Patents by Inventor Faith M. Zeller

Faith M. Zeller has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 4770899
    Abstract: A module, for interconnecting integrated circuits, is comprised of a substrate, a layer of polyimide disposed thereon, and a plurality of spaced apart copper conductors on the layer of polyimide. This module is dipped into a solution of palladium chloride, thereafter it is dipped into a solution of sodium hydroxide, and thereafter it is dipped into an electroless plating solution for cobalt. As a result, a film of cobalt is deposited on all exposed surfaces of the copper conductors, but no cobalt is deposited on the exposed polyimide surface between the conductors. This cobalt film protects the copper conductors from corrosion, and it does not short the conductors together.
    Type: Grant
    Filed: June 10, 1987
    Date of Patent: September 13, 1988
    Assignee: Unisys Corporation
    Inventor: Faith M. Zeller