Abstract: A fluid handling structure for a lithographic apparatus is disclosed. The fluid handling structure has a plurality of openings arranged in plan, in a line. The fluid handling structure is configured such that the openings are directed, in use, towards a facing surface, the facing surface being a substrate and/or a substrate table. The substrate table is configured to support the substrate. Outward of the line of openings is a damper. The damper may have a width that varies along the line of openings. The damper width is defined between the line of openings and an opposing damper edge.

Abstract: A fluid handling structure for a lithographic apparatus is disclosed, the fluid handling structure successively has, at a boundary from a space configured to contain immersion fluid to a region external to the fluid handling structure: an elongate opening or a plurality of openings arranged in a first line that, in use, are directed towards a substrate and/or a substrate table configured to support the substrate; a gas knife device having an elongate aperture in a second line; and an elongate opening or a plurality of openings adjacent the gas knife device.

Abstract: A fluid handling structure for a lithographic apparatus is disclosed, the fluid handling structure successively has, at a boundary from a space configured to contain immersion fluid to a region external to the fluid handling structure: an elongate opening or a plurality of openings arranged in a first line that, in use, are directed towards a substrate and/or a substrate table configured to support the substrate; a gas knife device having an elongate aperture in a second line; and an elongate opening or a plurality of openings adjacent the gas knife device.

Abstract: A fluid handling structure for a lithographic apparatus is disclosed, the fluid handling structure successively has, at a boundary from a space configured to contain immersion fluid to a region external to the fluid handling structure: an elongate opening or a plurality of openings arranged in a first line that, in use, are directed towards a substrate and/or a substrate table configured to support the substrate; a gas knife device having an elongate aperture in a second line; and an elongate opening or a plurality of openings adjacent the gas knife device.

Abstract: A fluid handling structure for a lithographic apparatus is disclosed, the fluid handling structure successively has, at a boundary from a space configured to contain immersion fluid to a region external to the fluid handling structure: an elongate opening or a plurality of openings arranged in a first line that, in use, are directed towards a substrate and/or a substrate table configured to support the substrate; a gas knife device having an elongate aperture in a second line; and an elongate opening or a plurality of openings adjacent the gas knife device.

Abstract: A fluid handling structure for a lithographic apparatus is disclosed, the fluid handling structure successively has, at a boundary from a space configured to contain immersion fluid to a region external to the fluid handling structure: an elongate opening or a plurality of openings arranged in a first line that, in use, are directed towards a substrate and/or a substrate table configured to support the substrate; a gas knife device having an elongate aperture in a second line; and an elongate opening or a plurality of openings adjacent the gas knife device.

Abstract: A fluid handling structure for a lithographic apparatus, the fluid handling structure successively having, at a boundary from a space configured to comprise immersion fluid to a region external to the fluid handling structure: an extractor having at least one opening arranged in a first line that, in use, is directed towards a substrate and/or a table; and a liquid manipulator on a surface that, in use, faces the substrate and/or table to reduce the chance of droplets on the surface from coalescing.

Abstract: A fluid handling structure for a lithographic apparatus is disclosed. The fluid handling structure has a plurality of openings arranged in plan, in a line. The fluid handling structure is configured such that the openings are directed, in use, towards a facing surface, the facing surface being a substrate and/or a substrate table. The substrate table is configured to support the substrate. Outward of the line of openings is a damper. The damper may have a width that varies along the line of openings. The damper width is defined between the line of openings and an opposing damper edge.

Abstract: A lithographic apparatus comprises an illumination system configured to condition a radiation beam, a support constructed to support a patterning device, the patterning device being capable of imparting the radiation beam with a pattern in its cross-section to form a patterned radiation beam; a substrate table constructed to hold a substrate, a projection system configured to project the patterned radiation beam onto a target portion of the substrate, and a sensor. The sensor (S) comprises a photodiode (2) provided on a face (8) of a semiconductor substrate (4) towards which the radiation beam is directed during operation of the lithographic apparatus, a first radiation blocking material (10) being provided around the photodiode on the face of the semiconductor substrate, and a second radiation blocking material (12) is provided on a side (14) of the semiconductor substrate upon which the radiation beam is incident during operation of the lithographic apparatus.

Abstract: A fluid handling structure for a lithographic apparatus is disclosed. The fluid handling structure has a plurality of openings arranged in plan, in a line. The fluid handling structure is configured such that the openings are directed, in use, towards a facing surface, the facing surface being a substrate and/or a substrate table. The substrate table is configured to support the substrate. Outward of the line of openings is a damper. The damper may have a width that varies along the line of openings. The damper width is defined between the line of openings and an opposing damper edge.

Abstract: A fluid handling structure for a lithographic apparatus is disclosed, the fluid handling structure successively has, at a boundary from a space configured to contain immersion fluid to a region external to the fluid handling structure: an elongate opening or a plurality of openings arranged in a first line that, in use, are directed towards a substrate and/or a substrate table configured to support the substrate; a gas knife device having an elongate aperture in a second line; and an elongate opening or a plurality of openings adjacent the gas knife device.

Abstract: A fluid handling structure for a lithographic apparatus is disclosed, the fluid handling structure successively has, at a boundary from a space configured to contain immersion fluid to a region external to the fluid handling structure: an elongate opening or a plurality of openings arranged in a first line that, in use, are directed towards a substrate and/or a substrate table configured to support the substrate; a gas knife device having an elongate aperture in a second line; and an elongate opening or a plurality of openings adjacent the gas knife device.

Abstract: A lithographic apparatus comprises an illumination system configured to condition a radiation beam, a support constructed to support a patterning device, the patterning device being capable of imparting the radiation beam with a pattern in its cross-section to form a patterned radiation beam; a substrate table constructed to hold a substrate, a projection system configured to project the patterned radiation beam onto a target portion of the substrate, and a sensor. The sensor (S) comprises a photodiode (2) provided on a face (8) of a semiconductor substrate (4) towards which the radiation beam is directed during operation of the lithographic apparatus, a first radiation blocking material (10) being provided around the photodiode on the face of the semiconductor substrate, and a second radiation blocking material (12) is provided on a side (14) of the semiconductor substrate upon which the radiation beam is incident during operation of the lithographic apparatus.

Abstract: A liquid handling structure for a lithographic apparatus comprises a droplet controller configured to allow a droplet of immersion liquid to be lost from the structure and to prevent the droplet from colliding with the meniscus of the confined immersion liquid. The droplet controller may comprise gas knives arranged to overlap to block an incoming droplet. There may be extraction holes lined up with gaps between gas knives to extract liquid that passes through the gap. A droplet is allowed to escape through the gaps.

Abstract: A fluid handling structure is provided for a lithographic apparatus having at a boundary between a space containing immersion fluid and a region external to the fluid handling structure, a plurality of openings arranged in a first line, a first gas knife device having an aperture in a second line, one or more openings in a third line and a second gas knife device having an aperture in a fourth line.

Abstract: A method of operating a lithographic apparatus is disclosed. The method includes moving a substrate table supporting a substrate relative to a projection system and adjusting the scanning speed between the substrate table and the projection system during imaging of a target within a predefined area at or near an edge of the substrate, or adjusting the stepping speed between adjacent target positions in a predefined area at or near the edge of the substrate, or both. The adjusting the scanning and/or stepping speed may comprise lowering the speed. The projection system is configured to project a patterned beam of radiation on to a target portion of the substrate.

Abstract: A component of an immersion system of a lithographic apparatus is disclosed having a superhydrophobic surface which in use is not exposed to DUV radiation. Also, there is disclosed a surface of a lithographic apparatus which may come into contact with immersion liquid and is a threshold distance from a surface exposed in use to the projection beam has a superhydrophobic property.

Abstract: A fluid handling structure for a lithographic apparatus is disclosed, the fluid handling structure successively has, at a boundary from a space configured to contain immersion fluid to a region external to the fluid handling structure: an elongate opening or a plurality of openings arranged in a first line that, in use, are directed towards a substrate and/or a substrate table configured to support the substrate; a gas knife device having an elongate aperture in a second line; and an elongate opening or a plurality of openings adjacent the gas knife device.

Abstract: A liquid handling structure for a lithographic apparatus comprises a droplet controller configured to allow a droplet of immersion liquid to be lost from the structure and to prevent the droplet from colliding with the meniscus of the confined immersion liquid. The droplet controller may comprise gas knives arranged to overlap to block an incoming droplet. There may be extraction holes lined up with gaps between gas knives to extract liquid that passes through the gap. A droplet is allowed to escape through the gaps.

Abstract: A fluid handling structure for a lithographic apparatus, the fluid handling structure successively having, at a boundary from a space configured to comprise immersion fluid to a region external to the fluid handling structure: an extractor having at least one opening arranged in a first line that, in use, is directed towards a substrate and/or a table; and a liquid manipulator on a surface that, in use, faces the substrate and/or table to reduce the chance of droplets on the surface from coalescing.