Patents by Inventor Fang-Ling Kuo

Fang-Ling Kuo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • THERMAL INTERFACE MATERIAL AND FILLER USED THEREIN
    Publication number: 20060199878
    Abstract: A filler used in thermal interface materials (TIMs) is disclosed. The filler is composed of a plurality of electrically conductive particles, on which a non-electrically conductive films is formed for preventing the electrically conductive particles from electrical conducting with each other. The present invention also provides a thermal interface material (TIM) including the above-mentioned filler.
    Type: Application
    Filed: September 28, 2005
    Publication date: September 7, 2006
    Inventors: Kuang-Cheng Fan, Bar-Long Denq, Fang-Ling Kuo