Patents by Inventor Fabian Reiher

Fabian Reiher has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device and method
    Patent number: 9825139
    Abstract: A semiconductor device includes a device region including a compound semiconductor material and a non-device region at least partially surrounding the device region. The semiconductor device further includes a dielectric material in the non-device region and at least one electrode in the device region. The semiconductor device further includes at least one pad electrically coupled to the at least one electrode, wherein the at least one pad is arranged on the dielectric material in the non-device region.
    Type: Grant
    Filed: January 10, 2017
    Date of Patent: November 21, 2017
    Assignee: Infineon Technologies Austria AG
    Inventors: Gilberto Curatola, Oliver Haeberlen, Simone Lavanga, Gianmauro Pozzovivo, Fabian Reiher
  • SEMICONDUCTOR DEVICE AND METHOD
    Publication number: 20170148883
    Abstract: A semiconductor device includes a device region including a compound semiconductor material and a non-device region at least partially surrounding the device region. The semiconductor device further includes a dielectric material in the non-device region and at least one electrode in the device region. The semiconductor device further includes at least one pad electrically coupled to the at least one electrode, wherein the at least one pad is arranged on the dielectric material in the non-device region.
    Type: Application
    Filed: January 10, 2017
    Publication date: May 25, 2017
    Inventors: Gilberto Curatola, Oliver Haeberlen, Simone Lavanga, Gianmauro Pozzovivo, Fabian Reiher
  • Semiconductor device and method
    Patent number: 9564524
    Abstract: A semiconductor device includes a device region including a compound semiconductor material and a non-device region at least partially surrounding the device region. The semiconductor device further includes a dielectric material in the non-device region and at least one electrode in the device region. The semiconductor device further includes at least one pad electrically coupled to the at least one electrode, wherein the at least one pad is arranged on the dielectric material in the non-device region.
    Type: Grant
    Filed: May 28, 2015
    Date of Patent: February 7, 2017
    Assignee: Infineon Technologies Austria AG
    Inventors: Gilberto Curatola, Oliver Haeberlen, Simone Lavanga, Gianmauro Pozzovivo, Fabian Reiher
  • SEMICONDUCTOR DEVICE AND METHOD
    Publication number: 20150349105
    Abstract: A semiconductor device includes a device region including a compound semiconductor material and a non-device region at least partially surrounding the device region. The semiconductor device further includes a dielectric material in the non-device region and at least one electrode in the device region. The semiconductor device further includes at least one pad electrically coupled to the at least one electrode, wherein the at least one pad is arranged on the dielectric material in the non-device region.
    Type: Application
    Filed: May 28, 2015
    Publication date: December 3, 2015
    Inventors: Gilberto Curatola, Oliver Haeberlen, Simone Lavanga, Gianmauro Pozzovivo, Fabian Reiher