Abstract: Disclosed is an electric coupling system including an electronic control unit (ECU). The ECU includes an ECU housing having at least one guide element and a first thermal contact surface. The ECU includes an electric connector. The electric coupling system further includes a receiving unit for coupling with the ECU. The receiving unit includes a receiving housing to accommodate the ECU at least partially, the receiving housing including at least one guide track and a heat sink with a second thermal contact surface for establishing planar contact with the first thermal contact surface. The receiving unit further includes an electric counter connector for mating with the electric connector.

Abstract: A method for manufacturing an electronic control unit includes providing a printed circuit board with at least one electric component attached thereon. The method includes arranging a lower layer of thermal interface material on top of the electric component and arranging an integrated heat spreader on top of the lower layer. The method includes determining the distance of the top surface of the integrated heat spreader perpendicular to the printed circuit board and arranging an upper layer of thermal interface material on the top surface of the integrated heat spreader. A layer thickness of the upper layer is selected based on the determined distance. The method includes arranging a heat sink with a contact surface such that the contact surface contacts the upper layer.

Abstract: The specification provides arrangements including an electronic controller unit, ECU, comprising a heatsink, a first printed circuit board, PCB; and a second printed circuit board, PCB. A plurality of components are provided located on said PCBs. The heatsink is arranged between the first and second PCBs and is thermally coupled to the components to provide cooling. The heatsink further comprises an aperture extending through a body of the heatsink. The first PCB is directly connected to the second PCB by a board-to-board, B2B, connector configured to electrically and/or communicatively connect the PCBs located above and below the heatsink. The specification also provides arrangements of a heatsink provided for use within an ECU.

Abstract: The specification provides a connector for connection between a hose and a device in a fluid line of a fluid circuit, the device comprising a socket for coupling with the connector. The connector comprises a connector body having a device connector plug (250) and comprises a channel formed axially through the connector body between a distal end opening and a proximal end opening, the channel defining a fluid pathway. The connector further comprises a collar (230) arranged at a proximal end of the plug. The plug is configured to be receivable in a socket of the device, the device interface and socket formed for conformity and for secure coupling, the plug comprising an elongated body portion extending from the collar to a distal end of the connector. The plug comprising a seal (280) and a fastener (270) for engaging with the socket.

Abstract: An electronic system is described that comprises a first board and a first processing unit, wherein the first processing unit comprises a first semiconductor chip arranged on a first surface of the first board; a first cooling unit facing the first surface of the first board and configured to cool the first semiconductor chip; at least one further board and a second processing unit, wherein the second processing unit comprises a further semiconductor chip arranged on a first surface of the at least one further board; and a second cooling unit facing the first surface of the at least one further board and configured to cool the further semiconductor chip. The first board and the at least one further board are spaced apart from each other. The first cooling unit is a passive cooling unit, and the second cooling unit is an active cooling unit.

Abstract: An electronic control unit (ECU) with separable cooling and memory modules is described. The cooling module has an integrated liquid-cooling circuit with a direct connection to the cooling circuit. The memory module includes an independent memory that can store data and be tested independent of the cooling module. The cooling module and the memory module contact at thermal-contact surfaces to enable cooling when installed in a vehicle. In this way, the cooling module may provide cooling through the thermal-contact surface to one or more memory modules and the memory module may be implemented without an internal cooling system.

Abstract: Disclosed are aspects of apparatuses and methods of fitting a cooling device to a circuit board for cooling a high-power electronic component mounted on the circuit board. Cooling apparatuses, and arrangement thereof, are also described. The method provides the cooling device with a cooling surface having a cooling area for thermally connecting to a to-be-cooled surface of the electronic component. Fixing elements are provided for moving the cooling surface towards the circuit board. A distance position “d” of the to-be-cooled surface from the circuit board is determined, and on this basis spacer elements are selected to be interposed between the cooling device and the circuit board to limit the movement by the fixing elements to a position where the cooling area is in proximity to the to-be-cooled surface.

Abstract: A heat sink comprising a body non-adjustably mountable on a support provided with at least one element to be cooled, characterized in that said body comprises at least one insert that is adjustably fitted therein so that an insert contact surface comes into contact with the element to be cooled.

Abstract: An electronic system is described that comprises a first board and a first processing unit, wherein the first processing unit comprises a first semiconductor chip arranged on a first surface of the first board; a first cooling unit facing the first surface of the first board and configured to cool the first semiconductor chip; at least one further board and a second processing unit, wherein the second processing unit comprises a further semiconductor chip arranged on a first surface of the at least one further board; and a second cooling unit facing the first surface of the at least one further board and configured to cool the further semiconductor chip. The first board and the at least one further board are spaced apart from each other. The first cooling unit is a passive cooling unit, and the second cooling unit is an active cooling unit.

Abstract: The present disclosure relates to a cooling system for cooling an electronic component, the cooling system comprising a heat sink with a cooling channel for guiding a liquid. The heat sink comprises an external surface comprising at least one opening which partially exposes the cooling channel. The electronic component is mounted to the external surface such that the electronic component covers the opening. A sealing material is arranged between the electronic component and the external surface for at least partially sealing the electronic component against the liquid. The present disclosure further relates to a method for assembling a cooling system, the method comprising: forming at least one opening through an external surface of a heat sink; dispensing a sealing material in a liquid state over the external surface around the at least one opening for forming a molding; and pressing the electronic component onto the molding.