Patents by Inventor Fang-Po Wang

Fang-Po Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20110280020
    Abstract: An illumination structure for generating specific directional light sources includes a substrate unit, a light-emitting unit and a lens unit. The substrate unit has at least one substrate body. The light-emitting unit has a plurality of light-emitting elements disposed on and electrically connected to the substrate body. The lens unit has a plurality of lens modules sequentially abutted against each other and disposed on the substrate body. Each lens module has a lens frame disposed on the substrate body and a plurality of protruding lens elements separated from each other by a predetermined distance and integrally formed on the lens frame, the protruding lens elements respectively correspond to the light-emitting elements, and each protruding lens element has at least one concave portion formed on a top side thereof and above each light-emitting element and at least two protrusion portions respectively integrally connected to two opposite sides of the concave portion.
    Type: Application
    Filed: November 2, 2010
    Publication date: November 17, 2011
    Applicant: LEDTECH ELECTRONICS CORP.
    Inventors: WEI-CHUN CHEN, PEI-HUNG MENG, FANG-PO WANG
  • Publication number: 20110199768
    Abstract: An assembled LED lamp strip structure for generating continuous lighting includes a substrate unit, a light-emitting unit and a packaging unit. The substrate unit has a plurality of substrate bodies sequentially and electrically connected to form a strip shape. The light-emitting unit has a plurality of linear light-emitting arrays respectively disposed on and electrically connected to the substrate bodies. Each linear light-emitting array has a plurality of light-emitting elements, and light beams generated by each light-emitting element are unobstructively projected outward. The packaging unit has a plurality of packaging bodies respectively disposed on the substrate bodies and respectively covering the linear light-emitting arrays, and the length of each packaging body is substantially the same as the length of each substrate body.
    Type: Application
    Filed: November 2, 2010
    Publication date: August 18, 2011
    Applicant: LEDTECH ELECTRONICS CORP.
    Inventors: JUI-LUN KUO, YAO-I WANG, FANG-PO WANG
  • Publication number: 20110103053
    Abstract: The LED lighting device includes a tubular housing, a light emitting unit, and a reflector. The tubular housing has an accommodating space. The light emitting unit is disposed in the accommodating space and has a plurality of light emitting diodes. The reflector is disposed in the accommodating space and has a wing-shaped reflecting portion. The reflecting portion faces the light emitting unit for reflecting the light source emitted from the light emitting diodes to the lateral directions of the tubular housing. As a result, the light source can be converted to a specific direction. Compare to the fluorescent lamps, the present invention has higher illumination efficiency and a longer operating life. The volume of the lamps and the cost are saved.
    Type: Application
    Filed: April 21, 2010
    Publication date: May 5, 2011
    Applicant: LEDTECH ELECTRONICS CORP.
    Inventors: Wei-Chun Chen, Fang-Po Wang, Yao-I Wang
  • Patent number: 7926985
    Abstract: A custom assembly light-emitting module includes a base unit, a light-emitting unit and a lens unit. The base unit has a heat-dissipating base and two first retaining structures extending upwards from two opposite lateral sides of the heat-dissipating base. The light-emitting unit is detachably disposed on the heat-dissipating base. The lens unit has a lens and two second retaining structures formed on two opposite lateral sides of the lens, wherein the lens unit is detachably disposed over the light-emitting unit by matching the two first retaining structures and the two second retaining structures. Hence, the base unit, the light-emitting unit and the lens unit can be replaced according to the user's different requirements.
    Type: Grant
    Filed: February 1, 2010
    Date of Patent: April 19, 2011
    Assignee: Ledtech Electronics Corp.
    Inventors: Chien-Chen Teng, Fang-Po Wang, Wen-Chieh Chang Chien
  • Publication number: 20100219441
    Abstract: An LED package structure and an LED packaging method are disclosed. The LED package structure includes a substrate, an LED unit and a transparent holding wall. The LED unit is electrically connected and located on the surface of the substrate. The transparent holding wall that corresponds to the LED unit is formed on the surface of the substrate, and has a receiving space. The LED unit is received in the receiving space. By utilizing the transparent holding wall, the colloid is controllably received in the receiving space and uniformly spread on the surface of the LED unit and around the LED unit. Thereby, the quantity of the colloid is easily controlled, and the LED package structure has a wide lighting angle due to the light emitted from the LED unit can pass through the transparent holding wall.
    Type: Application
    Filed: May 17, 2010
    Publication date: September 2, 2010
    Applicant: LEDTECH ELECTRONICS CORP.
    Inventors: JUI-LUN KUO, YAO-I WANG, FANG-PO WANG
  • Patent number: 7772603
    Abstract: An array type light-emitting device with high color rendering index includes: a substrate, an array type light-emitting module, a plurality of wavelength-converting layers, and a plurality of transparent layers. The array type light-emitting module is composed of a plurality of light-emitting chip rows, and each light-emitting chip row has a plurality of first light-emitting chips and at least one second light-emitting chip. The wavelength-converting layers are respectively covered on the first light-emitting chips. Therefore, a part of visible light emitted by the first light-emitting chips is absorbed and converted into visible light with another emission peak wavelength range via the wavelength-converting layers, and the visible light with another emission peak wavelength range mixes with projecting light projected from the second light-emitting chips to make the array type light-emitting device generate mixed white light with a color rendering index of between 90 and 95.
    Type: Grant
    Filed: December 17, 2007
    Date of Patent: August 10, 2010
    Assignee: Ledtech Electronics Corp.
    Inventors: Chih-Liang Su, Hsin-Chun Liu, Fang-Po Wang
  • Publication number: 20100128485
    Abstract: A custom assembly light-emitting module includes a base unit, a light-emitting unit and a lens unit. The base unit has a heat-dissipating base and two first retaining structures extending upwards from two opposite lateral sides of the heat-dissipating base. The light-emitting unit is detachably disposed on the heat-dissipating base. The lens unit has a lens and two second retaining structures formed on two opposite lateral sides of the lens, wherein the lens unit is detachably disposed over the light-emitting unit by matching the two first retaining structures and the two second retaining structures. Hence, the base unit, the light-emitting unit and the lens unit can be replaced according to the user's different requirements.
    Type: Application
    Filed: February 1, 2010
    Publication date: May 27, 2010
    Applicant: LEDTECH ELECTRONICS CORP.
    Inventors: CHIEN-CHEN TENG, FANG-PO WANG, WEN-CHIEH CHANG CHIEN
  • Publication number: 20100103657
    Abstract: An improved custom assembly light-emitting module includes a light-emitting unit and a lens unit. The light-emitting unit has two first retaining structures respectively extended upwards from two opposite lateral sides of the light-emitting unit. The lens unit has a solid lens and two second retaining structures respectively formed on two opposite lateral sides of the solid lens. The lens unit is detachably disposed above the light-emitting unit by matching the two first retaining structures and the two second retaining structures. Hence, the light-emitting unit and the lens unit are changeable according to different requirements of users. In addition, each first retaining structure has a concave retaining portion formed on its outside, and the light-emitting unit is inverted and retained in a hooking unit by the two concave retaining portions mating with the hooking unit.
    Type: Application
    Filed: October 24, 2008
    Publication date: April 29, 2010
    Inventors: Chien-Chen Teng, Fang-Po Wang, Wen-Chieh Chang Chien
  • Patent number: 7655954
    Abstract: An array type light-emitting module includes a blue, a red, a green, a yellow and an amber light-emitting chip sets. Wavelength-converting layer set covers the blue light-emitting chip set. Transparent layer sets cover the red, green, yellow, and amber light-emitting chip sets. A portion of the visible light emitted by the blue light-emitting chip set is converted into visible light with another emission peak wavelength range via the wavelength-converting layer set. The converted visible light mixes with light projected from the red, the green, the yellow and the amber light-emitting chip sets to generate white light with a color rendering index ranging between 90 and 96.
    Type: Grant
    Filed: December 17, 2007
    Date of Patent: February 2, 2010
    Assignee: Ledtech Electronics Corp.
    Inventors: Chih-Liang Su, Hsin-Chun Liu, Fang-Po Wang
  • Publication number: 20100020542
    Abstract: A custom assembly light-emitting module includes a base unit, a light-emitting unit and a lens unit. The base unit has a heat-dissipating base and two first retaining structures extending upwards from two opposite lateral sides of the heat-dissipating base. The light-emitting unit is detachably disposed on the heat-dissipating base. The lens unit has a lens and two second retaining structures formed on two opposite lateral sides of the lens, wherein the lens unit is detachably disposed over the light-emitting unit by matching the two first retaining structures and the two second retaining structures. Hence, the base unit, the light-emitting unit and the lens unit can be replaced according to the user's different requirements.
    Type: Application
    Filed: July 23, 2008
    Publication date: January 28, 2010
    Inventors: Chien-Chen Teng, Fang-Po Wang, Wen-Chieh Chang Chien
  • Publication number: 20090212309
    Abstract: An LED package structure and an LED packaging method are disclosed. The LED package structure includes a substrate, an LED unit and a transparent holding wall. The LED unit is electrically connected and located on the surface of the substrate. The transparent holding wall that corresponds to the LED unit is formed on the surface of the substrate, and has a receiving space. The LED unit is received in the receiving space. By utilizing the transparent holding wall, the colloid is controllably received in the receiving space and uniformly spread on the surface of the LED unit and around the LED unit. Thereby, the quantity of the colloid is easily controlled, and the LED package structure has a wide lighting angle due to the light emitted from the LED unit can pass through the transparent holding wall.
    Type: Application
    Filed: February 27, 2008
    Publication date: August 27, 2009
    Inventors: Jui-Lun Kuo, Yao-I Wang, Fang-Po Wang
  • Publication number: 20090152572
    Abstract: An array type light-emitting device includes a substrate, an array type light-emitting module, a wavelength-converting layer set, and a plurality of transparent layer sets. The array type light-emitting module is composed of a blue, a red, a green, a yellow and an amber light-emitting chip sets. The wavelength-converting layer set is covered on the blue light-emitting chip set. The transparent layer sets are respectively covered on the red, the green, the yellow, the amber light-emitting chip sets. Therefore, a part of visible light emitted by the blue light-emitting chip set is absorbed and converted into visible light with another emission peak wavelength range via the wavelength-converting layer set, and the visible light mixes with projecting light projected from the red, the green, the yellow and the amber light-emitting chip sets to make the array type light-emitting device generate white light with a color rendering index of between 90 and 96.
    Type: Application
    Filed: December 17, 2007
    Publication date: June 18, 2009
    Inventors: Chih-Liang Su, Hsin-Chun Liu, Fang-Po Wang
  • Publication number: 20090152571
    Abstract: An array type light-emitting device with high color rendering index includes: a substrate, an array type light-emitting module, a plurality of wavelength-converting layers, and a plurality of transparent layers. The array type light-emitting module is composed of a plurality of light-emitting chip rows, and each light-emitting chip row has a plurality of first light-emitting chips and at least one second light-emitting chip. The wavelength-converting layers are respectively covered on the first light-emitting chips. Therefore, a part of visible light emitted by the first light-emitting chips is absorbed and converted into visible light with another emission peak wavelength range via the wavelength-converting layers, and the visible light with another emission peak wavelength range mixes with projecting light projected from the second light-emitting chips to make the array type light-emitting device generate mixed white light with a color rendering index of between 90 and 95.
    Type: Application
    Filed: December 17, 2007
    Publication date: June 18, 2009
    Inventors: Chih-Liang Su, Hsin-Chun Liu, Fang-Po Wang
  • Publication number: 20080164487
    Abstract: A ceramic light emitted diode (LED) package has a pair of discrete reflection walls to reflect light emission from the LED. With two opposite reflection walls and two opposite openings around the LED, light emitted from the LED package can be fanned out.
    Type: Application
    Filed: February 15, 2007
    Publication date: July 10, 2008
    Applicant: LEDTECH ELECTRONICS CORP.
    Inventors: Hsin-Chun LIU, Yao-I WANG, Chih-Liang SU, Fang-Po WANG
  • Patent number: D567968
    Type: Grant
    Filed: February 15, 2007
    Date of Patent: April 29, 2008
    Assignee: Ledtech Electronics Corp.
    Inventors: Hsin-Chun Liu, Yao-I Wang, Chih-Liang Su, Fang-Po Wang