Patents by Inventor Fan-Hsien Hsu

Fan-Hsien Hsu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20090066349
    Abstract: A probe system including a body, a testing apparatus, a probe card, and a strengthening mechanism is provided. The testing apparatus is disposed above the body. The probe card is disposed between the testing apparatus and the body. The strengthening mechanism is disposed between the probe card and the testing apparatus to have the probe card leaned against it. The strengthening mechanism has at least one elastic element.
    Type: Application
    Filed: January 30, 2008
    Publication date: March 12, 2009
    Applicant: POWERCHIP SEMICONDUCTOR CORP.
    Inventors: Fan-Hsien Hsu, Kuang-Hsuan Chiu, Li-Tien Yang, Yu-Hsin Liu
  • Patent number: 7449902
    Abstract: A probe apparatus and a probe system are provided. The probe apparatus uses a larger printed circuit board to dispose a plurality of testers. The layout of each of the testers on the circuit board is modified accordingly, such that more number of the testers can be disposed on the circuit board and the pin count of the probe apparatus is increased. In addition, the probe apparatus can be installed in the test tool. Accordingly, the testing efficiency of the present test tool can be substantially promoted and the cost of the overall testing can be effectively reduced.
    Type: Grant
    Filed: June 13, 2007
    Date of Patent: November 11, 2008
    Assignee: Powerchip Semiconductor Corp.
    Inventor: Fan-Hsien Hsu
  • Patent number: 7298154
    Abstract: A probe apparatus and a probe system are provided. The probe apparatus uses a larger printed circuit board to dispose a plurality of testers. The layout of each of the testers on the circuit board is modified accordingly, such that more number of the testers can be disposed on the circuit board and the pin count of the probe apparatus is increased. In addition, the probe apparatus can be installed in the test tool. Accordingly, the testing efficiency of the present test tool can be substantially promoted and the cost of the overall testing can be effectively reduced.
    Type: Grant
    Filed: April 20, 2006
    Date of Patent: November 20, 2007
    Assignee: Powerchip Semiconductor Corp.
    Inventor: Fan-Hsien Hsu
  • Publication number: 20070229108
    Abstract: A probe apparatus and a probe system are provided. The probe apparatus uses a larger printed circuit board to dispose a plurality of testers. The layout of each of the testers on the circuit board is modified accordingly, such that more number of the testers can be disposed on the circuit board and the pin count of the probe apparatus is increased. In addition, the probe apparatus can be installed in the test tool. Accordingly, the testing efficiency of the present test tool can be substantially promoted and the cost of the overall testing can be effectively reduced.
    Type: Application
    Filed: June 13, 2007
    Publication date: October 4, 2007
    Applicant: POWERCHIP SEMICONDUCTOR CORP.
    Inventor: Fan-Hsien Hsu
  • Publication number: 20070115011
    Abstract: A probe apparatus and a probe system are provided. The probe apparatus uses a larger printed circuit board to dispose a plurality of testers. The layout of each of the testers on the circuit board is modified accordingly, such that more number of the testers can be disposed on the circuit board and the pin count of the probe apparatus is increased. In addition, the probe apparatus can be installed in the test tool. Accordingly, the testing efficiency of the present test tool can be substantially promoted and the cost of the overall testing can be effectively reduced.
    Type: Application
    Filed: April 20, 2006
    Publication date: May 24, 2007
    Inventor: Fan-Hsien Hsu