Abstract: Various embodiments may relate to a semiconductor retrofit bulb, in particular a retrofit festoon bulb, having connecting elements that are arranged on two sides. The semiconductor retrofit bulb may include at least a tubular cooling body having at least one outer face support surface, wherein there is arranged on the support surface at least one semiconductor light source, in particular a light diode, a driver housing that is introduced into a hollow space of the tubular cooling body. At least one flow channel is provided between the driver housing and the cooling body.

Abstract: A semiconductor lamp includes a reflector having a lower side and an upper side, wherein the lower side widens laterally and wherein the lower side and the upper side are separated from one another by an upper rim, and having a first light source group having at least one semiconductor light source and a second light source group having at least one semiconductor light source, wherein the reflector is provided as a cooling body for the first light source group and for the second light source group; wherein at least a part of a light that can be emitted by the first light source group can be reflected by means of the lower side of the reflector at least into a spatial angle range that cannot be directly illuminated by the first light source group.

Abstract: A method for producing an LED lamp includes a lamp housing wherein at least one carrier circuit board equipped with LEDs is inserted into the lamp housing in such a way that at least a subregion of the lamp housing protrudes beyond the carrier circuit board with a projection, and the projection is at least partially deformed after insertion in such a way that the lamp housing is pressed with the carrier circuit board.

Abstract: An illumination device comprising at least one reflector and at least one light generating unit, wherein the at least one reflector is designed and arranged to reflect at least a portion of a light emitted by the at least one light generating unit into a spatial region that cannot be directly irradiated thereby, and the at least one light generating unit comprises at least one illuminating region having a substantially uniform emission characteristic in a circumferential direction of the illumination device.

Abstract: A lighting device may include a plurality of semiconductor light sources arranged on a substrate which is brought into contact thermally with a heat sink, wherein the substrate is formed from a multiplicity of substrate modules which are held by a carrier and which each carry at least one semiconductor light source and are brought into contact electrically with one another.

Abstract: A lighting device (1; 21; 41) having at least one heat sink (5; 44) for cooling at least one light source, wherein the at least one heat sink (5; 44) comprises one or more at least bent sheet metal parts.

Abstract: Various embodiments may relate to a semiconductor retrofit bulb, in particular a retrofit festoon bulb, having connecting elements that are arranged on two sides. The semiconductor retrofit bulb may include at least a tubular cooling body having at least one outer face support surface, wherein there is arranged on the support surface at least one semiconductor light source, in particular a light diode, a driver housing that is introduced into a hollow space of the tubular cooling body. At least one flow channel is provided between the driver housing and the cooling body.

Abstract: A cooling element for a lighting device having a plurality of cooling fins, wherein adjacent cooling fins delimit a cooling fin intermediate space with at least one air duct for connecting at least two cooling fin intermediate spaces.

Abstract: A lighting device may include a plurality of semiconductor light sources arranged on a substrate which is brought into contact thermally with a heat sink, wherein the substrate is formed from a multiplicity of substrate modules which are held by a carrier and which each carry at least one semiconductor light source and are brought into contact electrically with one another.

Abstract: A method for producing an LED lamp includes a lamp housing wherein at least one carrier circuit board equipped with LEDs is inserted into the lamp housing in such a way that at least a subregion of the lamp housing protrudes beyond the carrier circuit board with a projection, and the projection is at least partially deformed after insertion in such a way that the lamp housing is pressed with the carrier circuit board.

Abstract: An illumination device comprising at least one reflector and at least one light generating unit, wherein the at least one reflector is designed and arranged to reflect at least a portion of a light emitted by the at least one light generating unit into a spatial region that cannot be directly irradiated thereby, and the at least one light generating unit comprises at least one illuminating region having a substantially uniform emission characteristic in a circumferential direction of the illumination device.

Abstract: A semiconductor lamp includes a reflector having a lower side and an upper side, wherein the lower side widens laterally and wherein the lower side and the upper side are separated from one another by an upper rim, and having a first light source group having at least one semiconductor light source and a second light source group having at least one semiconductor light source, wherein the reflector is provided as a cooling body for the first light source group and for the second light source group; wherein at least a part of a light that can be emitted by the first light source group can be reflected by means of the lower side of the reflector at least into a spatial angle range that cannot be directly illuminated by the first light source group.

Abstract: A heat sink may be constructed from at least one sheet-metal part and may include at least one flow structure, wherein the flow structure is configured to guide cooling air along an inner side of the heat sink, and wherein the flow structure is configured to direct the cooling air at least partially along a longitudinal axis of the heat sink on the inner side of the heat sink.

Abstract: In various embodiments, an electronics housing for a lamp is provided, wherein an electronics printed circuit board is accommodated in an accommodating area surrounded by the electronics housing, and the electronics housing has an elongate channel, the channel connecting an outer side of the electronics housing to the accommodating area and extending substantially parallel to and offset with respect to the electronics printed circuit board.

Abstract: An illumination device may include a first heat sink; a carrier substrate, which is populated on its front side by at least one light source, and is attached by its rear side to the first heat sink; and a second heat sink, which is arranged essentially in front of the carrier substrate; wherein the at least one light source is arranged outside of the second heat sink.

Abstract: A lighting device may include at least one partially light-transmissive cover which covers at least one light source, so that a hollow chamber is provided between the at least one light source and the cover, and at least one heat sink structure, which is at least one of at least partially arranged in the hollow chamber and is set at least partially into the cover.

Abstract: A light-emitting device, including a heatsink arranged at a tip of the light-emitting device, at least one light source, in particular a light-emitting diode, arranged on an underside of the heatsink, and a reflector arranged below the heatsink for reflecting at least some of the light emitted by the at least one light source.

Abstract: In various embodiments, a lamp is provided. The lamp may include at least one light emitting diode; a housing, which comprises at least a first housing part and a second housing part, wherein the first housing part is arranged movably relative to the second housing part; a motion detection sensor for detecting a magnitude of a movement of the first housing part relative to the second housing part; and a radiation modification apparatus for modifying at least one parameter of the radiation emitted by the at least one light emitting diode, the radiation modification apparatus being coupled to the motion detection sensor, the radiation modification apparatus being designed to modify the radiation to be emitted by the at least one light emitting diode depending on the detected magnitude of the movement.

Abstract: A lighting device (1; 21; 41) having at least one heat sink (5; 44) for cooling at least one light source, wherein the at least one heat sink (5; 44) comprises one or more at least bent sheet metal parts.

Abstract: A luminaire is specified with a printed circuit board having at least one light emitting diode, the printed circuit board having a cutout for engaging with a holding element, the cutout positioning the printed circuit board in a fashion locked against rotation with the holding element.