Patents by Inventor Fabien Thion

Fabien Thion has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for fabricating a semiconductor device comprising a paste layer and semiconductor device
    Patent number: 11329021
    Abstract: A semiconductor device and method for fabricating a semiconductor device, comprising a paste layer is disclosed. In one example the method comprises attaching a substrate to a carrier, wherein the substrate comprises a plurality of semiconductor dies. A layer of a paste is applied to the substrate. The layer above cutting regions of the substrate is structured. The substrate is cut along the cutting regions.
    Type: Grant
    Filed: November 15, 2019
    Date of Patent: May 10, 2022
    Assignee: Infineon Technologies AG
    Inventors: Francisco Javier Santos Rodriguez, Fabian Craes, Barbara Eichinger, Martin Mischitz, Frederik Otto, Fabien Thion
  • METHOD FOR FABRICATING A SEMICONDUCTOR DEVICE COMPRISING A PASTE LAYER AND SEMICONDUCTOR DEVICE
    Publication number: 20200161269
    Abstract: A semiconductor device and method for fabricating a semiconductor device, comprising a paste layer is disclosed. In one example the method comprises attaching a substrate to a carrier, wherein the substrate comprises a plurality of semiconductor dies. A layer of a paste is applied to the substrate. The layer above cutting regions of the substrate is structured. The substrate is cut along the cutting regions.
    Type: Application
    Filed: November 15, 2019
    Publication date: May 21, 2020
    Applicant: Infineon Technologies AG
    Inventors: Francisco Javier Santos Rodriguez, Fabian Craes, Barbara Eichinger, Martin Mischitz, Frederik Otto, Fabien Thion