Patents by Inventor FAN-YU CHEN

FAN-YU CHEN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240147639
    Abstract: An electronic device includes a substrate, a side wiring, a protective film, and a first filler. The substrate has a first surface, a second surface, and a side surface connected between the first surface and the second surface. The side wiring is disposed on the substrate and extends from the first surface to the second surface through the side surface. The protective film is disposed on the side wiring. The side wiring is sandwiched between the substrate and the protective film. An edge of the protective film extends beyond a side wall of the side wiring, and the protective film, the side wall of the side wiring, and the substrate define a gap. The first filler is disposed on the protective film and in the gap, wherein the first filler includes a first material and a plurality of particles mixed within the first material.
    Type: Application
    Filed: October 4, 2023
    Publication date: May 2, 2024
    Applicant: AUO Corporation
    Inventors: Chih-Wen Lu, Fan-Yu Chen, Chun-Yueh Hou, Hsi-Hung Chen
  • Patent number: 11963300
    Abstract: A panel device including a substrate, a conductor pad, a turning wire, and a circuit board is provided. The substrate has a first surface and a second surface connected to the first surface while a normal direction of the second surface is different from a normal direction of the first surface. The conductor pad is disposed on the first surface of the substrate. The turning wire is disposed on the substrate and extends from the first surface to the second surface. The turning wire includes a wiring layer in contact with the conductor pad and a wire covering layer covering the wiring layer. The circuit board is bonded to and electrically connected to the wire covering layer. A manufacturing method of a panel device is also provided herein.
    Type: Grant
    Filed: July 9, 2021
    Date of Patent: April 16, 2024
    Assignee: Au Optronics Corporation
    Inventors: Chun-Yueh Hou, Hao-An Chuang, Fan-Yu Chen, Hsi-Hung Chen, Yun Cheng, Wen-Chang Hsieh, Chih-Wen Lu
  • Patent number: 11533811
    Abstract: An electronic device includes a substrate, multiple side wires, and a protection structure. The substrate has a first main surface, a side surface, and a first multi-turning surface connected between the first main surface and the side surface. The first multi-turning surface includes multiple first turning surfaces with differing normal directions. The side wires are disposed on the substrate. Each of the side wires extends from the first main surface over the first multi-turning surface to the side surface. The protection structure is disposed on the substrate and includes a wire protection part covering the side wires. The wire protection part has a first thickness at the side surface, a second thickness at the first main surface, and a third thickness at at least one of the first turning surfaces. The first thickness is greater than the second thickness, and the second thickness is greater than the third thickness.
    Type: Grant
    Filed: July 7, 2021
    Date of Patent: December 20, 2022
    Assignee: Au Optronics Corporation
    Inventors: Yun Cheng, Hao-An Chuang, Hsi-Hung Chen, Chun-Yueh Hou, Fan-Yu Chen
  • Publication number: 20220053638
    Abstract: A panel device including a substrate, a conductor pad, a turning wire, and a circuit board is provided. The substrate has a first surface and a second surface connected to the first surface while a normal direction of the second surface is different from a normal direction of the first surface. The conductor pad is disposed on the first surface of the substrate. The turning wire is disposed on the substrate and extends from the first surface to the second surface. The turning wire includes a wiring layer in contact with the conductor pad and a wire covering layer covering the wiring layer. The circuit board is bonded to and electrically connected to the wire covering layer. A manufacturing method of a panel device is also provided herein.
    Type: Application
    Filed: July 9, 2021
    Publication date: February 17, 2022
    Applicant: Au Optronics Corporation
    Inventors: Chun-Yueh Hou, Hao-An Chuang, Fan-Yu Chen, Hsi-Hung Chen, Yun Cheng, Wen-Chang Hsieh, Chih-Wen Lu
  • Publication number: 20220053646
    Abstract: An electronic device includes a substrate, multiple side wires, and a protection structure. The substrate has a first main surface, a side surface, and a first multi-turning surface connected between the first main surface and the side surface. The first multi-turning surface includes multiple first turning surfaces with differing normal directions. The side wires are disposed on the substrate. Each of the side wires extends from the first main surface over the first multi-turning surface to the side surface. The protection structure is disposed on the substrate and includes a wire protection part covering the side wires. The wire protection part has a first thickness at the side surface, a second thickness at the first main surface, and a third thickness at at least one of the first turning surfaces. The first thickness is greater than the second thickness, and the second thickness is greater than the third thickness.
    Type: Application
    Filed: July 7, 2021
    Publication date: February 17, 2022
    Applicant: Au Optronics Corporation
    Inventors: Yun Cheng, Hao-An Chuang, Hsi-Hung Chen, Chun-Yueh Hou, Fan-Yu Chen
  • Patent number: 10302587
    Abstract: Test strip and method of operating thereof are provided. The test strip, from the top down, comprises a cover, an insulating layer, an electrode set, and a substrate. More particularly, the electrode set at least comprises a first electrode, a second electrode, and a third electrode. The insulating layer comprises a track, and the cover comprises an inlet, an indication line, and at least one vent. With the third electrode and the indication line in accordance with the present invention, a user may confirm the operation status of the test strip and the loading status of biological samples with ease to improve the accuracy of testing.
    Type: Grant
    Filed: March 29, 2016
    Date of Patent: May 28, 2019
    Assignee: BROADMASTER BIOTECH CORP.
    Inventors: Chien-Hung Lai, Ya-Sian Lin, Fan-Yu Chen
  • Publication number: 20170284955
    Abstract: Test strip and method of operating thereof are provided. The test strip, from the top down, comprises a cover, an insulating layer, an electrode set, and a substrate. More particularly, the electrode set at least comprises a first electrode, a second electrode, and a third electrode. The insulating layer comprises a track, and the cover comprises an inlet, an indication line, and at least one vent. With the third electrode and the indication line in accordance with the present invention, a user may confirm the operation status of the test strip and the loading status of biological samples with ease to improve the accuracy of testing.
    Type: Application
    Filed: March 29, 2016
    Publication date: October 5, 2017
    Inventors: CHIEN-HUNG LAI, YA-SIAN LIN, FAN-YU CHEN