract: A brace worn by a user has side shell portions disposed in or on the lateral and medial sides portions of the brace to support the medial and lateral sides of the user's ankle. The shell may include a connecting center portion that extends under the foot of the user and couples the medial and lateral side shell portions. In certain embodiments, the connecting portion includes a plurality of flexible fingers oriented substantially towards the user's toes for yielding to the movement of the user's foot while maintaining the stability and orientation of the lateral and medial supports with respect to the user's ankle.

Abstract: A pad for use with an orthopedic device comprises a sealed pre-inflated aircell disposed between a foam pad and the inner surface of a portion of the orthopedic device. The pads that may be employed with orthopedic devices such as braces and supports. In one embodiment, the pads may be removable and replaceable and fit within a brace, typically between the body part being braced and a support structure, such as a plastic shell support.

Abstract: The pneumatic Achilles sleeve assembly comprises a sleeve and at least one strap for fastening the sleeve around the ankle. The sleeve assembly positions an arch cell which contains a dynamic volume of air within the sleeve under a human foot. The arch cell is fabricated from a flexible material and is in communication with a conduit member. Upon application of external pressure to the arch cell, air is expelled from said air cell through said conduit member. The sleeve assembly also positions a tendon cell which contains a dynamic volume of air within the sleeve against the Achilles tendon. The tendon cell is in communication with the arch cell via the conduit member. The tendon cell is also fabricated from a flexible material. Upon the expelling of air from said arch cell, the air enters through the conduit member into the tendon cell which exerts a greater pressure against the Achilles tendon.

Abstract: The pneumatic Achilles sleeve assembly comprises a sleeve and at least one strap for fastening the sleeve around the ankle. The sleeve assembly positions an arch cell which contains a dynamic volume of air within the sleeve under a human foot. The arch cell is fabricated from a flexible material and is in communication with a conduit member. Upon application of external pressure to the arch cell, air is expelled from said air cell through said conduit member. The sleeve assembly also positions a tendon cell which contains a dynamic volume of air within the sleeve against the Achilles tendon. The tendon cell is in communication with the arch cell via the conduit member. The tendon cell is also fabricated from a flexible material. Upon the expelling of air from said arch cell, the air enters through the conduit member into the tendon cell which exerts a greater pressure against the Achilles tendon.

Abstract: The pneumatic Achilles sleeve assembly comprises a sleeve and at least one strap for fastening the sleeve around the ankle. The sleeve assembly positions an arch cell which contains a dynamic volume of air within the sleeve under a human foot. The arch cell is fabricated from a flexible material and is in communication with a conduit member. Upon application of external pressure to the arch cell, air is expelled from said air cell through said conduit member. The sleeve assembly also positions a tendon cell which contains a dynamic volume of air within the sleeve against the Achilles tendon. The tendon cell is in communication with the arch cell via the conduit member. The tendon cell is also fabricated from a flexible material. Upon the expelling of air from said arch cell, the air enters through the conduit member into the tendon cell which exerts a greater pressure against the Achilles tendon.

Abstract: A unitary boot-type ankle brace is provided having the capability of stabilizing an ankle against inversion and eversion without limiting normal plantarflexion and dorsiflexion of the ankle and while simultaneously providing focal compression of the anterior talofibular ligament. The brace is preferably constructed of a flexible material and includes a medial side portion dimensioned and configured to extend along a medial side of a user's leg and foot, and having a lateral side portion dimensioned and configured to extend along a lateral side of the leg and foot. The side portions are joined to a forwardly extending forefoot sleeve portion and to a base portion. In a primary aspect of the invention the side portions define a rear opening for insertion of the foot with a strap for selectively connecting the side portions adjacent the user's heel.