Abstract: Polishing pad cleaning systems and related methods are disclosed. A rotatable platen comprising a polishing pad in combination with a fluid, such as a polishing fluid, contacts a substrate to planarize material at the surface thereof and resultantly creates debris. A cleaning system introduces a spray system to remove debris from the polishing pad to prevent substrate damage and improve efficiency, a waste removal system for removing used spray, used polishing fluid, and debris from the polishing pad, and a polishing fluid delivery system for providing fresh polishing fluid to the polishing pad, such that the substrate only receives fresh polishing fluid upon each complete rotation of the platen. In this manner, within die performance is enhanced, the range of certain CMP processes is improved, scratches and contamination are avoided for each polished substrate and for later-polished substrates, and platen temperatures are reduced.

Abstract: In embodiments, improved capabilities are described for dimming performance of lighting methods and systems, such as the improvement of dimming LED lamps that are dimmed from standard external dimming devices. Methods and systems for improving dimming performance include a fast startup override facility for overriding a default dimming function of the lamp's electronics through forcing the lamp electronics to operate with a higher than normal duty cycle to ensure the lamp electronics can deliver higher than normal power to an LED module during a dimming current level startup condition. Dimming facilities may also include a dynamic RC selection facility, an active N-level bleeder facility, a dimmer-type detection facility, an improved dimming linearity through symmetrical phase cutting facility, and a flicker reduction facility.

Abstract: In embodiments, improved capabilities are described for dimming performance of lighting methods and systems, such as the improvement of dimming LED lamps that are dimmed from standard external dimming devices. Methods and systems for improving dimming performance include a fast startup override facility for overriding a default dimming function of the lamp's electronics through forcing the lamp electronics to operate with a higher than normal duty cycle to ensure the lamp electronics can deliver higher than normal power to an LED module during a dimming current level startup condition. Dimming facilities may also include a dynamic RC selection facility, an active N-level bleeder facility, a dimmer-type detection facility, an improved dimming linearity through symmetrical phase cutting facility, and a flicker reduction facility.

Abstract: A method to deposit a layer of harder thin film substrate onto a softer substrate. In particular, the present invention provides a method to deposit a layer of sapphire thin film on to a softer substrate e.g. quartz, fused silica, silicon and (toughen) glass. This combination is better than pure sapphire substrate.

Abstract: A method to transfer a layer of harder thin film substrate onto a softer, flexible substrate. In particular, the present invention provides a method to deposit a layer of sapphire thin film on to a softer and flexible substrate e.g. PET, polymers, plastics, paper and fabrics. This combination provides the hardness of sapphire thin film to softer flexible substrates.

Abstract: In one embodiment, a method for cleaning a surface of a polishing pad includes conditioning the polishing pad surface and rotating the conditioned polishing pad surface. The method also includes spraying the polishing pad surface to lift debris from the conditioned polishing pad surface. The method further includes vacuuming the debris from the polishing pad surface downstream from where the condition occurs, wherein downstream is defined by a rotational direction of the polishing pad. In another embodiment, a processing station including a rotatable platen, a substrate carrier head, a polishing fluid delivery system, a conditioner, a spray nozzle, and a vacuum system is provided. The conditioner is disposed between the substrate carrier head and the spray nozzle. The vacuum system is configured to vacuum the polishing pad surface. The vacuum system is downstream from the conditioner, defined by a rotation of the platen.

Abstract: In embodiments, improved capabilities are described for dimming performance of lighting methods and systems, such as the improvement of dimming LED lamps that are dimmed from standard external dimming devices. Methods and systems for improving dimming performance include a fast startup override facility for overriding a default dimming function of the lamp's electronics through forcing the lamp electronics to operate with a higher than normal duty cycle to ensure the lamp electronics can deliver higher than normal power to an LED module during a dimming current level startup condition. Dimming facilities may also include a dynamic RC selection facility, an active N-level bleeder facility, a dimmer-type detection facility, an improved dimming linearity through symmetrical phase cutting facility, and a flicker reduction facility.