Patents by Inventor Fakhrozi Bin Che Ani

Fakhrozi Bin Che Ani has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Solder paste stencil with aperture wall coating
    Patent number: 12069810
    Abstract: A solder paste stencil includes, in one embodiment, a substrate defining solder apertures, each aperture wall of each of the solder apertures is coated with a coating material that reduces wetting of a solder paste relative to the aperture walls.
    Type: Grant
    Filed: June 21, 2021
    Date of Patent: August 20, 2024
    Assignee: Sandisk Technologies, Inc.
    Inventors: Fakhrozi Bin Che Ani, Mohamad Riduwan Bin Ramli, Mohamad Solehin Bin Mohamed Sunar, Ibrahym Bin Ahmad
  • MICRO SOLDER JOINT AND STENCIL APERTURE DESIGN
    Publication number: 20240057261
    Abstract: Micro solder joint and stencil design. In one embodiment, a stencil for depositing solder on a printed circuit board (PCB) includes a plurality of stencil apertures, a first stencil aperture of the plurality of apertures having an aperture wall defining an aperture perimeter. The aperture wall is configured to not extend beyond an outer edge of a PCB pad provided on the printed circuit board, the aperture wall is also configured to not extend beyond an outer edge of a terminal of a surface mount component, and the first stencil aperture is configured to receive solder paste to form a non-convex solder joint between the PCB pad and the terminal.
    Type: Application
    Filed: October 24, 2023
    Publication date: February 15, 2024
    Inventors: John Patrick Burke, Ibrahym bin Ahmad, Fakhrozi Bin Che Ani, Mohamad Solehin Bin Mohamed Sunar, Peir Ming Sing, Hari kiran Raavi
  • Micro solder joint and stencil aperture design
    Patent number: 11839031
    Abstract: Micro solder joint and stencil design. In one embodiment, a stencil for depositing solder on a printed circuit board (PCB) includes a plurality of stencil apertures, a first stencil aperture of the plurality of apertures having an aperture wall defining an aperture perimeter. The aperture wall is configured to not extend beyond an outer edge of a PCB pad provided on the printed circuit board, the aperture wall is also configured to not extend beyond an outer edge of a terminal of a surface mount component, and the first stencil aperture is configured to receive solder paste to form a non-convex solder joint between the PCB pad and the terminal.
    Type: Grant
    Filed: April 6, 2022
    Date of Patent: December 5, 2023
    Assignee: Western Digital Technologies, Inc.
    Inventors: John Patrick Burke, Ibrahym bin Ahmad, Fakhrozi Bin Che Ani, Mohamad Solehin Bin Mohamed Sunar, Peir Ming Sing, Hari Kiran Raavi
  • MICRO SOLDER JOINT AND STENCIL APERTURE DESIGN
    Publication number: 20230328892
    Abstract: Micro solder joint and stencil design. In one embodiment, a stencil for depositing solder on a printed circuit board (PCB) includes a plurality of stencil apertures, a first stencil aperture of the plurality of apertures having an aperture wall defining an aperture perimeter. The aperture wall is configured to not extend beyond an outer edge of a PCB pad provided on the printed circuit board, the aperture wall is also configured to not extend beyond an outer edge of a terminal of a surface mount component, and the first stencil aperture is configured to receive solder paste to form a non-convex solder joint between the PCB pad and the terminal.
    Type: Application
    Filed: April 6, 2022
    Publication date: October 12, 2023
    Inventors: John Patrick Burke, Ibrahym bin Ahmad, Fakhrozi Bin Che Ani, Mohamad Solehin Bin Mohamed Sunar, Peir Ming Sing, Hari kiran Raavi
  • SOLDER PASTE STENCIL WITH APERTURE WALL COATING
    Publication number: 20220159842
    Abstract: A solder paste stencil includes, in one embodiment, a substrate defining solder apertures, each aperture wall of each of the solder apertures is coated with a coating material that reduces wetting of a solder paste relative to the aperture walls.
    Type: Application
    Filed: June 21, 2021
    Publication date: May 19, 2022
    Inventors: Fakhrozi Bin Che Ani, Mohamad Riduwan Bin Ramli, Mohamad Solehin Bin Mohamed Sunar, Ibrahym Bin Ahmad