Patents by Inventor Fang-Shian Su

Fang-Shian Su has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Phenolic resin with low level of free bisphenol
    Patent number: 7662902
    Abstract: A phenolic resin having not more than 5 wt% of free bisphenol and a molecular weight distribution Mw/Mn of not more than 2.0 is prepared by reacting a bisphenol and aldehyde in the presence of an alkaline catalyst at a temperature of from 0° C. to 100° C., neutralizing with an acid, adding an acid to adjust the pH to from 0 to 6, heating to a temperature of from 50° C. to 200° C, and vacuuming to recover the phenolic resin.
    Type: Grant
    Filed: November 9, 2006
    Date of Patent: February 16, 2010
    Assignee: Chang Chun Plastics Co., Ltd.
    Inventors: Kuen Yuan Hwang, An Pang Tu, Chun Hsiung Kao, Fang Shian Su
  • Novel phenolic resin, its preparation and use thereof
    Publication number: 20070299163
    Abstract: The present invention relates to a novel phenolic resin, which is characterized that the content of free bisphenol contained therein is not more than 5 wt %, and it has a narrow molecular weight distribution represented by Mw/Mn that is not more than 2.0. The present invention also relates to a method for preparing the novel phenolic resin described above and an epoxy resin composition in which the phenolic resin is used as a curing agent.
    Type: Application
    Filed: November 9, 2006
    Publication date: December 27, 2007
    Inventors: Kuen Yuan Hwang, An Pang Tu, Chun Hsiung Kao, Fang Shian Su
  • Halogen-free resin composition
    Patent number: 6900269
    Abstract: Disclosed is a halogen-free resin composition comprising: (A) one or more phosphorus-containing epoxy resins; (B) a hardener; (C) a hardening accelerator; (D) a polyphenylene oxide resin; and (E) a filling material, wherein the hardener of component B has the structure represented by the following formula (I): wherein each symbol is as defined above. The halogen-free resin composition of the present invention without adding halogen has excellent heat resistance and flame retardant property, and excellent dielectric property. The halogen-free resin composition of the present invention is particularly useful in the application of bonding sheets, composite materials, laminated plates, printed circuit boards, copper foil adhesives, inks used for build-up process, semiconductor packaging materials and the like.
    Type: Grant
    Filed: April 11, 2003
    Date of Patent: May 31, 2005
    Assignee: Chang Chun Plastics Co., Ltd.
    Inventors: Kuen-Yuan Hwang, An-Pang Tu, Mong Liang, Chi-Yi Ju, Sheng-Yen Wu, Chun-Hsiung Kao, Fang-Shian Su
  • Halogen-free resin composition
    Publication number: 20040147640
    Abstract: Disclosed is a halogen-free resin composition comprising: (A) one or more phosphorus-containing epoxy resins; (B) a hardener; (C) a hardening accelerator; (D) a polyphenylene oxide resin; and (E) a filling material, wherein the hardener of component B has the structure represented by the following formula (I): 1
    Type: Application
    Filed: April 11, 2003
    Publication date: July 29, 2004
    Inventors: Kuen-Yuan Hwang, An-Pang Tu, Mong Liang, Chi-Yi Ju, Sheng-Yen Wu, Chun-Hsiung Kao, Fang-Shian Su
  • Flame retarding resin composition
    Publication number: 20040077821
    Abstract: Disclosed is a flame retarding resin composition comprising (A) one or more epoxy resins; (B) a hardener; and (C) a hardening accelerator, wherein the hardener of the component B is a phosphorus-containing compound represented by the following formula (I): 1
    Type: Application
    Filed: April 8, 2003
    Publication date: April 22, 2004
    Inventors: Kuen-Yuan Hwang, An-Pang Tu, Chi-Yi Ju, Chun-Hsiung Kao, Fang-Shian Su