Patents by Inventor Falikul Isbah Batubara

Falikul Isbah Batubara has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • LAMINATE STRUCTURES AND FLEXIBLE PACKAGING MATERIALS INCORPORATING SAME
    Publication number: 20200047460
    Abstract: Embodiments of laminate structures and flexible packaging materials incorporating same comprise a first film comprising biaxially-oriented polyethylene terephthalate (BOPET), and a second film laminated to the first film and comprising a co-extruded film, wherein the second film comprises a polyamide layer and a polyolefin layer, the polyolefin layer comprising a first composition. The first composition comprises at least one ethylene based polymer, wherein the first composition comprises a Molecular Weighted Comonomer Distribution Index (MWCDI) value greater than 0.9, and a melt index ratio (I10/I2) that meets the following equation: I10/I2?7.0?1.2× log (I2).
    Type: Application
    Filed: April 19, 2018
    Publication date: February 13, 2020
    Applicants: Dow Global Technologies LLC, PT Dow Indonesia
    Inventors: Hoai Son Nguyen, Jian Wang, Hwee-Lun Goh, Falikul Isbah Batubara, Adit Pradhana Jayusman Setyogroho, Rou Hua Chua, Peter Sandkuehler