Abstract: A method is provided for smoothing a surface region of a component consisting of an electrically conductive material. The surface region of the component is coated inside a vacuum chamber, by focused electron beam(s) with a first surface energy, which brings about melting of the component material within the surface region. Before melting, the surface region is passed over at least twice by the electron beam, each time with a different focal length of the electron beam. A second surface energy is set for the electron beam, such that no melting of the component material is brought about in the surface region. Data is recorded by a number of sensors arranged inside the vacuum chamber. An actual value for the roughness is compared to a set point value. If the actual value has not reached the set point value, a value for the first surface energy is determined via comparison.

Abstract: Methods are provided for modifying a transparent and electrically conductive metal-oxide coating deposited on a plastic substrate. At least one surface region of the metal oxide coating is impinged by a pulse-driven electron beam. The impingement of the surface region of the metal oxide coating by the pulse-driven electron beam occurs inside a vacuum chamber into which hydrogen, argon, nitrogen, or oxygen, or a gas mixture of at least two of the above-mentioned gasses has been introduced.

Abstract: Methods are provided for modifying a transparent and electrically conductive metal-oxide coating deposited on a plastic substrate. At least one surface region of the metal oxide coating is impinged by a pulse-driven electron beam. The impingement of the surface region of the metal oxide coating by the pulse-driven electron beam occurs inside a vacuum chamber into which hydrogen, argon, nitrogen, or oxygen, or a gas mixture of at least two of the above-mentioned gasses has been introduced.

Abstract: A method for forming an electrically conductive structure on a plastic substrate is provided. An ink, which contains electrically conductive solid particles, is printed on the plastic substrate, where copper particles are used as electrically conductive solid particles. After the printing of the ink, only the surface regions of the plastic substrate on which the electrically conductive structure is to be formed are swept over within a vacuum chamber by means of an electron beam having a first energy per unit length, causing sintering of the copper particles.