Patents by Inventor Fai Lung Ting

Fai Lung Ting has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • NICKEL ELECTROPLATING COMPOSITIONS FOR ROUGH NICKEL
    Publication number: 20240124999
    Abstract: Nickel electroplating compositions containing thiourethanes deposit rough nickel on substrates. The rough nickel can be electroplated over wide current density ranges. The rough nickel deposits enable improved adhesion to other metal layers in contrast to many conventional nickel deposits.
    Type: Application
    Filed: September 13, 2023
    Publication date: April 18, 2024
    Inventors: Weigang WU, Fai Lung TING
  • NICKEL ELECTROPLATING COMPOSITIONS FOR ROUGH NICKEL
    Publication number: 20240117516
    Abstract: Nickel electroplating compositions containing mercaptotetrazoles deposit rough nickel on substrates. The rough nickel can be electroplated over wide current density ranges. The rough nickel deposits enable improved adhesion to other metal layers in contrast to many conventional nickel deposits.
    Type: Application
    Filed: September 13, 2023
    Publication date: April 11, 2024
    Inventors: Weigang WU, Fai Lung TING
  • SILVER ELECTROPLATING COMPOSITIONS AND METHODS FOR ELECTROPLATING ROUGH MATT SILVER
    Publication number: 20240003037
    Abstract: Silver electroplating compositions deposit rough, matt silver having needle-like grain structures. The rough, matt, silver deposits enable good adhesion with dielectric materials, even in environments of high relative humidity.
    Type: Application
    Filed: February 2, 2023
    Publication date: January 4, 2024
    Inventors: Fai Lung TING, Weigang WU
  • Silver electroplating compositions and methods for electroplating rough matt silver
    Patent number: 11629426
    Abstract: Silver electroplating compositions deposit rough, matt silver having needle-like grain structures. The rough, matt, silver deposits enable good adhesion with dielectric materials, even in environments of high relative humidity.
    Type: Grant
    Filed: June 29, 2022
    Date of Patent: April 18, 2023
    Assignee: ROHM AND HAAS ELECTRONIC MATERIALS LLC
    Inventors: Fai Lung Ting, Weigang Wu
  • Immersion method
    Publication number: 20100101962
    Abstract: A composition and method for inhibiting corrosion is disclosed. Metals and metal alloys are treated with compositions which contain inorganic and organic acids that prevent oxide formation on the metals and metal alloys.
    Type: Application
    Filed: December 29, 2009
    Publication date: April 29, 2010
    Inventors: Danny Lau, Raymund W. M. Kwok, Fai Lung Ting, Jeffrey N. Crosby
  • Electrolytic tin plating solution and electrolytic tin plating method
    Publication number: 20100000873
    Abstract: A plating solution and a plating method, which does not use a complexing agent and which provides favorable solder wetting properties and an extremely low coupling rate when electrolytic tin plating is performed, and particularly when electrolytic tin plating is performed using a barrel plating method.
    Type: Application
    Filed: June 11, 2009
    Publication date: January 7, 2010
    Applicant: Rohm and Haas Electronic Materials LLC
    Inventors: Masaaki Imanari, Fai Lung Ting, Motoya Shimazu, Yasuo Ohta