Abstract: A sound receiver includes a casing, a circuit portion, a conductive member, a first piezoelectric plate, a second piezoelectric plate, a first conductive transmission portion, and a second conductive transmission portion. The casing has an accommodating portion. The accommodating portion has an opening and a base. The circuit portion is disposed to close upon the opening. The conductive member having a first side and a second side is disposed in the accommodating portion. The first piezoelectric plate is disposed at the first side of the conductive member within the accommodating portion. The second piezoelectric plate is disposed at the second side of the conductive member within the accommodating portion. The first conductive transmission is configured to elastically and electrically connect the base and the first piezoelectric plate. The second conductive transmission is configured to elastically and electrically connect the circuit portion and the second piezoelectric plate.

Abstract: A MEMS microphone has a cover, a base and a MEMS chip. The cover has a contact voice receiving unit which is disposed on the base, and a space is formed between the cover and the base. The MEMS chip is disposed in the space and electrically connected to the base and the contact voice receiving unit. The MEMS microphone enhances the quality of voice transmission by reducing interferences from ambient noises.

Abstract: A MEMS microphone has a cover, a base and a MEMS chip. The cover has a contact voice receiving unit which is disposed on the base, and a space is formed between the cover and the base. The MEMS chip is disposed in the space and electrically connected to the base and the contact voice receiving unit. The MEMS microphone enhances the quality of voice transmission by reducing interferences from ambient noises.