Patents by Inventor Fang Jie
Fang Jie has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11929260Abstract: Embodiments of methods and apparatus for reducing warpage of a substrate are provided herein. In some embodiments, a method for reducing warpage of a substrate includes: applying an epoxy mold over a plurality of dies on the substrate in a dispenser tool; placing the substrate on a pedestal in a curing chamber, wherein the substrate has an expected post-cure deflection in a first direction; inducing a curvature on the substrate in a direction opposite the first direction; and curing the substrate by heating the substrate in the curing chamber.Type: GrantFiled: August 24, 2021Date of Patent: March 12, 2024Assignee: APPLIED MATERIALS, INC.Inventors: Fang Jie Lim, Chin Wei Tan, Jun-Liang Su, Felix Deng, Sai Kumar Kodumuri, Ananthkrishna Jupudi, Nuno Yen-Chu Chen
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Patent number: 11881436Abstract: Methods and apparatus for processing a substrate are provided. For example, metrology apparatus configured for use with a substrate processing platform comprise an interferometer configured to obtain a first set of measurements at a first set of points along a surface of a substrate, a sensor configured to obtain a second set of measurements at a second set of points different from the first set of points along the surface of the substrate, an actuator configured to position the interferometer and the sensor at various positions along a measurement plane parallel to the surface of the substrate for obtaining the first set of measurements and the second set of measurements, and a substrate support comprising a substrate support surface for supporting the substrate beneath the measurement plane while obtaining the first set of measurements and the second set of measurements.Type: GrantFiled: July 7, 2021Date of Patent: January 23, 2024Assignee: APPLIED MATERIALS, INC.Inventors: Jun-Liang Su, Chin Wei Tan, Fang Jie Lim
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Patent number: 11871667Abstract: Methods and apparatus for processing a substrate are provided herein. For example, a system for processing a substrate includes a process chamber comprising a first processing volume and a second processing volume, a carrier disposed in the first processing volume, comprising a first thermoelectric module (TEM), and configured to support the substrate while the substrate is being heated or cooled, a chuck disposed within the second processing volume, comprising a second TEM, and configured to receive the substrate from the carrier and to support the substrate while the substrate is being heated or cooled, and a system controller configured to monitor a temperature of at least one of the substrate, the carrier, or the chuck during operation, and based on the temperature of the at least one of the substrate, the carrier, or the chuck, supply current to at least one of the first TEM or the second TEM.Type: GrantFiled: September 17, 2020Date of Patent: January 9, 2024Assignee: APPLIED MATERIALS, INC.Inventors: Sriskantharajah Thirunavukarasu, Puay Han Tan, Karrthik Parathithasan, Jun-Liang Su, Fang Jie Lim, Chin Wei Tan, Wei Jie Dickson Teo
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Patent number: 11835393Abstract: A microprobe is provided that includes a microsphere optical resonator operatively coupled to a nanoscatterer. The microsphere optical resonator includes a back surface and a front surface opposite the front surface. The front surface is configured to receive a focused laser beam, and the nanoscatterer is positioned adjacent to the back surface.Type: GrantFiled: December 11, 2018Date of Patent: December 5, 2023Assignee: Washington UniversityInventors: Lan Yang, Fang-Jie Shu, Xuefeng Jiang, Guangming Zhao
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Patent number: 11819420Abstract: The disclosure relates to a spinal intervertebral body fusion device including an adjustable spacer, a first and second pushing piece, and an operative piece. The adjustable spacer includes a first and second supporting plate. The first supporting plate portion is movably installed on the second supporting plate portion. The first and second supporting plate portions form a first and second opening respectively located at two opposite sides of the adjustable spacer. The first pushing piece located at the first opening and is partially clamped by the first and second supporting plate portions. The second pushing piece located at the second opening is partially clamped by the first and second supporting plate portions. The operative piece is movably disposed through the second pushing piece and screwed to the first pushing piece. The operative piece has an annular slot, and the second pushing piece is partially located in the annular slot.Type: GrantFiled: December 23, 2019Date of Patent: November 21, 2023Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Fang-Jie Jang, Pei-I Tsai, Chih-Chieh Huang, De-Yau Lin, Wei-Lun Fan, Yi-Hung Wen, Kuo-Yi Yang, Hsin-Hsin Shen
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Patent number: 11596450Abstract: A low-profile offset-type spinal fusion device includes a first screw, a connection base, a nut and a compression part. The first screw has an external thread and a flange. The connection base includes a penetration part and a connection part disposed no higher than the penetration part, and can sleeve the first screw through a first hole of the penetration part to contact the flange with opposite ends of the first screw protruding out of the first hole. The nut, used to engage the first screw, has a bottom surface to contact against the penetration part. When the first screw is installed by penetrating the first hole, the nut and the flange are located to opposite ends of the first hole. The compression part is to screw into a cavity of the connection part for depressing a connecting bar tightly in the cavity.Type: GrantFiled: August 31, 2021Date of Patent: March 7, 2023Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Hsin-Hsin Shen, Pei-I Tsai, Chih-Chieh Huang, Kuo-Yi Yang, Yi-Hung Wen, Wei-Lun Fan, Fang-Jie Jang, Shih-Ping Lin
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Publication number: 20230061379Abstract: Embodiments of methods and apparatus for reducing warpage of a substrate are provided herein. In some embodiments, a method for reducing warpage of a substrate includes: applying an epoxy mold over a plurality of dies on the substrate in a dispenser tool; placing the substrate on a pedestal in a curing chamber, wherein the substrate has an expected post-cure deflection in a first direction; inducing a curvature on the substrate in a direction opposite the first direction; and curing the substrate by heating the substrate in the curing chamber.Type: ApplicationFiled: August 24, 2021Publication date: March 2, 2023Inventors: Fang Jie LIM, Chin Wei TAN, Jun-Liang SU, Felix DENG, Sai Kumar KODUMURI, Ananthkrishna JUPUDI, Nuno Yen-Chu CHEN
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Publication number: 20230009864Abstract: Methods and apparatus for processing a substrate are provided. For example, metrology apparatus configured for use with a substrate processing platform comprise an interferometer configured to obtain a first set of measurements at a first set of points along a surface of a substrate, a sensor configured to obtain a second set of measurements at a second set of points different from the first set of points along the surface of the substrate, an actuator configured to position the interferometer and the sensor at various positions along a measurement plane parallel to the surface of the substrate for obtaining the first set of measurements and the second set of measurements, and a substrate support comprising a substrate support surface for supporting the substrate beneath the measurement plane while obtaining the first set of measurements and the second set of measurements.Type: ApplicationFiled: July 7, 2021Publication date: January 12, 2023Inventors: Jun-Liang SU, Chin Wei TAN, Fang Jie LIM
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Publication number: 20230000881Abstract: In one aspect, pharmaceutical compositions comprising a CDK2 inhibitor and one or more of at least one agent known to treat a hearing impairment and at least one agent known to prevent a hearing impairment, and methods of treating and/or preventing hearing impairments or disorders using the compositions are disclosed. This abstract is intended as a scanning tool for purposes of searching in the particular art and is not intended to be limiting of the present invention.Type: ApplicationFiled: July 12, 2022Publication date: January 5, 2023Applicant: St. Jude Children's Research HospitalInventors: Jian Zuo, Tal Teitz, Fang Jie, Goktug Asli, Chen Taosheng, Min Jaeki, R. Kiplin Guy
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Patent number: 11529435Abstract: The present disclosure provides a method for manufacturing a porous film, including: preparing a polymer mixture solution, wherein the polymer mixture solution includes polycaprolactone and at least one hydrophobic polymer; adding solid particles as a dispersing agent to the polymer mixture solution and mixing the solid particles with the polymer mixture solution, wherein the amount of solid particles added is enough to convert the polymer mixture solution into a solid mixture; drying the solid mixture to form a film; and washing the film with a washing fluid to remove the solid particles from the film to form the porous film, wherein the weight ratio of the polycaprolactone to the at least one hydrophobic polymer is about 1:0.1-10, and wherein the weight ratio of the polycaprolactone and the at least one hydrophobic polymer to the solid particles is about 1:0.01-250.Type: GrantFiled: May 5, 2021Date of Patent: December 20, 2022Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Hsin-Hsin Shen, Ming-Chia Yang, Chia-Chi Ho, Fang-Jie Jang, Che-Yu Ou, Chi-Hsiang Liao, Brian Hsu, Tai-Horng Young
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Publication number: 20220175432Abstract: A bone screw includes an external screw thread, an internal supporter structure and a porous layer. The internal supporter structure is inside the external screw thread. The internal supporter structure includes a screw thread supporter or a polygonal wall supporter. The porous layer is on a surface of the internal supporter structure. Therefore, the bone screw has an increased strength and also provides postoperative healing effect.Type: ApplicationFiled: December 4, 2020Publication date: June 9, 2022Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Hsin-Hsin SHEN, Pei-I TSAI, Kuo-Yi YANG, Fang-Jie JANG, An-Li CHEN, Shih-Ping LIN, Chih-Chieh HUANG, Yi-Hung WEN, Wei-Lun FAN, Shin-I HUANG
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Publication number: 20220175423Abstract: A low-profile offset-type spinal fusion device includes a first screw, a connection base, a nut and a compression part. The first screw has an external thread and a flange. The connection base includes a penetration part and a connection part disposed no higher than the penetration part, and can sleeve the first screw through a first hole of the penetration part to contact the flange with opposite ends of the first screw protruding out of the first hole. The nut, used to engage the first screw, has a bottom surface to contact against the penetration part. When the first screw is installed by penetrating the first hole, the nut and the flange are located to opposite ends of the first hole. The compression part is to screw into a cavity of the connection part for depressing a connecting bar tightly in the cavity.Type: ApplicationFiled: August 31, 2021Publication date: June 9, 2022Inventors: HSIN-HSIN SHEN, PEI-I TSAI, CHIH-CHIEH HUANG, KUO-YI YANG, YI-HUNG WEN, WEI-LUN FAN, FANG-JIE JANG, SHIH-PING LIN
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Patent number: 11351037Abstract: The disclosure relates to a vertebral body implant including a flexible main body and at least one pedicle screw joint. The flexible main body is an integrally formed single piece having at least one joint-accommodating hole and at least one opening connected to the at least one joint-accommodating hole. The pedicle screw joint is an integrally formed single piece movably accommodated in the at least one joint-accommodating hole.Type: GrantFiled: December 30, 2019Date of Patent: June 7, 2022Assignees: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE, NATIONAL TAIWAN UNIVERSITY HOSPITALInventors: Fang-Jie Jang, Pei-I Tsai, De-Yau Lin, An-Li Chen, Fon-Yih Tsuang, Chih-Chieh Huang, Hsin-Hsin Shen
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Publication number: 20220085268Abstract: Methods and apparatus for processing a substrate are provided herein. For example, a system for processing a substrate includes a process chamber comprising a first processing volume and a second processing volume, a carrier disposed in the first processing volume, comprising a first thermoelectric module (TEM), and configured to support the substrate while the substrate is being heated or cooled, a chuck disposed within the second processing volume, comprising a second TEM, and configured to receive the substrate from the carrier and to support the substrate while the substrate is being heated or cooled, and a system controller configured to monitor a temperature of at least one of the substrate, the carrier, or the chuck during operation, and based on the temperature of the at least one of the substrate, the carrier, or the chuck, supply current to at least one of the first TEM or the second TEM.Type: ApplicationFiled: September 17, 2020Publication date: March 17, 2022Inventors: Sriskantharajah THIRUNAVUKARASU, Puay Han TAN, Karrthik PARATHITHASAN, Jun-Liang SU, Fang Jie LIM, Chin Wei TAN, Wei Jie Dickson TEO
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Publication number: 20220079639Abstract: One embodiment of the disclosure relates to a flexible bone fixation device including two first fixation parts and a first flexible spanning part, connected between the two first fixation parts. The first flexible spanning part has a plurality of first cuts spaced apart by one another.Type: ApplicationFiled: December 4, 2020Publication date: March 17, 2022Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Fang-Jie JANG, Pei-I TSAI, An-Li CHEN, Wei-Lun FAN, Shih-Ping LIN, Yi-Hung WEN, De-Yau LIN, Shun-Mao YANG, Ying-Hao SU, Huan-Jang KO
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Patent number: 11177146Abstract: Methods and apparatus for processing a substrate are provided herein. For example, a system for processing a substrate includes a process chamber comprising a first processing volume and a second processing volume; a first heating device configured to heat a substrate to a first temperature; a carrier configured to support the substrate while the substrate is being heated using the first heating device to the first temperature and transfer the substrate to and from each of the first processing volume and the second processing volume; a second heating device configured to maintain the substrate at or near the first temperature; and a chuck configured to receive the substrate from the carrier, and comprising an outer zone and an inner zone having independent variable pressure control to apply a chucking force at the outer zone that is different from a chucking force provided at the inner zone.Type: GrantFiled: October 31, 2019Date of Patent: November 16, 2021Assignee: APPLIED MATERIALS, INC.Inventors: Qi Jie Peng, Chin Wei Tan, Jun-Liang Su, Fang Jie Lim, Sriskantharajah Thirunavukarasu, Arvind Sundarrajan, Puay Han Tan
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Publication number: 20210322625Abstract: The present disclosure provides a method for manufacturing a porous film, including: preparing a polymer mixture solution, wherein the polymer mixture solution includes polycaprolactone and at least one hydrophobic polymer; adding solid particles as a dispersing agent to the polymer mixture solution and mixing the solid particles with the polymer mixture solution, wherein the amount of solid particles added is enough to convert the polymer mixture solution into a solid mixture; drying the solid mixture to form a film; and washing the film with a washing fluid to remove the solid particles from the film to form the porous film, wherein the weight ratio of the polycaprolactone to the at least one hydrophobic polymer is about 1:0.1-10, and wherein the weight ratio of the polycaprolactone and the at least one hydrophobic polymer to the solid particles is about 1:0.01-250.Type: ApplicationFiled: May 5, 2021Publication date: October 21, 2021Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Hsin-Hsin SHEN, Ming-Chia YANG, Chia-Chi HO, Fang-Jie JANG, Che-Yu OU, Chi-Hsiang LIAO, Brian HSU, Tai-Horng YOUNG
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Patent number: 11027040Abstract: The present disclosure provides a method for manufacturing a porous film, including: preparing a polymer mixture solution, wherein the polymer mixture solution includes polycaprolactone and at least one hydrophobic polymer; adding solid particles as a dispersing agent to the polymer mixture solution and mixing the solid particles with the polymer mixture solution, wherein the amount of solid particles added is enough to convert the polymer mixture solution into a solid mixture; drying the solid mixture to form a film; and washing the film with a washing fluid to remove the solid particles from the film to form the porous film, wherein the weight ratio of the polycaprolactone to the at least one hydrophobic polymer is about 1:0.1-10, and wherein the weight ratio of the polycaprolactone and the at least one hydrophobic polymer to the solid particles is about 1:0.01-250.Type: GrantFiled: December 27, 2017Date of Patent: June 8, 2021Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Hsin-Hsin Shen, Ming-Chia Yang, Chia-Chi Ho, Fang-Jie Jang, Che-Yu Ou, Chi-Hsiang Liao, Brian Hsu, Tai-Horng Young
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Publication number: 20210137699Abstract: The disclosure relates to a spinal intervertebral body fusion device including an adjustable spacer, a first and second pushing piece, and an operative piece. The adjustable spacer includes a first and second supporting plate. The first supporting plate portion is movably installed on the second supporting plate portion. The first and second supporting plate portions form a first and second opening respectively located at two opposite sides of the adjustable spacer. The first pushing piece located at the first opening and is partially clamped by the first and second supporting plate portions. The second pushing piece located at the second opening is partially clamped by the first and second supporting plate portions. The operative piece is movably disposed through the second pushing piece and screwed to the first pushing piece. The operative piece has an annular slot, and the second pushing piece is partially located in the annular slot.Type: ApplicationFiled: December 23, 2019Publication date: May 13, 2021Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Fang-Jie JANG, Pei-I TSAI, Chih-Chieh HUANG, De-Yau LIN, Wei-Lun FAN, Yi-Hung WEN, Kuo-Yi YANG, Hsin-Hsin SHEN
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Publication number: 20210137698Abstract: The disclosure relates to a vertebral body implant including a flexible main body and at least one pedicle screw joint. The flexible main body is an integrally formed single piece having at least one joint-accommodating hole and at least one opening connected to the at least one joint-accommodating hole. The pedicle screw joint is an integrally formed single piece movably accommodated in the at least one joint-accommodating hole.Type: ApplicationFiled: December 30, 2019Publication date: May 13, 2021Applicants: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE, NATIONAL TAIWAN UNIVERSITY HOSPITALInventors: Fang-Jie JANG, Pei-I TSAI, De-Yau LIN, An-Li CHEN, Fon-Yih TSUANG, Chih-Chieh HUANG, Hsin-Hsin SHEN