Abstract: A semiconductor apparatus includes a driver circuit wafer including a plurality of driver circuits arranged in an array, a bonding metal layer formed over the driver circuit wafer, and a horizontally continuous functional device epi-structure layer formed over the bonding metal layer and covering the driver circuits.

Abstract: A semiconductor apparatus includes a driver circuit wafer including a plurality of driver circuits arranged in an array, a bonding metal layer formed over the driver circuit wafer, and a horizontally continuous functional device epi-structure layer formed over the bonding metal layer and covering the driver circuits.

Abstract: A light-emitting diode (LED) projector includes an LED display panel and a projection lens arranged in front of LED display panel and configured to collect and project light emitted by the LED display panel. The LED display panel includes an LED panel and a micro lens array arranged over the LED panel. The LED panel includes a substrate, a driver circuit array on the substrate and including a plurality of pixel driver circuits arranged in an array, and an LED array including a plurality of LED dies each being coupled to one of the pixel driver circuits. The micro lens array includes a plurality of micro lenses each corresponding to and being arranged over at least one of the LED dies.

Abstract: Various embodiments include a semiconductor device with thin-film transistor (TFT) circuitry monolithically integrated with other non-TFT functional devices. One example is an integrated LED display panel, in which an array of LEDs is integrated with corresponding TFT driver circuitry. The TFT driver circuitry typically is an array of pixel drivers that drive the LEDs.

Abstract: Various embodiments include a display panel with integrated micro lens array. The display panel typically includes an array of pixel light sources (e.g., LEDs) electrically coupled to corresponding pixel driver circuits (e.g., FETs). The array of micro lenses are aligned to the pixel light sources and positioned to reduce the divergence of light produced by the pixel light sources. The display panel may also include an integrated optical spacer to maintain the positioning between the micro lenses and pixel driver circuits.

Abstract: Embodiments include a manufacturing method of making a semiconductor device via multiple stages of alignment bonding and substrate removal. One example is an integrated full-color LED display panel, in which multiple wafers with different arrays of LEDs are integrated onto a host wafer with driver circuitry. The driver circuitry typically is an array of pixel drivers that drive individual LEDs on the display panel.

Abstract: A light-emitting diode (LED) projector includes an LED display panel and a projection lens arranged in front of LED display panel and configured to collect and project light emitted by the LED display panel. The LED display panel includes an LED panel and a micro lens array arranged over the LED panel. The LED panel includes a substrate, a driver circuit array on the substrate and including a plurality of pixel driver circuits arranged in an array, and an LED array including a plurality of LED dies each being coupled to one of the pixel driver circuits. The micro lens array includes a plurality of micro lenses each corresponding to and being arranged over at least one of the LED dies.

Abstract: Mass transfer of micro structures are effected from one substrate to another using adhesives. In the context of an integrated micro LED display, a micro LED array is fabricated on a native substrate and corresponding CMOS pixel drivers are fabricated on a separate substrate. The micro LED substrate (e.g., sapphire) and the CMOS substrate (e.g., silicon) may be incompatible. For example, they may have different thermal coefficients of expansion which make it difficult to bond the micro LEDs to the pixel driver circuitry. The micro LED array is transferred to an intermediate substrate (e.g., silicon) by use of an adhesive. This intermediate substrate may be used in a process of bonding the micro LED array to the array of pixel drivers. The intermediate substrate is separated from the micro LED array by releasing the adhesive.

Abstract: Various embodiments include a display panel with integrated micro lens array. The display panel typically includes an array of pixel light sources (e.g., LEDs) electrically coupled to corresponding pixel driver circuits (e.g., FETs). The array of micro lenses are aligned to the pixel light sources and positioned to reduce the divergence of light produced by the pixel light sources. The display panel may also include an integrated optical spacer to maintain the positioning between the micro lenses and pixel driver circuits.

Abstract: Various embodiments include a multi-color micro-LED array light source that enables well-overlapped light beams of different colors. The multi-color micro-LED array light source includes a thermally conductive substrate and multiple arrays of different color micro-LEDs integrated on the thermally conductive substrate. The micro-LEDs within each array are electrically connected so that they can all be driven in unison. The multi-color array light source also includes a controller that is electrically coupled to and that drives the arrays of micro-LEDs. The controller drives the micro-LEDs in a manner that produces an output light distribution with a spatial wavelength and angular distribution that is suitable for use as a light source.

Abstract: A display panel with integrated micro-reflectors. The display panel also includes an array of pixel light sources (e.g., micro-LEDs) electrically coupled to corresponding pixel driver circuits (e.g., FETs). The micro-LEDs produce light and the micro-reflectors reduce the divergence of the light produced by the micro-LEDs. Different designs are possible. The micro-reflectors can have different shapes, include the shape of their sidewalls and the shape of their plan cross-section. The array schemes can also vary, including the number of LEDs per micro-reflector. Different fabrication approaches are also possible. In one approach, a support structure is integrated between micro-LEDs. The sides of the support structure are reflective and serve as the reflective sidewalls of the micro-reflector. Alternately, the LED mesa itself can serve as the support structure.

Abstract: Various embodiments include a display panel with integrated micro lens array. The display panel typically includes an array of pixel light sources (e.g., LEDs) electrically coupled to corresponding pixel driver circuits (e.g., FETs). The array of micro lenses are aligned to the pixel light sources and positioned to reduce the divergence of light produced by the pixel light sources. The display panel may also include an integrated optical spacer to maintain the positioning between the micro lenses and pixel driver circuits.

Abstract: Various embodiments include a display panel with integrated micro lens array. The display panel typically includes an array of pixel light sources (e.g., LEDs) electrically coupled to corresponding pixel driver circuits (e.g., FETs). The array of micro lenses are aligned to the pixel light sources and positioned to reduce the divergence of light produced by the pixel light sources. The display panel may also include an integrated optical spacer to maintain the positioning between the micro lenses and pixel driver circuits.

Abstract: Embodiments include a manufacturing method of making a semiconductor device via multiple stages of alignment bonding and substrate removal. One example is an integrated full-color LED display panel, in which multiple wafers with different arrays of LEDs are integrated onto a host wafer with driver circuitry. The driver circuitry typically is an array of pixel drivers that drive individual LEDs on the display panel.

Abstract: Various embodiments include a semiconductor device with thin-film transistor (TFT) circuitry monolithically integrated with other non-TFT functional devices. One example is an integrated LED display panel, in which an array of LEDs is integrated with corresponding TFT driver circuitry. The TFT driver circuitry typically is an array of pixel drivers that drive the LEDs.

Abstract: A semiconductor apparatus includes a driver circuit wafer including a plurality of driver circuits arranged in an array, a bonding metal layer formed over the driver circuit wafer, and a horizontally continuous functional device epi-structure layer formed over the bonding metal layer and covering the driver circuits.

Abstract: A light-emitting diode (LED) display panel includes a substrate, a driver circuit array on the substrate and including a plurality of pixel driver circuits arranged in an array, an LED array including a plurality of LED dies each being coupled to one of the pixel driver circuits, a micro lens array including a plurality of micro lenses each corresponding to and being arranged over at least one of the LED dies, and an optical spacer formed between the LED array and the micro lens array.

Abstract: A light-emitting diode (LED) projector includes an LED display panel and a projection lens arranged in front of LED display panel and configured to collect and project light emitted by the LED display panel. The LED display panel includes an LED panel and a micro lens array arranged over the LED panel. The LED panel includes a substrate, a driver circuit array on the substrate and including a plurality of pixel driver circuits arranged in an array, and an LED array including a plurality of LED dies each being coupled to one of the pixel driver circuits. The micro lens array includes a plurality of micro lenses each corresponding to and being arranged over at least one of the LED dies.

Abstract: A method for manufacturing non-sewing three-dimensional fabric capable of polychrome printing comprises steps of setting a mold seat formed by a stack of layers of mold powder, reversely pressing a surface layer thereof by a substantial fabric to form a plurality of low-lying grooves corresponding to the patterns, sintering the mold seat under high temperature for getting a ventilative mold plate, and placing and positioning the mold plate in a vacuum suction groove, whereby a half-melted plastic fabric plastered on a top surface of the ventilative mold plate is tightly pressed on a surface of the low-lying grooves by a vacuum suction force and plastic-formed into an initial material with corresponding reverse and three-dimensional patterns.

Abstract: A cushion capable of exhausting heat and moisture includes an airproof bottom fabric, a lumpy foam pad on top of the bottom fabric, and a face fabric on top of the foam pad. The face fabric and the bottom fabric are connected to form a peripheral lamination so that the foam pad is enclosed between the face fabric and the bottom fabric to constitute the cushion having a certain thickness. The cushion has a plurality of air exhaust apertures close to the peripheral lamination. When the cushion is applied to a backpack, the face fabric can absorb the heat and perspiration of a user. When the user acts to compress and restore the foam pad, air is exhausted and inhaled repeatedly through the exhaust apertures of the cushion to expel heat and perspiration so as to provide a cool and comfortable effect.