Patents by Inventor Fang-Jong LIU

Fang-Jong LIU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230066203
    Abstract: The present invention provides a pocket fabric, including at least one tubular pocket, where each tubular pocket includes: a tubular sidewall formed between two ends of the tubular pocket; at least two filling chambers formed between the two ends and surrounded by the tubular sidewall; and at least one mesh barrier layer provided between two filling chambers and substantially perpendicular to the tubular sidewall, wherein the filling chambers are communicated with each other. The mesh barrier layer allows fluffy filler to be maintained in the filling chamber and substantially prevents it from moving to adjacent filling chambers, so that the filler cannot accumulate in one place due to gravity or other external forces. Therefore, the pocket fabric of the present invention can maintain the desired warmth retention property after a period of use with filler evenly distributed inside.
    Type: Application
    Filed: August 24, 2022
    Publication date: March 2, 2023
    Inventors: Fang-Jong LIU, Ling Li LIN, Chia-Hao LIN
  • Patent number: 11546974
    Abstract: The present invention provides a conductive fabric comprising base cloth and a conductive metallic circuit structure formed on the surface of the base cloth. The conductive metallic circuit structure comprises at least one metallic seed layer and at least one chemical-plating layer. The metallic seed layer is an evaporation-deposition layer or a sputter-deposition layer and has a circuit pattern. The chemical-plating layer is applied over the surface of the metallic seed layer. The conductive fabric has improved conductivity and heat generation efficiency.
    Type: Grant
    Filed: October 16, 2020
    Date of Patent: January 3, 2023
    Assignee: FORMOSA TAFFETA CO., LTD.
    Inventors: Fang-Jong Liu, Hsing-Nan Chung, Meng-Yueh Wu
  • Publication number: 20210120634
    Abstract: The present invention provides a conductive fabric comprising base cloth and a conductive metallic circuit structure formed on the surface of the base cloth. The conductive metallic circuit structure comprises at least one metallic seed layer and at least one chemical-plating layer. The metallic seed layer is an evaporation-deposition layer or a sputter-deposition layer and has a circuit pattern. The chemical-plating layer is applied over the surface of the metallic seed layer. The conductive fabric has improved conductivity and heat generation efficiency.
    Type: Application
    Filed: October 16, 2020
    Publication date: April 22, 2021
    Inventors: Fang-Jong Liu, Hsing-Nan Chung, Meng-Yueh Wu
  • Publication number: 20210053315
    Abstract: A sandwich fabric with multi-layered pockets is provided. The sandwich fabric comprises at least one first outer layer, at least one second outer layer, at least one interlayer positioned between the first outer layer and the second outer layer, at least one first sandwiched yarn positioned between its adjacent first outer layer and interlayer, and at least one second sandwiched yarn positioned between its adjacent second outer layer and interlayer, in which multiple pockets are formed by joining each interlayer with its adjacent layer, wherein joints of the first outer layer and the interlayer are adjacent to a pocket formed by the interlayer joining with a non-first outer layer; and joints of the second outer layer joining with an interlayer are adjacent to pockets formed of the interlayer joining with a non-second outer layer. Each of the sandwiched yarns consists of warp yarn, weft yarn or both warp yarn and weft yarn.
    Type: Application
    Filed: August 18, 2020
    Publication date: February 25, 2021
    Inventors: Ling Li LIN, Chia-Hao LIN, Fang-Jong LIU