Abstract: An integrated module of acoustic wave device with active thermal compensation comprises a substrate, an acoustic wave filter, an active adjustment circuit and at least one variable capacitance device. The acoustic wave filter comprises a plurality of series acoustic wave resonators formed on the substrate, at least one shunt acoustic wave resonator formed on the substrate and a thermal sensing acoustic wave resonator. Each of the variable capacitance device is connected in parallel to one of the series and shunt acoustic wave resonators. The active adjustment circuit outputs an active thermal compensation signal correlated to a thermal variation sensed by the thermal sensing acoustic wave resonator to the variable capacitance device. The active thermal compensation signal induces a capacitance variation of the variable capacitance device such that the impact of the thermal variation to the acoustic wave device is compensated.

Abstract: An acoustic wave filter having thermal sensing acoustic wave resonator comprises a substrate, a plurality of series acoustic wave resonators formed on the substrate, at least one shunt acoustic wave resonator formed on the substrate and a thermal sensing acoustic wave resonator. The thermal sensing acoustic wave resonator is one of a series acoustic wave resonator and a shunt acoustic wave resonator. Thereby the thermal sensing acoustic wave resonator plays dual roles of thermal sensing and acoustic wave filtering.

Abstract: A thermal sensor circuit comprises a conversion circuit which is one of a buck DC-DC converter circuit and a boost DC-DC converter circuit, wherein the conversion circuit comprises an inductor and an output terminal. A thermal sensor senses a thermal variation correlated to a capacitance variation of the thermal sensor. The capacitance variation induces an internal parasitic capacitance variation of the inductor which is connected in parallel to the thermal sensor and results a variation of an energy stored in the inductor. Hence a variation of a converted circuit signal outputting by the output terminal is caused, wherein the variation of the converted circuit signal is correlated to the thermal variation.

Abstract: A package structure is disclosed. The package structure includes at least a lead, for delivering at least a signal; at least a routing layer, connected to the at least a lead, where at least a first hole is formed through the at least a routing layer; a die, disposed on the at least a routing layer, where at least a second hole is formed through the die, and the die generates or receives the at least a signal; and a molding cap, for covering the at least a routing layer and the die; where the at least a signal is delivered through the at least a first hole and the at least a second hole.

Abstract: A thermal sensor circuit comprises a conversion circuit which is one of a buck DC-DC converter circuit and a boost DC-DC converter circuit, wherein the conversion circuit comprises an inductor and an output terminal. A thermal sensor senses a thermal variation correlated to a capacitance variation of the thermal sensor. The capacitance variation induces an internal parasitic capacitance variation of the inductor which is connected in parallel to the thermal sensor and results a variation of an energy stored in the inductor. Hence a variation of a converted circuit signal outputting by the output terminal is caused, wherein the variation of the converted circuit signal is correlated to the thermal variation.

Abstract: An integrated module of acoustic wave device with active thermal compensation comprises a substrate, an acoustic wave filter, an active adjustment circuit and at least one variable capacitance device. The acoustic wave filter comprises a plurality of series acoustic wave resonators formed on the substrate, at least one shunt acoustic wave resonator formed on the substrate and a thermal sensing acoustic wave resonator. Each of the variable capacitance device is connected in parallel to one of the series and shunt acoustic wave resonators. The active adjustment circuit outputs an active thermal compensation signal correlated to a thermal variation sensed by the thermal sensing acoustic wave resonator to the variable capacitance device. The active thermal compensation signal induces a capacitance variation of the variable capacitance device such that the impact of the thermal variation to the acoustic wave device is compensated.

Abstract: An acoustic wave filter having thermal sensing acoustic wave resonator comprises a substrate, a plurality of series acoustic wave resonators formed on the substrate, at least one shunt acoustic wave resonator formed on the substrate and a thermal sensing acoustic wave resonator. The thermal sensing acoustic wave resonator is one of a series acoustic wave resonator and a shunt acoustic wave resonator. Thereby the thermal sensing acoustic wave resonator plays dual roles of thermal sensing and acoustic wave filtering.

Abstract: A biasing circuitry is disclosed. The biasing circuitry includes a biasing module, electrically connected to a power amplifier; and a control series, having an end electrically connected to a positive voltage, and another end electrically connected to the biasing module. The control series includes a switch unit, controlled by a control voltage to be on or off; and a voltage-drop unit, connected to the switch unit in series. The voltage-drop unit is configured to adjust a bias point of the power amplifier.

Abstract: A power amplifier (PA) has been disclosed for linearity improvement. The PA comprises at least an amplifying transistor and at least an auxiliary transistor. Each amplifying transistor of the at least an amplifying transistor includes a first terminal for receiving an input signal of the PA, a second terminal for delivering an output signal of the PA, and a third terminal. Each auxiliary transistor of the at least an auxiliary transistor includes a first terminal, a second terminal coupled to the second terminal of the at least an amplifying transistor, and a third terminal electrically connected to the first terminal of the at least an amplifying transistor.

Abstract: A low noise amplifier (LNA) has been disclosed for the noise and linearity performance improvement. The LNA includes an amplifying transistor and an auxiliary transistor. The amplifying transistor includes a first terminal for receiving an input signal of the LNA, a second terminal for outputting an output signal of the LNA, and a third terminal. The auxiliary transistor has a first terminal, a second terminal coupled to the second terminal of the amplifying transistor, and a third terminal electrically connected to the first terminal of the amplifying transistor.

Abstract: A biasing circuitry is disclosed. The biasing circuitry includes a biasing module, electrically connected to a power amplifier; and a control series, having an end electrically connected to a positive voltage, and another end electrically connected to the biasing module. The control series includes a switch unit, controlled by a control voltage to be on or off; and a voltage-drop unit, connected to the switch unit in series. The voltage-drop unit is configured to adjust a bias point of the power amplifier.

Abstract: A power amplifier (PA) has been disclosed for linearity improvement. The PA comprises at least an amplifying transistor and at least an auxiliary transistor. Each amplifying transistor of the at least an amplifying transistor includes a first terminal for receiving an input signal of the PA, a second terminal for delivering an output signal of the PA, and a third terminal. Each auxiliary transistor of the at least an auxiliary transistor includes a first terminal, a second terminal coupled to the second terminal of the at least an amplifying transistor, and a third terminal electrically connected to the first terminal of the at least an amplifying transistor.

Abstract: A package structure is disclosed. The package structure includes at least a lead, for delivering at least a signal; at least a routing layer, connected to the at least a lead, where at least a first hole is formed through the at least a routing layer; a die, disposed on the at least a routing layer, where at least a second hole is formed through the die, and the die generates or receives the at least a signal; and a molding cap, for covering the at least a routing layer and the die; where the at least a signal is delivered through the at least a first hole and the at least a second hole.

Abstract: A low noise amplifier (LNA) has been disclosed for the noise and linearity performance improvement. The LNA includes an amplifying transistor and an auxiliary transistor. The amplifying transistor includes a first terminal for receiving an input signal of the LNA, a second terminal for outputting an output signal of the LNA, and a third terminal. The auxiliary transistor has a first terminal, a second terminal coupled to the second terminal of the amplifying transistor, and a third terminal electrically connected to the first terminal of the amplifying transistor.

Abstract: A single wavelength fiber-optic communication system that mixes an Ethernet signal with a radio frequency signal is disclosed. The system includes an Ethernet signal module, a radio frequency signal module, a mixer module and a receiver module. The Ethernet signal module provides an Ethernet signal. The radio frequency signal module provides a radio frequency signal. The mixer module provides an optical mixed signal by means of mixing the Ethernet signal with the radio signal at a single wavelength. The receiver module transforms the optical mixed signal into the radio frequency signal and a digital signal that contains the Ethernet signal.

Abstract: The present invention improves a frequency divider circuit so that the frequency divider further obtains a capability of operating an injection-locking frequency division without changing or adding any component; and, the frequency divider operates under low voltage and low power consumption yet in high frequency, where the present invention can be use in related fields of radio frequency and optoelectronic communication.

Abstract: The present invention is an optical fiber system and method for carrying both CATV and Ethernet signals. The digital signals are translated into higher band by a direct up/down conversion so that analog signals and digital signals are treated as different frequency bands of electrical signals. Then, all the signals are mixed/divided by a power combiner/divider. And then, by using optoelectronic devices, the signals are processed with optoelectronic conversion. The converted optical signals are transmitted in a fiber or a related optical channel having low channel loss yet high capacity. To sum up, the present invention can transmit digital signals together with analog signals in a single wavelength to save the cost of an optical signal system and to provide a convenience on rearranging the system.

Abstract: A frequency divider, which has a cross-coupled inductor-capacitor (LC) structure or a ring structure, is inputted with a direct current (DC) control voltage from an input terminal. By doing so, the frequency divider can adjust an oscillation frequency; and further compensate the input power sensitivity, lower the power consumption and increase the division range. The frequency divider can be used in high-band/high-speed digital or analog communication systems.

Abstract: The present invention improves a frequency divider circuit so that the frequency divider further obtains a capability of operating an injection-locking frequency division without changing or adding any component; and, the frequency divider operates under low voltage and low power consumption yet in high frequency, where the present invention can be use in related fields of radio frequency and optoelectronic communication.

Abstract: A single wavelength fiber-optic communication system that mixes an Ethernet signal with a radio frequency signal is disclosed. The system includes an Ethernet signal module, a radio frequency signal module, a mixer module and a receiver module. The Ethernet signal module provides an Ethernet signal. The radio frequency signal module provides a radio frequency signal. The mixer module provides an optical mixed signal by means of mixing the Ethernet signal with the radio signal at a single wavelength. The receiver module transforms the optical mixed signal into the radio frequency signal and a digital signal that contains the Ethernet signal.