Abstract: This layered element (11) for encapsulating an element (12) that is sensitive to air and/or moisture, especially an element that collects or emits radiation such as a photovoltaic cell or an organic light-emitting diode, comprises a polymer layer (1) and a barrier layer (2) against at least one face (1A) of the polymer layer. The barrier layer (2) has a moisture vapor transfer rate of less than 10?2 g/m2 per day and consists of a multilayer of at least two thin hydrogenated silicon nitride layers (21, 22, 23, 24) having alternately lower and higher densities.

Abstract: This layered element (11) for encapsulating an element (12) that is sensitive to air and/or moisture, especially an element that collects or emits radiation such as a photovoltaic cell or an organic light-emitting diode, comprises a polymer layer (1) and a barrier layer (2) against at least one face (1A) of the polymer layer. The barrier layer (2) has a moisture vapor transfer rate of less than 10?2 g/m2 per day and consists of a multilayer of at least two thin hydrogenated silicon nitride layers (21, 22, 23, 24) having alternately lower and higher densities.

Abstract: A process of forming a member for a structure can include depositing a solar control layer over a first substrate, wherein depositing is performed using a plasma-assisted technique. The process can also include coupling the solar control layer and the first substrate to a second substrate. The process can further include removing the first substrate from the solar control layer while at least a portion of the solar control layer remains coupled to the second substrate. In an embodiment, second substrate can include a substrate for a structural member. Due to the composition or size of the substrate, the process described herein can be used to deposit a solar control layer that is initially deposited on a different substrate and is subsequently transferred to the substrate of the structural member.