Patents by Inventor Facan Feng

Facan Feng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7713085
    Abstract: The present invention provides a connector interface comprising a connector socket interface and a connector plug interface, the connector socket interface comprising metal shell, insulator, band-shaped recess provided on said insulator and metal contacts and the connector plug interface comprising metal shell, insulator, and band-shaped protrusion provided on said insulator and metal contacts, said connector socket interface and said connector plug interface being able to be coupled together, wherein: said connector socket interface has a plurality of band-shaped recesses and said connector plug interface has a plurality of band-shaped protrusions. In a connector interface with the same number of metal pieces according to an embodiment of the present invention, the footprint of the coupling part is reduced, the footprint per pair of contacts is reduced, and the objective of increasing the pin density of the contacts in a connector is achieved.
    Type: Grant
    Filed: February 17, 2006
    Date of Patent: May 11, 2010
    Assignee: Huawei Technologies Co., Ltd.
    Inventors: Hongbin Wu, Dong Yang, Wei Fang, Fengwei Tian, Facan Feng
  • Patent number: 7585189
    Abstract: The present invention relates to a high density connector plug, comprising the body of plug and a plastic enclosure for fixing said body of plug and being connected with the cable. Said body of plug comprises a shielding shell, an insulator mounted in said shielding shell, and a set of contacts provided on the side of said insulator; said insulator comprising a base and upper plastic body and lower plastic body extending outwards from one side of said base, which have slots for mounting said contacts. Thus the interface footprint of plug and socket is reduced and the pin density is increased, thereby the volume of the corresponding device is significantly reduced, so that the devices have a trend towards miniature and high density. In addition, there is a stepped welding area provided on the insulator, so that the contacts can be connected to the cable by welding, and there is visibility in the cable welding, thereby the working efficiency is improved.
    Type: Grant
    Filed: June 28, 2006
    Date of Patent: September 8, 2009
    Assignee: Huawei Technologies Co., Ltd.
    Inventors: Hongbin Wu, Dong Yang, Wei Fang, Fengwei Tian, Facan Feng
  • Publication number: 20080268707
    Abstract: The present invention relates to a high density connector plug, comprising the body of plug and a plastic enclosure for fixing said body of plug and being connected with the cable. Said body of plug comprises a shielding shell, an insulator mounted in said shielding shell, and a set of contacts provided on the side of said insulator; said insulator comprising a base and upper plastic body and lower plastic body extending outwards from one side of said base, which have slots for mounting said contacts. Thus the interface footprint of plug and socket is reduced and the pin density is increased, thereby the volume of the corresponding device is significantly reduced, so that the devices have a trend towards miniature and high density. In addition, there is a stepped welding area provided on the insulator, so that the contacts can be connected to the cable by welding, and there is visibility in the cable welding, thereby the working efficiency is improved.
    Type: Application
    Filed: June 28, 2006
    Publication date: October 30, 2008
    Inventors: Hongbin Wu, Dong Yang, Wei Fang, Fengwei Tian, Facan Feng
  • Publication number: 20080132111
    Abstract: The present invention provides a connector interface comprising a connector socket interface and a connector plug interface, the connector socket interface comprising metal shell, insulator, band-shaped recess provided on said insulator and metal contacts and the connector plug interface comprising metal shell, insulator, and band-shaped protrusion provided on said insulator and metal contacts, said connector socket interface and said connector plug interface being able to be coupled together, wherein: said connector socket interface has a plurality of band-shaped recesses and said connector plug interface has a plurality of band-shaped protrusions. In a connector interface with the same number of metal pieces according to an embodiment of the present invention, the footprint of the coupling part is reduced, the footprint per pair of contacts is reduced, and the objective of increasing the pin density of the contacts in a connector is achieved.
    Type: Application
    Filed: February 17, 2006
    Publication date: June 5, 2008
    Applicant: Huawei Technologies Co., Ltd. (People's Republic of China)
    Inventors: Hongbin Wu, Dong Yang, Wei Fang, Fengwei Tian, Facan Feng