Patents by Inventor Fang-Teng Chung

Fang-Teng Chung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8553387
    Abstract: This invention provides an electronic device including a casing and a circuit board. The casing has an opening. The circuit board is located in the casing and at least includes a conductive layer and a surface insulating layer. The conductive layer includes a signal transmission portion and a static induction portion. The static induction portion is electrically disconnected with the signal transmission portion at the conductive layer, and the static induction portion is closer to the opening than the signal transmission portion. The surface insulating layer covers the signal transmission portion on the circuit board and exposes the static induction portion.
    Type: Grant
    Filed: March 7, 2011
    Date of Patent: October 8, 2013
    Assignee: Pegatron
    Inventors: Ching-Jen Wang, Fang-Teng Chung, Wen-Hsieh Hsieh
  • Publication number: 20110317378
    Abstract: This invention provides an electronic device including a casing and a circuit board. The casing has an opening. The circuit board is located in the casing and at least includes a conductive layer and a surface insulating layer. The conductive layer includes a signal transmission portion and a static induction portion. The static induction portion is electrically disconnected with the signal transmission portion at the conductive layer, and the static induction portion is closer to the opening than the signal transmission portion. The surface insulating layer covers the signal transmission portion on the circuit board and exposes the static induction portion.
    Type: Application
    Filed: March 7, 2011
    Publication date: December 29, 2011
    Inventors: Ching-Jen Wang, Fang-Teng Chung, Wen-Hsieh Hsieh