Patents by Inventor Fajanilan Darcyjo Directo

Fajanilan Darcyjo Directo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240088054
    Abstract: A carrier structure is provided with a plurality of package substrates connected via connecting sections, and a functional element and a groove are formed on the connecting section, such that the groove is located between the package substrate and the functional element. Therefore, when a cladding layer covering a chip is formed on the package substrate, the groove can accommodate a glue material overflowing from the cladding layer to prevent the glue material from contaminating the functional element.
    Type: Application
    Filed: December 8, 2022
    Publication date: March 14, 2024
    Inventors: Shu-Ting LAI, Chiu-Lien LI, Che-Min SU, Chun-Huan HUNG, Mu-Hung HSIEH, Cheng-Han YAO, Fajanilan Darcyjo Directo, Cheng-Liang HSU