Patents by Inventor Fabien Letourneau

Fabien Letourneau has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11933346
    Abstract: A screw assembly, including: a removable shoulder screw including: a first screw shaft portion; a second screw shaft portion; a first threaded portion; and a first shaft edge between the first screw shaft portion and the second screw shaft portion, wherein the second screw shaft portion is between the first screw shaft portion and the first threaded portion, and wherein a diameter of the second screw shaft portion is smaller than the diameter of the first screw shaft portion; and a first removable shoulder including a first removable shoulder opening and a first removable shoulder edge, wherein the first removable shoulder opening has a diameter less than the diameter of the first screw shaft portion and is configured to engage the second screw shaft portion, and wherein the first removable shoulder edge is configured to engage the first shaft edge.
    Type: Grant
    Filed: May 12, 2023
    Date of Patent: March 19, 2024
    Assignee: NOKIA SOLUTIONS AND NETWORKS OY
    Inventor: Fabien Letourneau
  • Publication number: 20160223004
    Abstract: The unit locking system includes a first fastening member having a proximal end having a first head portion and a distal end connected to a first surface and a second fastening member having a proximal end having a second head portion and a distal end connected to a second surface. The unit locking system further includes a unit having an aperture including an insertable first end portion and a slot portion having a second end portion. The insertable portion of the aperture is configured to receive the first head portion of the first fastening member and the second head portion of the second fastening member. The unit is locked to the mounting surface when the first head portion and second head portion are inserted into the aperture such that first fastening member engages the first end portion and the second fastening member is moved into engagement with the second end portion.
    Type: Application
    Filed: January 30, 2015
    Publication date: August 4, 2016
    Inventor: Fabien Letourneau
  • Publication number: 20130259601
    Abstract: A low profile standoff with tool stop is disclosed for attaching surfaces in fixed proximity to each other. The low profile standoff with tool stop includes a main body having a threaded bore, a threaded stem for threading a nut, and an intermediate section of narrower cross section than the main body that admits a portion of the threaded bore. The intermediate section extends within the thickness of the mounting surface while the main body stays on one side and the threaded stem extends wholly through to the opposite side of the surface. Some embodiments further comprise a tool stop on the exterior of the main body. Other embodiments dispense with the threaded stem. The low profile standoff with tool stop is particularly useful for overcoming the strength disadvantages of reduced height standoffs known in the art, and of minimizing tool head damage to the mounting surface.
    Type: Application
    Filed: March 30, 2012
    Publication date: October 3, 2013
    Applicant: Alcatel-Lucent Canada, Inc.
    Inventor: Fabien Létourneau
  • Patent number: 8534892
    Abstract: Various exemplary embodiments relate to a light transmission device for transmitting light from at least one light source to an illuminated surface. The device may include at least one light entrance surface that allows entrance of light from the at least one light source; a light emitting surface with an area greater than the total area of the at least one light entrance surface; at least one light pipe portion extending from the at least one light entrance surface toward the illuminated surface wherein the light pipe portion internally reflects the light toward the illuminated surface; and a flared diffusion portion between the at least one light pipe portion and the light emitting surface wherein the diffusion portion internally reflects the light towards the light emitting surface. The device may be a solid piece of plastic. The light pipe portions may be curved to bend light toward the illuminated surface.
    Type: Grant
    Filed: July 30, 2010
    Date of Patent: September 17, 2013
    Assignee: Alcatel Lucent
    Inventors: Fabien Letourneau, Bevin G. Schmidt
  • Publication number: 20120026750
    Abstract: Various exemplary embodiments relate to a light transmission device for transmitting light from at least one light source to an illuminated surface. The device may include at least one light entrance surface that allows entrance of light from the at least one light source; a light emitting surface with an area greater than the total area of the at least one light entrance surface; at least one light pipe portion extending from the at least one light entrance surface toward the illuminated surface wherein the light pipe portion internally reflects the light toward the illuminated surface; and a flared diffusion portion between the at least one light pipe portion and the light emitting surface wherein the diffusion portion internally reflects the light towards the light emitting surface. The device may be a solid piece of plastic. The light pipe portions may be curved to bend light toward the illuminated surface.
    Type: Application
    Filed: July 30, 2010
    Publication date: February 2, 2012
    Applicant: ALCATE-LUCENT CANADA, INC.
    Inventors: Fabien Letourneau, Bevin G. Schmidt
  • Patent number: 7940525
    Abstract: An air-cooled electronic device includes a device housing having a bottom surface, and a motorized fan having a fan housing having a mounting hole, and having a hook projection secured to the bottom surface, the hook projection shaped and dimensioned to engage the mounting hole, and having an abutment, with the abutment, the hook and the mounting hole being arranged to secure the fan housing in a position without screws, rivets, or other hardware.
    Type: Grant
    Filed: November 6, 2008
    Date of Patent: May 10, 2011
    Assignee: Alcatel Lucent
    Inventor: Fabien Létourneau
  • Patent number: 7797823
    Abstract: Apparatus and method for providing high density component assemblies, such as electromechanical or electro-optical assemblies.
    Type: Grant
    Filed: December 31, 2007
    Date of Patent: September 21, 2010
    Assignee: Alcatel Lucent
    Inventors: Fabien Létourneau, Stefano DeCecco, Peter Serjak
  • Publication number: 20100107397
    Abstract: An air-cooled electronic device includes a device housing having a bottom surface, and a motorized fan having a fan housing having a mounting hole, and having a hook projection secured to the bottom surface, the hook projection shaped and dimensioned to engage the mounting hole, and having an abutment, with the abutment, the hook and the mounting hole being arranged to secure the fan housing in a position without screws, rivets, or other hardware.
    Type: Application
    Filed: November 6, 2008
    Publication date: May 6, 2010
    Applicant: Alcatel-Lucent
    Inventor: Fabien Letourneau
  • Patent number: 7663888
    Abstract: A printed circuit board card comprising: a printed circuit board having a first thickness and having first and second edges for inserting into respective channels of card guides, the channels of the card guides for receiving printed circuit boards having a second thickness, the second thickness being greater than the first thickness; and, first and second thickness adaptors each having a third thickness applied at the first and second edges, respectively, a sum of the first and third thicknesses approximating the second thickness, to thereby align the printed circuit board in the channels of the card guides.
    Type: Grant
    Filed: July 17, 2006
    Date of Patent: February 16, 2010
    Assignee: Alcatel Lucent
    Inventors: Simon Paul Creasy, Paul James Brown, Fabien Letourneau
  • Publication number: 20090168348
    Abstract: Apparatus and method for providing high density component assemblies, such as electromechanical or electro-optical assemblies.
    Type: Application
    Filed: December 31, 2007
    Publication date: July 2, 2009
    Inventors: Fabien Letourneau, Stefano DeCecco, Peter Serjak
  • Publication number: 20090097212
    Abstract: A high connector density printed circuit board, and high connector density device containing the same, including one or more of the following: a face plate; a plurality of connector ports in the face plate; a tab integral with the face plate label and bent to extend away from the face plate; information printed on the tab; the tab forming a plane at an angle of ninety degrees with respect to the face plate; the tab fabricated from a material having a combination of a thickness and a stiffness minimally able to resist a deformation resulting from a force of gravity; a second tab that is integral with the face plate and bent to extend away from the face plate; and the tabs do not infringe on an adjacent space occupied by another high connector density printed circuit board.
    Type: Application
    Filed: October 15, 2007
    Publication date: April 16, 2009
    Inventors: Bevin Schmidt, Fabien Letourneau
  • Publication number: 20080013290
    Abstract: A printed circuit board card comprising: a printed circuit board having a first thickness and having first and second edges for inserting into respective channels of card guides, the channels of the card guides for receiving printed circuit boards having a second thickness, the second thickness being greater than the first thickness; and, first and second thickness adaptors each having a third thickness applied at the first and second edges, respectively, a sum of the first and third thicknesses approximating the second thickness, to thereby align the printed circuit board in the channels of the card guides.
    Type: Application
    Filed: July 17, 2006
    Publication date: January 17, 2008
    Inventors: Simon Paul Creasy, Paul James Brown, Fabien Letourneau
  • Publication number: 20070264921
    Abstract: A ventilated housing for accommodating one or more components comprises opposed first and second-spaced apart end portions. An air barrier extends at least partially between the first and second end portions for limiting movement of air inside the housing and defining an upper or lower surface of the housing. A first part of the air barrier proximate the first end portion is positioned at a level below the level of a second part of the air barrier proximate the second end portion. An inlet is defined for admitting air into the housing and an outlet is defined for discharging air from the housing. An ventilated housing assembly comprises first and second housings with an angled space between a lower air barrier of the first housing and an upper air barrier of the second housing.
    Type: Application
    Filed: May 10, 2006
    Publication date: November 15, 2007
    Inventors: Fabien Letourneau, Bevin Schmidt, Nicholas Bundza
  • Patent number: 7057904
    Abstract: An assembly of releasably interconnected circuit substrates is provided. The assembly has a first and second circuit substrate. Each substrate provides an electrical connector for mating electrical engagement of the first and second substrates. The assembly also has a two-position lock that is operable between a first and second position. In the first position of the lock, the first and second circuit substrates are in locked interconnection with each other. In the second position of the lock, the first and second circuit substrates are separable from each other.
    Type: Grant
    Filed: July 22, 2004
    Date of Patent: June 6, 2006
    Assignee: Alcatel
    Inventors: Nicholas Bundza, Fabien Letourneau, Gregory William Cheshire
  • Publication number: 20050265010
    Abstract: An assembly of releasably interconnected circuit substrates is provided. The assembly has a first and second circuit substrate. Each substrate provides an electrical connector for mating electrical engagement of the first and second substrates. The assembly also has a two-position lock that is operable between a first and second position. In the first position of the lock, the first and second circuit substrates are in locked interconnection with each other. In the second position of the lock, the first and second circuit substrates are separable from each other.
    Type: Application
    Filed: July 22, 2004
    Publication date: December 1, 2005
    Applicant: Alcatel
    Inventors: Nicholas Bundza, Fabien Letourneau, Gregory Cheshire
  • Patent number: 6757470
    Abstract: A faceplate having at least one opening with a cover. The cover may be removed after initial use of a circuit board to be replaced with a connector unit through which conductors may extend to the circuit board to allow for its modification in operation. This enables the same faceplate to be used for modification purposes and without the expense entailed with a faceplate of different design. The cover may be such as to completely cover the whole of the opening. Alternatively, the cover may be provided by a connector unit which enables interconnection of conductors through the faceplate in one part of the unit while providing, in another part of the unit, the cover for part of the opening. This connector unit may then be replaced in the modification by another connector unit which enables connectors to extend and be connected through the whole of the opening. Conveniently, a latching arrangement is provided for assembly and disassembly purposes for both the cover and connector unit with frontal access.
    Type: Grant
    Filed: December 12, 2001
    Date of Patent: June 29, 2004
    Assignee: Alcatel Canada Inc.
    Inventors: Fabien Létourneau, Christopher J. Kavanagh
  • Publication number: 20030108320
    Abstract: A faceplate having at least one opening with a cover. The cover may be removed after initial use of a circuit board to be replaced with a connector unit through which conductors may extend to the circuit board to allow for its modification in operation. This enables the same faceplate to be used for modification purposes and without the expense entailed with a faceplate of different design. The cover may be such as to completely cover the whole of the opening. Alternatively, the cover may be provided by a connector unit which enables interconnection of conductors through the faceplate in one part of the unit while providing, in another part of the unit, the cover for part of the opening. This connector unit may then be replaced in the modification by another connector unit which enables connectors to extend and be connected through the whole of the opening. Conveniently, a latching arrangement is provided for assembly and disassembly purposes for both the cover and connector unit with frontal access.
    Type: Application
    Filed: December 12, 2001
    Publication date: June 12, 2003
    Inventors: Fabien Letourneau, Christopher J. Kavanagh
  • Patent number: 6462951
    Abstract: A clip for holding a heat sink in heat conductive engagement with an integrated circuit mounted upon a substrate. The clip has a resilient beam for extending across the heat sink and two arms to extend down opposite edges of the heat sink and the substrate. The arms have free end extensions. When assembled, the heat sink and substrate sandwich between them the integrated circuit and a compression spring forming part of the clip, compresses the heat sink, integrated circuit and substrate together between the spring and the free end extensions. The compression spring is compressed in turn between the heat sink and the beam which is resiliently flexed away from the heat sink. The clip is devoid of screwthreaded attachments together with their disadvantages and the spring is the sole means of holding the assembly together. The beam of the clip may be spaced from a base of the heat sink so as not to extend across cooling air passages between heat transfer projections of the heat sink.
    Type: Grant
    Filed: May 18, 2001
    Date of Patent: October 8, 2002
    Assignee: Alcatal Canada Inc.
    Inventor: Fabien Letourneau
  • Publication number: 20010028552
    Abstract: A clip for holding a heat sink in heat conductive engagement with an integrated circuit mounted upon a substrate. The clip has a resilient beam for extending across the heat sink and two arms to extend down opposite edges of the heat sink and the substrate. The arms have free end extensions. When assembled, the heat sink and substrate sandwich between them the integrated circuit and a compression spring forming part of the clip, compresses the heat sink, integrated circuit and substrate together between the spring and the free end extensions. The compression spring is compressed in turn between the heat sink and the beam which is resiliently flexed away from the heat sink. The clip is devoid of screwthreaded attachments together with their disadvantages and the spring is the sole means of holding the assembly together. The beam of the clip may be spaced from a base of the heat sink so as not to extend across cooling air passages between heat transfer projections of the heat sink.
    Type: Application
    Filed: May 18, 2001
    Publication date: October 11, 2001
    Inventor: Fabien Letourneau