Patents by Inventor Fang-Bo Xu

Fang-Bo Xu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250031301
    Abstract: A circuit board includes a first multilayered structure, a second multilayered structure, a third multilayered structure, a first adhesive layer, a second adhesive layer and a plurality of hollow portions. The first adhesive layer is disposed between the first multilayered structure and the second multilayered structure. The second adhesive layer is disposed between the second multilayered structure and the third multilayered structure, wherein the second multilayered structure is arranged between the first adhesive layer and the second adhesive layer. The plurality of hollow portions are formed on at least one of the first multilayered structure, the second multilayered structure and the third multilayered structure. When the circuit board is bent, a force is applied on the plurality of hollow portions to make the plurality of hollow portions deform and change a cross-sectional area of each of the plurality of hollow portions.
    Type: Application
    Filed: August 28, 2023
    Publication date: January 23, 2025
    Inventors: Hao-Wen ZHONG, Fang-Bo XU
  • Patent number: 11582872
    Abstract: A circuit board with conductive wiring which is precisely shaped and sized includes a two-part conductive element, namely a first conductive wiring layer and a second conductive wiring layer, a first cover film and a second cover film. The first conductive wiring layer and the second conductive wiring layer are in direct contact to each other. A projection of the first conductive wiring layer and a projection of the second conductive wiring layer along a direction perpendicular to the circuit board overlap with each other. The first and the second cover films wrap the first and the second conductive wiring layers, respectively.
    Type: Grant
    Filed: June 6, 2019
    Date of Patent: February 14, 2023
    Assignees: Avary Holding (Shenzhen) Co., Limited., HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
    Inventors: Ke-Jian Wu, Fang-Bo Xu, Peng Wu, Jian-Quan Shen
  • Patent number: 11160166
    Abstract: A printed circuit board with high-capacity and high-current copper circuit includes a conductive trace, a first protecting layer, and a second protecting layer on opposite sides of the conductive trace. The conductive trace includes a basic conductive trace pattern, a first conductive trace pattern, and a second conductive trace pattern. The first and second conductive trace patterns are directly formed on opposite surfaces of the basic copper conductive trace pattern. A width of trace of the first conductive trace pattern is the same as a line width of the second conductive trace pattern.
    Type: Grant
    Filed: January 13, 2018
    Date of Patent: October 26, 2021
    Assignees: Avary Holding (Shenzhen) Co., Limited., HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
    Inventors: Fang-Bo Xu, Peng Wu, Jian-Quan Shen, Ke-Jian Wu
  • Publication number: 20190289723
    Abstract: A circuit board with conductive wiring which is precisely shaped and sized includes a two-part conductive element, namely a first conductive wiring layer and a second conductive wiring layer, a first cover film and a second cover film. The first conductive wiring layer and the second conductive wiring layer are in direct contact to each other. A projection of the first conductive wiring layer and a projection of the second conductive wiring layer along a direction perpendicular to the circuit board overlap with each other. The first and the second cover films wrap the first and the second conductive wiring layers, respectively.
    Type: Application
    Filed: June 6, 2019
    Publication date: September 19, 2019
    Inventors: KE-JIAN WU, FANG-BO XU, PENG WU, JIAN-QUAN SHEN
  • Publication number: 20180317325
    Abstract: A circuit board with conductive wiring which is precisely shaped and sized includes a two-part conductive element, namely a first conductive wiring layer and a second conductive wiring layer. The first conductive wiring layer and the second conductive wiring layer are in direct contact to each other. A projection of the first conductive wiring layer along a direction perpendicular to the circuit board and a projection of the second conductive wiring layer totally cover each other.
    Type: Application
    Filed: June 29, 2017
    Publication date: November 1, 2018
    Inventors: KE-JIAN WU, FANG-BO XU, PENG WU, JIAN-QUAN SHEN
  • Publication number: 20180139842
    Abstract: A printed circuit board with high-capacity and high-current copper circuit includes a conductive trace, a first protecting layer, and a second protecting layer on opposite sides of the conductive trace. The conductive trace includes a basic conductive trace pattern, a first conductive trace pattern, and a second conductive trace pattern. The first and second conductive trace patterns are directly formed on opposite surfaces of the basic copper conductive trace pattern. A width of trace of the first conductive trace pattern is the same as a line width of the second conductive trace pattern.
    Type: Application
    Filed: January 13, 2018
    Publication date: May 17, 2018
    Inventors: FANG-BO XU, PENG WU, JIAN-QUAN SHEN, KE-JIAN WU
  • Patent number: 9907167
    Abstract: A printed circuit board with high-capacity copper circuit includes a conductive trace, a first protecting layer, and a second protecting layer formed on opposite sides of the conductive trace. The conductive trace includes a base conductive trace pattern, a first conductive trace pattern, and a second conductive trace pattern. The first and second conductive trace patterns are directly formed on opposite surfaces of the base copper conductive trace pattern. A trace width of the first conductive trace pattern is the same as a line width of the second conductive trace pattern.
    Type: Grant
    Filed: December 29, 2016
    Date of Patent: February 27, 2018
    Assignees: Avary Holding (Shenzhen) Co., Limited., HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
    Inventors: Fang-Bo Xu, Peng Wu, Jian-Quan Shen, Ke-Jian Wu