Patents by Inventor Fang-Chuang Liu

Fang-Chuang Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for improving a solder bump adhesion bond to a UBM contact layer
    Patent number: 6541366
    Abstract: A method for improving an adhesion bond between a solder material and an under bump metallization (UBM) layer including providing at least two UBM layers overlying a chip bonding pad including an uppermost UBM layer forming a contact layer for forming a solder bump thereon; depositing a solder bump precursor material overlying the contact layer to form a solder column; exposing the sidewalls of the solder column to include the contact layer sidewalls; oxidizing the contact layer sidewalls to form a contact layer sidewall oxide at a temperature lower than the melting point of the solder bump precursor material; and forming a solder bump by reflowing the precursor material to wet the contact layer surface to exclude the contact layer sidewalls.
    Type: Grant
    Filed: January 8, 2002
    Date of Patent: April 1, 2003
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Shih-Ming Chin, Fang-Chuang Liu, Chia-Jen Cheng, Hsiu-Mei Yu