Abstract: Disclosed are a battery and an electronic device, where the battery includes a first electrode plate, a second electrode plate, a control unit, and a first tab and a second tab that are connected to the first electrode plate, and the first electrode plate and the second electrode plate have opposite polarities. The control unit includes a heating control circuit, and in a case that the battery is connected to an external power supply, the heating control circuit is configured to: when a battery temperature of the battery is less than a first temperature threshold, conduct the first tab, the first electrode plate, and the second tab to heat the battery. A charging speed of the battery at a low temperature may be improved, and lithium deposition and capacity fading of the battery may be slowed down.

Abstract: The present invention relates to a macro plastic and micro plastic detection method based on RGB and hyperspectral image fusion, which includes the following steps: obtaining macro plastics and micro plastics; mixing with solid wastes to obtain a solid-phase substrate; pretreating the obtained solid-phase substrate to obtain a material; drying to remove part of moisture and coating on a quartz window sheet, drying until the moisture is completely removed, and flattening by using another quartz window sheet to obtain a material to be detected; obtaining an RGB image and a hyperspectral image of the material to be detected respectively by using a high-resolution color image scanner and a hyperspectral camera; fusing the obtained RGB image and hyperspectral image; and automatically classifying and identifying the macro plastics and the micro plastics by using a supervised classification model.

Abstract: This application relates to the artificial intelligence (AI) field, and specifically, to a voice quality enhancement method and a related device. The method includes: after a PNR mode is enabled, obtaining a noisy voice signal and target voice-related data, where the noisy-carrying voice signal includes a voice signal of a target user and an interfering noise signal, and the target voice-related data indicates a voice feature of the target user; and performing noise reduction on the noisy voice signal based on the target voice-related data by using a trained voice noise reduction model to obtain a noise-reduced voice signal of the target user, where the voice noise reduction model is implemented based on a neural network. In embodiments of this application, voice of a target person can be enhanced, and interference can be suppressed.

Abstract: A powder-based three-dimensional printing (3DP) method, device and system, and a computer-readable storage medium. The method includes: analyzing printing images of layers corresponding to a part to be printed to determine a target print image and adding a preset mark to the target print image which includes a print image of a target layer that causes a previous powder layer of the target layer to displace during printing; acquiring an image to be printed of a current layer to be printed; identifying the image to be printed to determine whether the preset mark exists on the image to be printed; and if yes, processing the current layer to be printed and/or a previous powder layer of the current layer to be printed such that the previous powder layer of the current layer does not move with powder spreading of the current layer.

Abstract: A hoist for transferred materials in an underground auxiliary transportation system and a method thereof. The hoist includes a hoist body, guiding plates mounted at two ends of the hoist body through bolts, twist locks mounted at four ends of the hoist body, a driving unit configured to drive twist locks to rotate, transmission assemblies configured to connect the twist locks with the driving unit, ejector pins configured to prevent the twist locks from rotating mistakenly, and a sensor configured to control the hoist to operate and provide protection safety.

Abstract: Circuit board assembly, Display apparatus, Terminal, and Signal processing system. The circuit board assembly comprises a first circuit board, a second circuit board, a third circuit board, and multiple differential signal lines; the first circuit board comprises a first connector which comprises a first lead group comprising N first leads and a second lead group comprising N second lead; the second circuit board comprises a second connector which comprises a third lead group comprising N third leads and a fourth lead group comprising N fourth leads; multiple i-th leads and multiple (i+2)-th leads are in one-to-one correspondence, and the i-th leads and the corresponding (i+2)-th leads are arranged along a first direction; a first differential line of a j-th differential signal line is connected to the (2j?1)-th i-th lead and the (2j?1)-th (i+2)-th lead, its second differential line is connected to the 2j-th i-th lead and the 2j-th (i+2)-th lead.

Abstract: A method for manufacturing a semiconductor structure includes forming a fin over a substrate, wherein the fin includes first semiconductor layers and second semiconductor layers alternating stacked. The method also includes forming an isolation feature around the fin, forming a dielectric feature over the isolation feature, forming a cap layer over the fin and the dielectric feature, oxidizing the cap layer to form an oxidized cap layer, forming source/drain features passing through the cap layer and in the fin, removing the second semiconductor layers in the fin to form nanostructures, and forming a gate structure wrapping around the nanostructures.

Abstract: A semiconductor structure includes a semiconductor substrate; fin active regions protruded above the semiconductor substrate; and a gate stack disposed on the fin active regions; wherein the gate stack includes a high-k dielectric material layer, and various metal layers disposed on the high-k dielectric material layer. The gate stack has an uneven profile in a sectional view with a first dimension D1 at a top surface, a second dimension D2 at a bottom surface, and a third dimension D3 at a location between the top surface and the bottom surface, and wherein each of D1 and D2 is greater than D3.

Abstract: A semiconductor structure includes a semiconductor substrate; fin active regions protruded above the semiconductor substrate; and a gate stack disposed on the fin active regions; wherein the gate stack includes a high-k dielectric material layer, and various metal layers disposed on the high-k dielectric material layer. The gate stack has an uneven profile in a sectional view with a first dimension D1 at a top surface, a second dimension D2 at a bottom surface, and a third dimension D3 at a location between the top surface and the bottom surface, and wherein each of D1 and D2 is greater than D3.

Abstract: A semiconductor structure includes a fin extending from a substrate and oriented lengthwise in a first direction, where the fin includes a stack of semiconductor layers, an isolation feature disposed over the substrate and oriented lengthwise in a second direction perpendicular to the first direction, where the isolation feature is disposed adjacent to the fin, and a metal gate structure having a top portion disposed over the stack of semiconductor layers and a bottom portion interleaved with the stack of semiconductor layers. Furthermore, a sidewall of the bottom portion of the metal gate structure is defined by a sidewall of the isolation feature, and the top portion of the metal gate structure laterally extends over a top surface of the isolation feature.

Abstract: A unidirectional or bidirectional sand dispensing device, including a discharge port (10), the discharge port includes a lower plate (11) and an upper plate (12), the upper plate is provided above the lower plate, an included angle between a horizontal plane and a straight line where an endpoint of a free end of the upper plate and an endpoint of a free end of the lower plate are located is a leakage angle (13), that is to say, a particulate material forms an inclined plane between the upper plate and the lower plate, and an included angle between the inclined plane and the horizontal plane is the leakage angle, which can be adjusted by changing relative positions of the upper plate and the lower plate. The direction of an opening of the sand passing passage is opposite to a moving direction during the sand dispensing operation.

Abstract: A method for manufacturing a semiconductor structure includes forming a fin over a substrate, wherein the fin includes first semiconductor layers and second semiconductor layers alternating stacked. The method also includes forming an isolation feature around the fin, forming a dielectric feature over the isolation feature, forming a cap layer over the fin and the dielectric feature, oxidizing the cap layer to form an oxidized cap layer, forming source/drain features passing through the cap layer and in the fin, removing the second semiconductor layers in the fin to form nanostructures, and forming a gate structure wrapping around the nanostructures.

Abstract: The present invention relates to organic polymer synthetic materials, and discloses a self-curing organic synthetic resin composition for additive manufacturing. The self-curing organic synthetic resin composition includes 30-75% by weight of a linear thermoplastic phenolic resin and 25-70% by weight of a phenol modified furan resin. The self-curing organic synthetic resin composition is prepared through three stages. The linear thermoplastic phenolic resin prepared in stage (1) and the phenol modified furan resin prepared in stage (2) are mixed in a certain weight ratio in stage (3) to obtain the self-curing organic synthetic resin composition for additive manufacturing, which has the advantages of high strength at normal temperature, excellent resistance to high temperature, high activity and excellent collapsibility. Thus, the self-curing organic synthetic resin composition provided in the invention is suitable for additive manufacturing, and particularly for 3D printing in mold casting.

Abstract: Circuit board assembly, Display apparatus, Terminal, and Signal processing system. The circuit board assembly comprises a first circuit board, a second circuit board, a third circuit board, and multiple differential signal lines; the first circuit board comprises a first connector which comprises a first lead group comprising N first leads and a second lead group comprising N second lead; the second circuit board comprises a second connector which comprises a third lead group comprising N third leads and a fourth lead group comprising N fourth leads; multiple i-th leads and multiple (i+2)-th leads are in one-to-one correspondence, and the i-th leads and the corresponding (i+2)-th leads are arranged along a first direction; a first differential line of a j-th differential signal line is connected to the (2j?1)-th i-th lead and the (2j?1)-th (i+2)-th lead, its second differential line is connected to the 2j-th i-th lead and the 2j-th (i+2)-th lead.

Abstract: A 3D printing apparatus and a 3D printing method are provided. The 3D printing apparatus includes a frame, and a working area is formed in the frame; a powder spreading device, a printing device, and a moving device are disposed in the working area; the powder spreading device and the printing device are simultaneously driven by the moving device to move in a staggered manner along different moving paths, wherein a powder spreading of the powder spreading device and a printing of the printing device are achieved at a same time. A technical problem in the prior art that a printing efficiency of the 3D printing apparatus is greatly limited resulting from that because powder spreading and printing are completed successively at different steps, time needs to be spent on waiting and a long period is spent on printing after powder spreading on each layer is solved.

Abstract: The embodiments of the present disclosure provide a 3D printing apparatus, a production line using the apparatus, and a cyclical printing method thereof. The 3D printing apparatus includes a frame assembly, and a powder spreading unit, a powder spreading movement system, a powder supply device, an inkjet unit, an inkjet movement system, a working box, a transfer unit, an inner lifting mechanism, an outer lifting mechanism, an accessory unit and an auxiliary unit that are mounted on the frame assembly.

Abstract: A powder-based three-dimensional printing (3DP) method, device and system, and a computer-readable storage medium. The method includes: analyzing printing images of layers corresponding to a part to be printed to determine a target print image and adding a preset mark to the target print image which includes a print image of a target layer that causes a previous powder layer of the target layer to displace during printing; acquiring an image to be printed of a current layer to be printed; identifying the image to be printed to determine whether the preset mark exists on the image to be printed; and if yes, processing the current layer to be printed and/or a previous powder layer of the current layer to be printed such that the previous powder layer of the current layer does not move with powder spreading of the current layer.

Abstract: A unidirectional or bidirectional sand dispensing device, including a discharge port (10), the discharge port includes a lower plate (11) and an upper plate (12), the upper plate is provided above the lower plate, an included angle between a horizontal plane and a straight line where an endpoint of a free end of the upper plate and an endpoint of a free end of the lower plate are located is a leakage angle (13), that is to say, a particulate material forms an inclined plane between the upper plate and the lower plate, and an included angle between the inclined plane and the horizontal plane is the leakage angle, which can be adjusted by changing relative positions of the upper plate and the lower plate. The direction of an opening of the sand passing passage is opposite to a moving direction during the sand dispensing operation.

Abstract: A semiconductor structure includes a semiconductor substrate; fin active regions protruded above the semiconductor substrate; and a gate stack disposed the fin active regions; wherein the gate stack includes a high-k dielectric material layer, and various metal layers disposed on the high-k dielectric material layer. The gate stack has an uneven profile in a sectional view with a first dimension D1 at a top surface, a second dimension D2 at a bottom surface, and a third dimension D3 at a location between the top surface and the bottom surface, and wherein each of D1 and D2 is greater than D3.

Abstract: A sand spreader includes a sand storage chamber. Two sand discharge ports are disposed below the sand storage chamber, and are an upper-layer staggered sand discharge port and a lower-layer sand pressing plate sand discharge port, respectively. The upper-layer staggered sand discharge port comprises a left side sand discharge plate and a right side sand discharge plate configured to intersect with each other. Horizontal staggered ports are formed in a position at the bottom of the two sand discharge plates, and vertical spacing between the staggered ports is adjustable. Also comprised is the lower-layer sand pressing plate sand discharge port, including left and right side sand pressing plates. Vertical sand discharge ports are disposed between the sand pressing plates on the two sides, and the width of the vertical sand discharge ports is adjustable, so as to further facilitate control over the amount of discharged sand.