Abstract: A semiconductor device and method of manufacturing the same are provided. The semiconductor device includes a substrate and a gate structure disposed on the substrate. The semiconductor device also includes a source region and a drain region disposed within the substrate. The substrate includes a drift region laterally extending between the source region and the drain region. The semiconductor device further includes a first stressor layer disposed over the drift region of the substrate. The first stressor layer is configured to apply a first stress to the drift region of the substrate. In addition, the semiconductor device includes a second stressor layer disposed on the first stressor layer. The second stressor layer is configured to apply a second stress to the drift region of the substrate, and the first stress is opposite to the second stress.

Abstract: A rubber-tired train, and a control method and system thereof are disclosed. The train comprises multiple cars connected in series in turn, the cars include a relatively front car and a relatively rear car, and the front car is able to rotate in a horizontal plane relative to the rear car. The method comprises: acquiring a turning angle of a front car at a target position; determining a turning angle of a rear car at the target position according to the turning angle of the front car; and when it is determined that the rear car reaches the target position, controlling the rear car to steer according to the determined turning angle of the rear car. The rear car can follow the front car to steer, each car of the rubber-tired train can be controlled to steer accurately, allowing the rubber-tired train to run accurately along a preset running plan.

Abstract: The disclosure relates to a packaging structure for a power module, a packaging method and an electric vehicle. The packaging structure includes: a circuit board; at least one power chip, where each power chip is fastened on the circuit board, and each power chip is integrated with a sensor that is capable of detecting a working state of the power chip; and a signal chip, where the signal chip is fastened on the circuit board and separated from the power chip, a compiling program is preset in the signal chip, the signal chip is in a communication connection with each sensor, and the signal chip is configured to be capable of being in a communication connection with a predetermined device, so as to output working state data of each power chip to the predetermined device. By detecting the working state of each power chip, the power chip can be protected precisely in real time.

Abstract: A frame is provided, for applying potting material to a printed circuit board (PCB). The frame includes a plurality of substantially vertically oriented walls arranged to isolate a surface of the PCB into a plurality of zones. This allows the frame to be aligned over the surface of the PCB to isolate the surface of the PCB into a plurality of zones, each zone comprising at least one PCB component; and allows the potting material to be applied into the zones to achieve coverage of the PCB components in that zone.

Abstract: The present invention relates to crystalline forms of 5-chloro-6-{2,6-difluoro-4-[3-(methylamino)propoxy]phenyl}-N-[(1S)-2,2,2-trifluoro-1-methylethyl][1,2,4]triazolo[1,5-a]pyrimidin-7-amine salts; processes for the production thereof; pharmaceutical compositions thereof; and methods for inhibiting tumor growth therewith.

Abstract: The present invention relates to crystalline forms of 5-chloro-6-{2,6-difluoro-4-[3-(methylamino)propoxy]phenyl}-N-[(1S)-2,2,2-trifluoro-1-methylethyl][1,2,4]triazolo[1,5-a]pyrimidin-7-amine salts; processes for the production thereof; pharmaceutical compositions thereof; and methods for inhibiting tumor growth therewith.