Abstract: Meta-lens based ocular imaging, near-eye display, and eye-tracking systems are described. The systems can include a single focusing optic and an integrated circuit that provides illumination light and includes an imaging array. The focusing optic includes meta-atoms formed on a substrate. The systems may have no moving parts and achieve imaging or image-projection fields-of-view approaching or exceeding 180 degrees. Because of their low part count, the systems can be robust and have a very small form factor.

Abstract: A wide field-of-view sensor or projector includes a transparent substrate with one or more apertures on one side, and one or more chip stacks joined to the opposite side. Each chip stack includes a flat optics layer (e.g., metasurface), at least one spacer layer, an optional filter layer, and either an image sensor or a light source. In one example, two apertures and two corresponding chip stacks are provided; both chip stacks include image sensors but different metasurfaces and filters to capture different information from the scene. In an alternative embodiment, the two chip stacks include a light source and an image sensor, to function as a light projector and a light receiver, respectively. In other examples, two apertures and a single chip stack are provided, where the single chip stack include two metasurface and/or two filters corresponding to the two apertures.

Abstract: A mask for forming a trench in a flexible bendable region of a flexible display panel is provided. The mask includes a first region, a second region, and a third region sandwiched between the first and second regions in a first direction, and the third region has the same pattern as a pattern of a trench to be formed. Light transmission properties of the first and second regions are the same as each other, but are opposite to a light transmission property of the third region. An edge of at least one of the first and second regions proximal to the third region has a plurality of protrusions, and each of the plurality of protrusions has a vertex angle that is at a side proximal to the third region and is not more than 90°. A flexible display panel and a manufacturing method thereof are further provided.

Abstract: The disclosure provides a three-dimensional (3D) image classification method and apparatus, a device, and a storage medium. The method includes: obtaining a 3D image, the 3D image including first-dimensional image information, second-dimensional image information, and third-dimensional image information; extracting a first image feature corresponding to planar image information from the 3D image; extracting a second image feature corresponding to the third-dimensional image information from the 3D image; fusing the first image feature and the second image feature, to obtain a fused image feature corresponding to the 3D image; and determining a classification result corresponding to the 3D image according to the fused image feature corresponding to the 3D image.

Abstract: An electronic device (200) includes a liquid crystal display (LCD) panel (204), a cover layer (218), one or more light sources (224), and an optical sensor module (226). The LCD panel (204) receives a contact input associated with a fingerprint of a user. The cover layer (218) includes a first major surface (228) and a second major surface (230) opposite to the first major surface (228), and is disposed on the LCD panel (204). The cover layer (218) defines a first axis (AA?) normal to the first major surface (228). The optical sensor module (226) receives a light from the predetermined fingerprint sensing area (222) to detect the fingerprint. The optical sensor module (226) at least partially overlaps with the predetermined fingerprint sensing area (222) along the plane of the first major surface (228). The optical sensor module (226) defines a second axis (BB?) normal to a surface of the optical sensor module (226).

Abstract: The present invention relates to the technical field of acetonitrile refining, and in particular, to an improved acetonitrile purification process for an ultrahigh performance liquid chromatography-mass spectrometer. The present invention provides an acetonitrile purification process. A high-purity finished product may be obtained by performing operations of oxidation, rectification adsorption, drying, reflux rectification and filtration on industrial acetonitrile and controlling related parameters such as temperature, flow and the like, continuous production is ensured, a light transmittance of the finished product in ultraviolet rays of 200 to 260 nm is greater than or equal to 95%, water and impurities in the industrial acetonitrile are removed, and the requirements of the ultrahigh performance liquid chromatography-mass spectrometer are met; moreover, by controlling process parameters and equipment.

Abstract: An ultrasound scanning control method applied to an ultrasound scanning device is provided. The ultrasound scanning device includes an execution mechanism. The execution mechanism includes a mechanical arm and a probe. The ultrasound scanning control method includes controlling the mechanical arm to drive the probe to move according to a set scanning trajectory for performing an ultrasound scanning detection on a part to be examined. Once an actual pressure value between the probe and the part to be examined in each control cycle is sensed using the force sensor, a pressure value between the probe and the part to be examined is controlled to be a constant value based on the actual pressure value.

Abstract: A computing system including a plurality of processing devices configured to execute a Mixture-of-Experts (MoE) layer. The processing devices are configured to execute the MoE layer at least in part by receiving an input tensor including input tokens. Executing the MoE layer further includes computing a gating function output vector based on the input tensor and computing a sparse encoding of the input tensor and the gating function output vector. The sparse encoding indicates one or more destination expert sub-models. Executing the MoE layer further includes dispatching the input tensor for processing at the one or more destination expert sub-models, and further includes computing an expert output tensor. Executing the MoE layer further includes computing an MoE layer output at least in part by computing a sparse decoding of the expert output tensor. Executing the MoE layer further includes conveying the MoE layer output to an additional computing process.

Abstract: A system, method, and computer program product for determining the cause of a battery condition, such as a thermal runaway event, are provided. An example battery safety evaluation system may include a battery having a housing and an interior battery compartment. The battery safety evaluation system may include internal sensing elements attached to the interior battery compartment and configured to capture data representative of an internal battery condition event. The battery safety evaluation system may further include an external sensing element attached to the battery housing and configured to capture data representative of an external battery condition event. In addition, the battery safety evaluation system may include a controller for determining a cause of the battery condition based at least in part on a time sequence of events generated from the internal data captured by the internal sensing element and the external data captured by the external sensing element.

Abstract: A hoist for transferred materials in an underground auxiliary transportation system and a method thereof. The hoist includes a hoist body, guiding plates mounted at two ends of the hoist body through bolts, twist locks mounted at four ends of the hoist body, a driving unit configured to drive twist locks to rotate, transmission assemblies configured to connect the twist locks with the driving unit, ejector pins configured to prevent the twist locks from rotating mistakenly, and a sensor configured to control the hoist to operate and provide protection safety.

Abstract: A powder-based three-dimensional printing (3DP) method, device and system, and a computer-readable storage medium. The method includes: analyzing printing images of layers corresponding to a part to be printed to determine a target print image and adding a preset mark to the target print image which includes a print image of a target layer that causes a previous powder layer of the target layer to displace during printing; acquiring an image to be printed of a current layer to be printed; identifying the image to be printed to determine whether the preset mark exists on the image to be printed; and if yes, processing the current layer to be printed and/or a previous powder layer of the current layer to be printed such that the previous powder layer of the current layer does not move with powder spreading of the current layer.

Abstract: An integrated optical component coupled to a circuit board of an aerosol sensor is provided. The integrated optical component comprising a medium including a first, second plane, third plane, wherein the first plane is adjacent to a detection area, the second plane is positioned about a photosensor, and the third plane is opposite an angle formed by an intersection of the first and second plane. The integrated optical component further comprising a first lens configured on the first sidewall, the first lens configured to receive incident light from the detection area and focus the incident light onto a reflector through the medium, the reflector configured on the third sidewall, the reflector configured to reflect the incident light towards a second lens, and the second lens configured on the second sidewall, the second lens configured to receive the incident light from the reflector and focus the incident light to the photosensor.

Abstract: Various embodiments of the present disclosure are directed towards a semiconductor processing system including an overlay (OVL) shift measurement device. The OVL shift measurement device is configured to determine an OVL shift between a first wafer and a second wafer, where the second wafer overlies the first wafer. A photolithography device is configured to perform one or more photolithography processes on the second wafer. A controller is configured to perform an alignment process on the photolithography device according to the determined OVL shift. The photolithography device performs the one or more photolithography processes based on the OVL shift.

Abstract: A method and a system for detecting a semiconductor device are provided. The method comprises obtaining an image of the semiconductor device, evaluating a feature of the image, detecting a defect of the semiconductor device based on the feature, extracting a defect information for the defect, calculating a defect die ratio (DDR) in response to the defect and analyzing a relation between the DDR and the defect information.

Abstract: The present disclosure relates to an integrated chip including a semiconductor device substrate and a plurality of semiconductor devices arranged along the semiconductor device substrate. A micro-electromechanical system (MEMS) layer overlies the semiconductor device substrate. The MEMS layer includes a first moveable mass and a second moveable mass. A capping layer overlies the MEMS layer. The capping layer has a first lower surface directly over the first moveable mass and a second lower surface directly over the second moveable mass. An outgas layer is on the first lower surface and directly between the first pair of sidewalls. A lower surface of the outgas layer delimits a first cavity in which the first moveable mass is arranged. The second lower surface of the capping layer delimits a second cavity in which the second moveable mass is arranged.

Abstract: Various embodiments of the present disclosure are directed towards a microelectromechanical system (MEMS) device. The MEMS device includes a first dielectric structure disposed over a first semiconductor substrate, where the first dielectric structure at least partially defines a cavity. A second semiconductor substrate is disposed over the first dielectric structure and includes a movable mass, where opposite sidewalls of the movable mass are disposed between opposite sidewall of the cavity. A first piezoelectric anti-stiction structure is disposed between the movable mass and the first dielectric structure, wherein the first piezoelectric anti-stiction structure includes a first piezoelectric structure and a first electrode disposed between the first piezoelectric structure and the first dielectric structure.

Abstract: Various embodiments of the present disclosure are directed towards an integrated chip including an interconnect structure overlying a semiconductor substrate. An upper dielectric structure overlies the interconnect structure. A microelectromechanical system (MEMS) substrate overlies the upper dielectric structure. A cavity is defined between the MEMS substrate and the upper dielectric structure. The MEMS substrate comprises a movable membrane over the cavity. A cavity electrode is disposed in the upper dielectric structure and underlies the cavity. A plurality of stopper structures is disposed in the cavity between the movable membrane and the cavity electrode. A dielectric protection layer is disposed along a top surface of the cavity electrode. The dielectric protection layer has a greater dielectric constant than the upper dielectric structure.

Abstract: Various embodiments of the present disclosure are directed towards a microelectromechanical system (MEMS) device. The MEMS device includes a first dielectric structure disposed over a first semiconductor substrate, where the first dielectric structure at least partially defines a cavity. A second semiconductor substrate is disposed over the first dielectric structure and includes a movable mass, where opposite sidewalls of the movable mass are disposed between opposite sidewall of the cavity.

Abstract: Disclosed is a shock absorption device for photoelectric instrument for gun, comprising a bracket, a buffer mechanism, and a connection mechanism; a card block is formed on the bracket, and a perforation is formed on the card block; the buffer mechanism includes a buffer seat, a slide bar, and a cushioning elastic; the connection mechanism is mounted on the bracket and used to be detachably connected to Picatinny rail on a sniper rifle. When shooting, the sniper rifle recoils, the sniper rifle drives the Picatinny rail to recoil, the Picatinny rail drives the bracket to recoil through the connection mechanism, the bracket acts on the cushioning elastic, and the cushioning elastic contracts, which can buffer the photoelectric instrument for the gun installed on the buffer seat, reduce the recoil of the photoelectric instrument for gun, and prolong its service life.

Abstract: The present invention relates to a method for preparing GLP-1 receptor agonist, specifically relates to an industrialized method for preparing a GLP-1 receptor agonist (S)-2-(3S,8S)-3-(4-(3,4-dichlorobenzyloxy)phenyl-7-((S)-1-phenylpropyl)-2,3,6,7,8,9-hexahydro-[1,4]-dioxino[2,3-g]isoquinolin-8-ylformylamino)-3-(4-(2,3-dimethylpyridin-4-yl)phenyl)propanoic acid dihydrochloride (compound I). The method utilizes compound 1 as the starting material, which undergoes nucleophilic addition, hydrolysis, reduction ammoniation, cyclization, amide condensation, hydrolysis, and salt forming reaction to give compound I. The method for preparing compound I has a total yield of more than 35%, with purity of compound I more than 98%.