Abstract: A method for metalizing at least one blind via formed in at least one substrate, including: a) arranging at least one solid portion of electrically conductive material in the blind via, b) performing a thermal treatment of the solid portion of electrically conductive material, making it melt in the blind via, cooling the electrically conductive material, solidifying it in the blind via, and wherein, before carrying out step a), at least part of the walls of the blind via is covered with a material able to prevent wetting of said part of the walls of the blind via by the melted electrically conductive material obtained during the performance of step b), the solidified electrically conductive material obtained after carrying out step c) being able not to be secured to said non-wetting part of the walls of the blind via.

Abstract: A method for encapsulating a microcomponent positioned on a substrate, including: a) production of an electrical contact pad on the substrate; b) production of a portion of sacrificial material covering the microcomponent and the electrical contact pad; c) production of an encapsulation layer covering the sacrificial material and a first face of the substrate; d) production, through the substrate, of a hole aligned with the electrical contact pad and emerging at the portion of sacrificial material; e) elimination of the portion of sacrificial material through the hole; f) production, in the hole, of a conductive portion electrically connected to the electrical contact pad, forming a conductive via.

Abstract: A method for producing a sealed cavity, including: a) producing a sacrificial layer on a substrate; b) producing a cover layer covering at least the sacrificial layer and a portion of the face of the substrate not covered by the sacrificial layer, the cover layer including lateral flanks forming, with the substrate, an angle of less than 90°; c) producing a hole through one of the lateral flanks of the cover layer such that a maximum distance between the substrate and an edge of the hole is less than approximately 3 ?m, the hole crossing a portion of the cover layer deposited on a portion of the substrate not covered by the sacrificial layer; d) eliminating the sacrificial layer through the hole, forming the cavity; and e) depositing at least one material plugging the hole in a sealed fashion.

Abstract: An interconnect device is disclosed including a support in which at least one hole is formed, the hole having walls forming a closed contour and being formed by a cavity and one or several slots communicating with the cavity. The slots extend in a direction making a non-zero angle with the main plane of the support. Several conducting elements are positioned on at least one wall of the hole and pass through the hole. The conducting elements are each intended to connect conducting areas to each other that are situated on either side of the support. At least one of the slots separates two of the conducting elements from each other.

Abstract: A method for encapsulating a microcomponent positioned on a substrate, including: a) production of an electrical contact pad on the substrate; b) production of a portion of sacrificial material covering the microcomponent and the electrical contact pad; c) production of an encapsulation layer covering the sacrificial material and a first face of the substrate; d) production, through the substrate, of a hole aligned with the electrical contact pad and emerging at the portion of sacrificial material; e) elimination of the portion of sacrificial material through the hole; f) production, in the hole, of a conductive portion electrically connected to the electrical contact pad, forming a conductive via.

Abstract: The invention relates to a method for producing a device with a membrane used to encapsulate a fluid contained in a cavity, in which: two substrates (110, 120) are provided; a membrane (111) is placed on one and/or on the other of the substrates; one or more walls (113) are formed, helping to laterally define the cavity (114), in which said walls are located on or in one of the substrates and/or on or in the other of the substrates, and said cavity is intended to contain the fluid, the two substrates (110, 120) are assembled together by superimposing one on the other so as to complete the cavity, in which the or each membrane (111) also helps to define the cavity, the fluid (117) is encapsulated in the cavity between the substrates, and the or each membrane is soaked by the fluid, at least a portion of one of the substrates and/or the other of the substrates is removed insofar as one and/or the other of the substrates are equipped with a membrane, in order to release the membrane at least in the central po

Abstract: An interconnect structure including: at least one first substrate, whereof at least one first face is made integral with at least one face of at least one second substrate, at least one blind via passing through the first substrate and emerging at the first face of the first substrate and at a second face, opposite the first face, of the first substrate, at least one electric contact arranged against said face of the second substrate and opposite the blind via, and/or against the first face and/or against the second face of the first substrate, at least one channel putting the blind via in communication with an environment outside the interconnect structure and/or with at least one cavity formed in the interconnect structure, and extending substantially parallel to one of said faces of the first or second substrate.

Abstract: A method for making a micro-device including at least one receiving site for components, formed in a thickness of a substrate. The method includes: a) making in at least one first substrate adhesively bonded to a second substrate via a discontinuous adhesive bonding interface, at least one first trench around at least one sacrificial block of the first substrate, by etching the first substrate so as to expose the adhesive bonding interface; and b) removing the sacrificial block so as to make at least one first cavity in the first substrate.

Abstract: It consists of a microcomponent comprising a cavity (13) delimited by a cap (12) enclosing an active part (10) supported by a substrate (11). The cap (12) comprises a top wall (12a) comprising stiffening means with at least one projecting stiffening member (12b), said stiffening member (12b) being located between two recessed areas (12c) of the top wall (12a) and having one end (14) at a distance from the recessed areas (12c) without coming into contact with the substrate (11).

Abstract: A method for producing a sealed cavity, including: a) producing a sacrificial layer on a substrate; b) producing a cover layer covering at least the sacrificial layer and a portion of the face of the substrate not covered by the sacrificial layer, the cover layer including lateral flanks forming, with the substrate, an angle of less than 90°; c) producing a hole through one of the lateral flanks of the cover layer such that a maximum distance between the substrate and an edge of the hole is less than approximately 3 ?m, the hole crossing a portion of the cover layer deposited on a portion of the substrate not covered by the sacrificial layer; d) eliminating the sacrificial layer through the hole, forming the cavity; and e) depositing at least one material plugging the hole in a sealed fashion.

Abstract: A method for making a micro-device including at least one receiving site for components, formed in a thickness of a substrate. The method includes: a) making in at least one first substrate adhesively bonded to a second substrate via a discontinuous adhesive bonding interface, at least one first trench around at least one sacrificial block of the first substrate, by etching the first substrate so as to expose the adhesive bonding interface; and b) removing the sacrificial block so as to make at least one first cavity in the first substrate.

Abstract: The invention relates to a method for producing a device with a membrane used to encapsulate a fluid contained in a cavity, in which: two substrates (110, 120) are provided; a membrane (111) is placed on one and/or on the other of the substrates; one or more walls (113) are formed, helping to laterally define the cavity (114), in which said walls are located on or in one of the substrates and/or on or in the other of the substrates, and said cavity is intended to contain the fluid, the two substrates (110, 120) are assembled together by superimposing one on the other so as to complete the cavity, in which the or each membrane (111) also helps to define the cavity, the fluid (117) is encapsulated in the cavity between the substrates, and the or each membrane is soaked by the fluid, at least a portion of one of the substrates and/or the other of the substrates is removed insofar as one and/or the other of the substrates are equipped with a membrane, in order to release the membrane at least in the central po

Abstract: A method for metalizing at least one blind via formed in at least one substrate, including at least the following steps: a) arranging at least one solid portion of electrically conductive material in the blind via, b) performing a thermal treatment of the solid portion of electrically conductive material, making it melt in the blind via, c) cooling the electrically conductive material, solidifying it in the blind via, and wherein, before carrying out step a), at least part of the walls of the blind via is covered with a material able to prevent wetting of said part of the walls of the blind via by the melted electrically conductive material obtained during the performance of step b), the solidified electrically conductive material obtained after carrying out step c) being able not to be secured to said non-wetting part of the walls of the blind via.

Abstract: An interconnect structure including: at least one first substrate, whereof at least one first face is made integral with at least one face of at least one second substrate, at least one blind via passing through the first substrate and emerging at the first face of the first substrate and at a second face, opposite the first face, of the first substrate, at least one electric contact arranged against said face of the second substrate and opposite the blind via, and/or against the first face and/or against the second face of the first substrate, at least one channel putting the blind via in communication with an environment outside the interconnect structure and/or with at least one cavity formed in the interconnect structure, and extending substantially parallel to one of said faces of the first or second substrate.

Abstract: The invention concerns an interconnect device comprising a support (200) in which at least one hole is formed, the hole having walls forming a closed contour and being formed by a cavity (203) and one or several slots (205a-205b, 215a-215b) communicating with the cavity, the slots extending in a direction making a non-zero angle with the main plane of the support, several conducting elements (214) being positioned on at least one wall of the hole and passing through the latter part, the conducting elements each being intended to connect conducting areas to each other that are situated on either side of the support, at least one of said slots separating two of said conducting elements from each other.

Abstract: It consists of a microcomponent comprising a cavity (13) delimited by a cap (12) enclosing an active part (10) supported by a substrate (11) The cap (13) comprises a top wall (12a) comprising stiffening means with at least one projecting stiffening member (12b) said stiffening member (12b) being located between two recessed areas (12c) of the top wall (12a) and having one end (14) at a distance from the recessed areas (12c) without coming into contact with the substrate (11).