Patents by Inventor Faheem F. Faheem

Faheem F. Faheem has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • ROTARY MAGNET SWITCH
    Publication number: 20150145622
    Abstract: A rotary magnet switch includes a housing defining a cavity for a rotary magnet having a first section rotatable with respect to a second section. A first registration secures the first magnet section to the housing. An actuator extends from a side wall of the housing. The actuator is secured to the second magnet section and is configured to rotate the second magnetic section with respect to the housing and the first magnet section to switch the magnet on and off.
    Type: Application
    Filed: November 25, 2013
    Publication date: May 28, 2015
    Applicant: QinetiQ North America, Inc.
    Inventors: Edward J. Terrenzi, Faheem F. Faheem, Donald MacLeod, Ross Malin, M. Spenser Brouwer, Paul William Paolillo, Scott Quigley
  • Membrane die attach circuit element package and method therefor
    Patent number: 7781852
    Abstract: A circuit element package has a substrate having a plurality of electrically conductive patterns, a die pad, and an access hole formed through the die pad and substrate. A plurality of leads is coupled to the substrate. A circuit element die is attached to the die pad wherein a first sensor port is positioned over the access hole. A die attach membrane is provided for attaching the circuit element die to the die pad. The die attach membrane allows the circuit element die to sense ambient while protecting the circuit element die from environmental damage. An encapsulant is used for covering portions of the circuit element die.
    Type: Grant
    Filed: December 5, 2006
    Date of Patent: August 24, 2010
    Assignee: Amkor Technology, Inc.
    Inventors: Faheem F. Faheem, Christopher M. Scanlan, Christopher J. Berry
  • Etch singulated semiconductor package
    Patent number: 7732899
    Abstract: In accordance with the present invention, there is provided various methods of simultaneously fabricating a plurality of semiconductor packages (e.g., cavity type semiconductor packages) wherein the singulation process is achieved using etching techniques as opposed to more conventional cutting techniques such as sawing or punching. Such etching techniques are inherently lower in cost and free from many of the defects induced by other cutting techniques.
    Type: Grant
    Filed: February 4, 2009
    Date of Patent: June 8, 2010
    Assignee: Amkor Technology, Inc.
    Inventors: Christopher J. Berry, Christopher M. Scanlan, Faheem F. Faheem
  • Etch singulated semiconductor package
    Patent number: 7507603
    Abstract: In accordance with the present invention, there is provided various methods of simultaneously fabricating a plurality of semiconductor packages (e.g., cavity type semiconductor packages) wherein the singulation process is achieved using etching techniques as opposed to more conventional cutting techniques such as sawing or punching. Such etching techniques are inherently lower in cost and free from many of the defects induced by other cutting techniques.
    Type: Grant
    Filed: December 2, 2005
    Date of Patent: March 24, 2009
    Assignee: Amkor Technology, Inc.
    Inventors: Christopher J. Berry, Christopher M. Scanlan, Faheem F. Faheem