Abstract: A semiconductor device and method of manufacturing the same are provided. The semiconductor device includes a substrate and a gate structure disposed on the substrate. The semiconductor device also includes a source region and a drain region disposed within the substrate. The substrate includes a drift region laterally extending between the source region and the drain region. The semiconductor device further includes a first stressor layer disposed over the drift region of the substrate. The first stressor layer is configured to apply a first stress to the drift region of the substrate. In addition, the semiconductor device includes a second stressor layer disposed on the first stressor layer. The second stressor layer is configured to apply a second stress to the drift region of the substrate, and the first stress is opposite to the second stress.

Abstract: Various examples and techniques pertaining to audio output monitoring for failure detection of warning sound playback are described. In one aspect, audio data, which includes a plurality of bits of a first sound sample and one or more control bits for integrity check, is retrieved from a data storage. The audio data is processed by: (i) performing an integrity check on the first sound sample based on the one or more control bits, and (ii) playing back a first sound using the first sound sample. The first sound can be a warning sound in automobile applications.

Abstract: Various examples and techniques pertaining to audio output monitoring for failure detection of warning sound playback are described. In one aspect, audio data, which includes a plurality of bits of a first sound sample and one or more control bits for integrity check, is retrieved from a data storage. The audio data is processed by: (i) performing an integrity check on the first sound sample based on the one or more control bits, and (ii) playing back a first sound using the first sound sample. The first sound can be a warning sound in automobile applications.

Abstract: Various examples and techniques pertaining to audio output monitoring for failure detection of warning sound playback are described. In one aspect, audio data, which includes a plurality of bits of a first sound sample and one or more control bits for integrity check, is retrieved from a data storage. The audio data is processed by: (i) performing an integrity check on the first sound sample based on the one or more control bits, and (ii) playing back a first sound using the first sound sample. The first sound can be a warning sound in automobile applications.

Abstract: Various examples and techniques pertaining to audio output monitoring for failure detection of warning sound playback are described. In one aspect, audio data, which includes a plurality of bits of a first sound sample and one or more control bits for integrity check, is retrieved from a data storage. The audio data is processed by: (i) performing an integrity check on the first sound sample based on the one or more control bits, and (ii) playing back a first sound using the first sound sample. The first sound can be a warning sound in automobile applications.

Abstract: The present invention is a method for separating a workpiece from a common substrate. It includes the steps of providing the workpiece, generating, within a beam source, a beam of laser pulses configured to modify a portion of the workpiece, determining a depth for creating a modified region based upon a characteristic of the workpiece and modifying a plurality of regions within the workpiece to form a plurality of modified regions. Modifying the plurality of regions includes directing the beam of laser pulses from an output of the beam source onto the workpiece, causing relative motion between the workpiece and the output of the beam source while directing the beam of laser pulses onto workpiece, and modifying a characteristic of the pulses of the beam upon generating a number of pulses which generally correspond to creating the modified regions to the determined depth.

Abstract: Laser output (114) is employed to mark an article (100) including a layer (104) supported by a substrate (102), wherein the layer (104) has a thickness (t) that is less than or equal to 50 microns. The laser output (114) is focused to a numerical aperture diffraction-limited spot size (32) of less than or equal to 5 microns at a focal point (80) of the beam waist (90) and directed into the layer (104) to form a plurality of structures comprising a plurality of laser-induced cracks within the layer (104) and within a region of the article (100), wherein the laser-induced cracks terminate within the layer (104) without extending to the substrate (102) or an outer surface (108) of the layer (104), and wherein the plurality of structures are configured to scatter light incident upon the article (100).

Abstract: A power managing method, applied to an electronic system comprising a power providing device and one or more system modules, the power providing device comprising at least one battery. The method comprises: (a) determining a total power budget of the power providing device; (b) obtaining system information of the electronic system; (c) determining an available power budget according to the total power budget and the system information; and (d) allocating the available power budget to the one or more system modules according to the system information.

Abstract: Laser output (114) is employed to mark an article (100) including a layer (104) supported by a substrate (102), wherein the layer (104) has a thickness (t) that is less than or equal to 50 microns. The laser output (114) is focused to a numerical aperture diffraction-limited spot size (32) of less than or equal to 5 microns at a focal point (80) of the beam waist (90) and directed into the layer (104) to form a plurality of structures comprising a plurality of laser-induced cracks within the layer (104) and within a region of the article (100), wherein the laser-induced cracks terminate within the layer (104) without extending to the substrate (102) or an outer surface (108) of the layer (104), and wherein the plurality of structures are configured to scatter light incident upon the article (100).

Abstract: A method and laser processing system (2) addresses a substrate (102) with three different sets of laser processing parameters to achieve different surface effects in the substrate (102). A first set of laser parameters is employed to form a recess (106) in the substrate. A second set of laser parameters is employed to polish a surface (108) of the recess (106). A third set of laser parameters is employed to modify a polished surface (108) of the recess (106) to have optical characteristics that satisfy conditions for a desirable visual appearance.

Abstract: The present invention is a method for separating a workpiece from a common substrate. It includes the steps of providing the workpiece, generating, within a beam source, a beam of laser pulses configured to modify a portion of the workpiece, determining a depth for creating a modified region based upon a characteristic of the workpiece and modifying a plurality of regions within the workpiece to form a plurality of modified regions. Modifying the plurality of regions includes directing the beam of laser pulses from an output of the beam source onto the workpiece, causing relative motion between the workpiece and the output of the beam source while directing the beam of laser pulses onto workpiece, and modifying a characteristic of the pulses of the beam upon generating a number of pulses which generally correspond to creating the modified regions to the determined depth.

Abstract: An LED lamp includes a first light device and a second light device. The first light device includes a first cover and a first light strip received in the first cover. The second light device included a second cover and a second light strip received in the second cover. The second light device is movably mounted to the first light device. A light emitting area of the second light strip of the second light device is changeable according to movement of the second light device relative to the first light device whereby a total light emitting area of the LED lamp is adjustable.