Abstract: Systems and methods described herein relate to an adapter driver board for parallel operation of power modules. The systems and methods receive an electrical signal at an input interface of a high voltage adapter board. The systems and methods may deliver the electrical signals to first and second switches along corresponding first and second conductive traces. The first conductive trace extends along the high voltage adapter board and is conductively coupled to the input interface and the first switch. The second conductive trace extends along the high voltage adapter board and is conductively coupled to the input interface and the second switch. The first and second conductive traces may have an inductance or other property that is substantially the same as each other.

Abstract: The disclosure relates to a power module including a semiconductor power circuit, a conductor and a first core part being arranged besides the conductor such that it can form a core together with a second core part. The disclosure further relates to methods for manufacturing such a power module.

Abstract: An apparatus is disclosed to include: a conductor structure (such as a busbar) comprising a first electrical connection and a second electrical connection; a first capacitor pair including a first capacitor and a second capacitor mounted directly opposite each other on opposite sides of the conductor structure, wherein the first and second capacitors each have a first electrical connector and a second electrical connector having a first electrical capacitance therebetween, and wherein the first and second capacitors each have a first side and a second side opposite the first side; a first connection arrangement connecting the first electrical connector of the first capacitor and the first electrical connector of the second capacitor to the first electrical connection of the conductor structure; and a second connection arrangement connecting the second electrical connector of the first capacitor and the second electrical connector of the second capacitor to the second electrical connection of the conductor str

Abstract: A panel system may include a core body having opposite sides and switching devices mounted to at least one of the opposite sides of the core body, a housing in which the core body and the switching devices are disposed, gate drivers coupled to a first side of the housing and to the switching devices, and connectors coupled to one or more other sides of the housing and to the switching devices. The connectors may receive and conduct a voltage to collector terminals of the switching devices. The gate drivers may conduct a gate voltage to gate terminals of the switching devices. The switching devices may control conduction of the voltage out of the housing via the connectors as an alternating current.

Abstract: An apparatus is disclosed to include: a conductor structure (such as a busbar) comprising a first electrical connection and a second electrical connection; a first capacitor pair including a first capacitor and a second capacitor mounted directly opposite each other on opposite sides of the conductor structure, wherein the first and second capacitors each have a first electrical connector and a second electrical connector having a first electrical capacitance therebetween, and wherein the first and second capacitors each have a first side and a second side opposite the first side; a first connection arrangement connecting the first electrical connector of the first capacitor and the first electrical connector of the second capacitor to the first electrical connection of the conductor structure; and a second connection arrangement connecting the second electrical connector of the first capacitor and the second electrical connector of the second capacitor to the second electrical connection of the conductor str

Abstract: Systems and methods described herein relate to an adapter driver board for parallel operation of power modules. The systems and methods receive an electrical signal at an input interface of a high voltage adapter board. The systems and methods may deliver the electrical signals to first and second switches along corresponding first and second conductive traces. The first conductive trace extends along the high voltage adapter board and is conductively coupled to the input interface and the first switch. The second conductive trace extends along the high voltage adapter board and is conductively coupled to the input interface and the second switch. The first and second conductive traces may have an inductance or other property that is substantially the same as each other.

Abstract: A phase module assembly includes a first flat laminated busbar elongated along a first direction, including a positive layer, a negative layer, and a load layer that is configured to be conductively coupled with a load. The first flat laminated busbar is conductively coupled to a second flat laminated busbar extending in a plane that is orthogonal to the first direction. The second flat laminated busbar is conductively coupled with a power source of direct current. The phase module assembly also includes one or more switches conductively coupled with internal terminal connectors of the first flat laminated busbar and configured to convert the direct current into one phase of a multi-phase alternating current, and to output the phase to the load. The phase module assembly also includes one or more capacitors mechanically mounted on and conductively coupled with the second flat laminated busbar.

Abstract: A vehicle electrical power system includes a phase module assembly of a multi-phase inverter. The phase module assembly includes first and second flat laminated busbars extending in orthogonal planes. The phase module assembly also includes one or more transistors that convert direct current into one phase of a multi-phase alternating current of the multi-phase inverter, and to output the phase of the multi-phase alternating current to the load. The phase module assembly also includes one or more capacitors conductively coupled with the internal positive and negative terminal connectors and with the external positive and negative bushings configured to be conductively coupled with the power source of direct current. The assembly can be useful for vehicles because the components of the system are configured to carry large amounts of current in a more reliable and sustainable manner.

Abstract: A vehicle electrical power system includes a phase module assembly of a multi-phase inverter. The phase module assembly includes first and second flat laminated busbars extending in orthogonal planes. The phase module assembly also includes one or more transistors that convert direct current into one phase of a multi-phase alternating current of the multi-phase inverter, and to output the phase of the multi-phase alternating current to the load. The phase module assembly also includes one or more capacitors conductively coupled with the internal positive and negative terminal connectors and with the external positive and negative bushings configured to be conductively coupled with the power source of direct current. The assembly can be useful for vehicles because the components of the system are configured to carry large amounts of current in a more reliable and sustainable manner.

Abstract: A vehicle electrical power system includes a phase module assembly of a multi-phase inverter. The phase module assembly includes first and second flat laminated busbars extending in orthogonal planes. The phase module assembly also includes one or more transistors that convert direct current into one phase of a multi-phase alternating current of the multi-phase inverter, and to output the phase of the multi-phase alternating current to the load. The phase module assembly also includes one or more capacitors conductively coupled with the internal positive and negative terminal connectors and with the external positive and negative bushings configured to be conductively coupled with the power source of direct current. The assembly can be useful for vehicles because the components of the system are configured to carry large amounts of current in a more reliable and sustainable manner.

Abstract: A phase module assembly includes a first flat laminated busbar elongated along a first direction, including a positive layer, a negative layer, and a load layer that is configured to be conductively coupled with a load. The first flat laminated busbar is conductively coupled to a second flat laminated busbar extending in a plane that is orthogonal to the first direction. The second flat laminated busbar is conductively coupled with a power source of direct current. The phase module assembly also includes one or more switches conductively coupled with internal terminal connectors of the first flat laminated busbar and configured to convert the direct current into one phase of a multi-phase alternating current, and to output the phase to the load. The phase module assembly also includes one or more capacitors mechanically mounted on and conductively coupled with the second flat laminated busbar.

Abstract: A gate network of a silicon-carbide (SiC) power conversion device includes a plurality of gate electrodes of SiC metal-oxide-semiconductor-based (MOS-based) transistor device cells disposed in an active area of the SiC power conversion device, and a gate pad disposed in a gate pad and bus area of the SiC power conversion device. The gate network also includes a gate bus disposed in the gate pad and bus area of the SiC power conversion device, wherein the gate bus extends between and electrically connects the gate pad to at least a portion of the plurality of gate electrodes in the active area of the SiC power conversion device. At least a portion of the gate pad, the gate bus, the plurality of gate electrodes, or a combination thereof, of the gate network have a positive temperature coefficient of resistance greater than approximately 2000 parts-per-million per degree Celsius (ppm/° C.).

Abstract: A gate network of a silicon-carbide (SiC) power conversion device includes a plurality of gate electrodes of SiC metal-oxide-semiconductor-based (MOS-based) transistor device cells disposed in an active area of the SiC power conversion device, and a gate pad disposed in a gate pad and bus area of the SiC power conversion device. The gate network also includes a gate bus disposed in the gate pad and bus area of the SiC power conversion device, wherein the gate bus extends between and electrically connects the gate pad to at least a portion of the plurality of gate electrodes in the active area of the SiC power conversion device. At least a portion of the gate pad, the gate bus, the plurality of gate electrodes, or a combination thereof, of the gate network have a positive temperature coefficient of resistance greater than approximately 2000 parts-per-million per degree Celsius (ppm/° C.).

Abstract: The application discloses the control of switches, such as metal-oxide semiconductor field effect transistors (MOSFETs) devices, during surge events. The switch controllers and methods for operation thereof discuss methods for providing driving signals to the switch for adjusting the mode of operation based on the voltage and/or current thresholds as sensed by the system and/or by the switch controller.

Abstract: A power electronic device includes at least one inductor configured to couple to a first capacitor and a second capacitor. The power electronic device includes a controller configured to control a first current conducting through the inductor and a second current conducting through the inductor. The first and second currents conduct in opposite directions with respect to each other, and the first and second currents interact with each other through the inductor such that a net direct current (DC) component through the inductor is approximately zero.

Abstract: The systems and methods described herein relate to an adapter driver board for parallel operation of power modules. The systems and methods receive an electrical signal at an input interface of a high voltage adapter board. The systems and methods further deliver the electrical signals to first and second switches along corresponding first and second conductive traces. The first conductive trace extends along the high voltage adapter board and is conductively coupled to the input interface and the first switch. The second conductive trace extending along the high voltage adapter board and is conductively coupled to the input interface and the second switch. The first and second conductive traces are each configured to have an inductance substantially the same. The systems and methods synchronously activate the first and second switches based on the electrical signal.

Abstract: A power electronic device includes at least one inductor configured to couple to a first capacitor and a second capacitor. The power electronic device includes a controller configured to control a first current conducting through the inductor and a second current conducting through the inductor. The first and second currents conduct in opposite directions with respect to each other, and the first and second currents interact with each other through the inductor such that a net direct current (DC) component through the inductor is approximately zero.

Abstract: A sub-sea power supply includes a plurality of transformers, a wet-mateable connector, and a plurality of passive rectifier circuits. Each transformer includes a primary coil and secondary coil. The primary coils are coupled in parallel. The wet-mateable connector is coupleable to a sub-sea AC power source. The wet-mateable connector is coupled to the primary coils. The plurality of passive rectifier circuits is respectively coupled to the secondary coils. The plurality of passive rectifier circuits is configured to generate substantially uniform polarity voltage outputs coupled in series.

Abstract: A sub-sea power supply includes a plurality of transformers, a wet-mateable connector, and a plurality of passive rectifier circuits. Each transformer includes a primary coil and secondary coil. The primary coils are coupled in parallel. The wet-mateable connector is coupleable to a sub-sea AC power source. The wet-mateable connector is coupled to the primary coils. The plurality of passive rectifier circuits is respectively coupled to the secondary coils. The plurality of passive rectifier circuits is configured to generate substantially uniform polarity voltage outputs coupled in series.