Patents by Inventor Fang-Yu Liu

Fang-Yu Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12255091
    Abstract: Semiconductor processing apparatuses and methods are provided in which an electrostatic discharge (ESD) prevention layer is utilized to prevent or reduce ESD events from occurring between a semiconductor wafer and one or more components of the apparatuses. In some embodiments, a semiconductor processing apparatus includes a wafer handling structure that is configured to support a semiconductor wafer during processing of the semiconductor wafer. The apparatus further includes an ESD prevention layer on the wafer handling structure. The ESD prevention layer includes a first material and a second material, and the second material has an electrical conductivity that is greater than an electrical conductivity of the first material.
    Type: Grant
    Filed: November 21, 2023
    Date of Patent: March 18, 2025
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Tsai-Hao Hung, Ping-Cheng Ko, Tzu-Yang Lin, Fang-Yu Liu, Cheng-Han Wu
  • Publication number: 20250066305
    Abstract: The present invention relates to oral compositions comprising cabozantinib salts and at least one pharmaceutically acceptable excipient and methods of using the oral compositions to increase the oral bioavailability of the cabozantinib and reduce the adverse events associate with the oral administration of cabozantinib. The invention also relates to methods for preparing cabozantinib lauryl sulfate salts.
    Type: Application
    Filed: November 6, 2024
    Publication date: February 27, 2025
    Applicant: Handa Oncology, LLC
    Inventors: Fang-Yu Liu, K.C. Sung, Yu Zhang, Shang Wei Qin, John Duan, George Kraft
  • Publication number: 20250057841
    Abstract: The present invention relates methods for treating thyroid cancer, renal cell carcinoma or hepatocellar carcinoma comprising orally administering to a patient in need of such therapy a therapeutic amount of cabozantinib lauryl sulfate salt, preferably in a capsule form. The method allows the administration of the therapeutic amount of cabozantinib lauryl sulfate salt in a fed state or a fasted state and the administration does not exhibit a food effect.
    Type: Application
    Filed: October 30, 2024
    Publication date: February 20, 2025
    Applicant: Handa Oncology, LLC
    Inventors: Fang-Yu Liu, K.C. Sung, Chin-Yao Yang, Chi-Cheng Lin, Yi-Hsin Lin, Li Qiao
  • Publication number: 20250049797
    Abstract: The present invention relates methods for treating thyroid cancer, renal cell carcinoma or hepatocellar carcinoma comprising orally administering to a patient in need of such therapy a therapeutic amount of cabozantinib lauryl sulfate salt, preferably in a capsule form. The method allows the administration of the therapeutic amount of cabozantinib lauryl sulfate salt in a fed state or a fasted state and the administration does not exhibit a food effect.
    Type: Application
    Filed: October 30, 2024
    Publication date: February 13, 2025
    Applicant: Handa Oncology, LLC
    Inventors: Fang-Yu Liu, K.C. Sung, Chin-Yao Yang, Chi-Cheng Lin, Yi-Hsin Lin, Li Qiao
  • Publication number: 20240366603
    Abstract: The present invention relates methods for treating chronic myeloid leukemia and/or lymphoblastic leukemia by orally administering to a patient in need of such a therapeutic amount of dasatinib lauryl sulfate salt, preferably in a tablet, capsule or suspension form. The method allows the administration of the therapeutic amount of dasatinib lauryl sulfate salt a fed state or a fasted state and the administration does not exhibit a food effect.
    Type: Application
    Filed: July 19, 2024
    Publication date: November 7, 2024
    Applicant: Handa Oncology, LLC
    Inventors: Fang-Yu Liu, K.C. Sung, Chin-Yao Yang, Chi-Cheng Lin, Yi-Hsin Lin, Li Qiao
  • Publication number: 20240360950
    Abstract: An apparatus includes a first portion and a second portion. The first portion includes a first front side wall, a first rear side wall, a top wall, and at least one pivotal pin structure extending from the first rear side wall. The at least one pivotal pin structure comprises a base, a shaft, and a head having a non-circular cross-sectional shape. The second portion includes a second front side wall, a second rear side wall, a bottom wall, and at least one pin holder extending from the second rear side wall. The at least one pin holder defines an opening for accepting the head of the at least one pivotal pin structure at an alignment. The head of the at least one pivotal pin structure extends through the opening. The first portion and the second portion are pivotally movable between an open configuration and a closed container configuration.
    Type: Application
    Filed: July 11, 2024
    Publication date: October 31, 2024
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Tse-Lun Hsu, Fang-Yu Liu, Tsez-Chong Tsai
  • Patent number: 12085220
    Abstract: An apparatus includes a first portion and a second portion. The first portion includes a first front side wall, a first rear side wall, a top wall, and at least one pivotal pin structure extending from the first rear side wall. The at least one pivotal pin structure comprises a base, a shaft, and a head having a non-circular cross-sectional shape. The second portion includes a second front side wall, a second rear side wall, a bottom wall, and at least one pin holder extending from the second rear side wall. The at least one pin holder defines an opening for accepting the head of the at least one pivotal pin structure at an alignment. The head of the at least one pivotal pin structure extends through the opening. The first portion and the second portion are pivotally movable between an open configuration and a closed container configuration.
    Type: Grant
    Filed: August 8, 2023
    Date of Patent: September 10, 2024
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Tse-Lun Hsu, Fang-Yu Liu, Tsez-Chong Tsai
  • Patent number: 12064428
    Abstract: The present invention relates to capsules comprising dasatinib lauryl sulfate salt.
    Type: Grant
    Filed: May 17, 2021
    Date of Patent: August 20, 2024
    Assignee: HANDA ONCOLOGY, LLC
    Inventors: Fang-Yu Liu, K. C. Sung, Chin-Yao Yang, Chi-Cheng Lin, Yi-Hsin Lin, Li Qiao
  • Patent number: 12064430
    Abstract: The present invention relates to cabozantinib lauryl sulfate salt and methods of use.
    Type: Grant
    Filed: January 13, 2023
    Date of Patent: August 20, 2024
    Assignee: Handa Oncology, LLC
    Inventors: Fang-Yu Liu, K. C. Sung, Chin-Yao Yang, Chi-Cheng Lin, Yi-Hsin Lin, Li Qiao
  • Publication number: 20240087932
    Abstract: An apparatus having a first portion including a first front wall, a first rear wall, and a bottom wall integrally coupled to the first front wall and the first rear wall, and pivotal pin structures integrally coupled to and extending from the first rear wall. The apparatus includes a second portion having a second front wall, a second rear wall, and a top wall integrally coupled to the second front wall and the second rear wall, and pin holders integrally coupled to and extending from the second rear wall and at an offset angle with reference to the top wall. The pivotal pin structure includes a base support connected to the first rear wall and a shaft connected to the base support, and the pin holder defines an opening sized and shaped to accept the shaft. The first and second portions are sized and shaped to be pivotally movable between open and closed configurations.
    Type: Application
    Filed: November 20, 2023
    Publication date: March 14, 2024
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Tzu-Chung TSAI, Ping-Cheng KO, Fang-yu LIU, Jhih-Yuan YANG
  • Publication number: 20240087945
    Abstract: Semiconductor processing apparatuses and methods are provided in which an electrostatic discharge (ESD) prevention layer is utilized to prevent or reduce ESD events from occurring between a semiconductor wafer and one or more components of the apparatuses. In some embodiments, a semiconductor processing apparatus includes a wafer handling structure that is configured to support a semiconductor wafer during processing of the semiconductor wafer. The apparatus further includes an ESD prevention layer on the wafer handling structure. The ESD prevention layer includes a first material and a second material, and the second material has an electrical conductivity that is greater than an electrical conductivity of the first material.
    Type: Application
    Filed: November 21, 2023
    Publication date: March 14, 2024
    Inventors: Tsai-Hao HUNG, Ping-Cheng KO, Tzu-Yang LIN, Fang-Yu LIU, Cheng-Han WU
  • Patent number: 11881421
    Abstract: An apparatus having a first portion including a first front wall, a first rear wall, and a bottom wall integrally coupled to the first front wall and the first rear wall, and pivotal pin structures integrally coupled to and extending from the first rear wall. The apparatus includes a second portion having a second front wall, a second rear wall, and a top wall integrally coupled to the second front wall and the second rear wall, and pin holders integrally coupled to and extending from the second rear wall and at an offset angle with reference to the top wall. The pivotal pin structure includes a base support connected to the first rear wall and a shaft connected to the base support, and the pin holder defines an opening sized and shaped to accept the shaft. The first and second portions are sized and shaped to be pivotally movable between open and closed configurations.
    Type: Grant
    Filed: March 29, 2021
    Date of Patent: January 23, 2024
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Tzu-Chung Tsai, Ping-Cheng Ko, Fang-yu Liu, Jhih-Yuan Yang
  • Patent number: 11854860
    Abstract: Semiconductor processing apparatuses and methods are provided in which an electrostatic discharge (ESD) prevention layer is utilized to prevent or reduce ESD events from occurring between a semiconductor wafer and one or more components of the apparatuses. In some embodiments, a semiconductor processing apparatus includes a wafer handling structure that is configured to support a semiconductor wafer during processing of the semiconductor wafer. The apparatus further includes an ESD prevention layer on the wafer handling structure. The ESD prevention layer includes a first material and a second material, and the second material has an electrical conductivity that is greater than an electrical conductivity of the first material.
    Type: Grant
    Filed: November 15, 2022
    Date of Patent: December 26, 2023
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Tsai-Hao Hung, Ping-Cheng Ko, Tzu-Yang Lin, Fang-Yu Liu, Cheng-Han Wu
  • Publication number: 20230383895
    Abstract: An apparatus includes a first portion and a second portion. The first portion includes a first front side wall, a first rear side wall, a top wall, and at least one pivotal pin structure extending from the first rear side wall. The at least one pivotal pin structure comprises a base, a shaft, and a head having a non-circular cross-sectional shape. The second portion includes a second front side wall, a second rear side wall, a bottom wall, and at least one pin holder extending from the second rear side wall. The at least one pin holder defines an opening for accepting the head of the at least one pivotal pin structure at an alignment. The head of the at least one pivotal pin structure extends through the opening. The first portion and the second portion are pivotally movable between an open configuration and a closed container configuration.
    Type: Application
    Filed: August 8, 2023
    Publication date: November 30, 2023
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Tse-Lun HSU, Fang-Yu Liu, Tsez-Chong Tsai
  • Patent number: 11796123
    Abstract: An apparatus includes a first portion and a second portion. The first portion includes a first front side wall, a first rear side wall, a top wall, and at least one pivotal pin structure extending from the first rear side wall. The at least one pivotal pin structure comprises a base, a shaft, and a head having a non-circular cross-sectional shape. The second portion includes a second front side wall, a second rear side wall, a bottom wall, and at least one pin holder extending from the second rear side wall. The at least one pin holder defines an opening for accepting the head of the at least one pivotal pin structure at an alignment. The head of the at least one pivotal pin structure extends through the opening. The first portion and the second portion are pivotally movable between an open configuration and a closed container configuration.
    Type: Grant
    Filed: July 7, 2020
    Date of Patent: October 24, 2023
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Tse-Lun Hsu, Fang-Yu Liu, Tsez-Chong Tsai
  • Publication number: 20230142737
    Abstract: The present invention relates to cabozantinib lauryl sulfate salt and methods of use.
    Type: Application
    Filed: January 13, 2023
    Publication date: May 11, 2023
    Applicant: Handa Oncology, LLC
    Inventors: FANG-YU LIU, K. C. SUNG, CHIN-YAO YANG, CHI-CHENG LIN, YI-HSIN LIN, LI QIAO
  • Patent number: 11633650
    Abstract: A composite golf club head and a method for manufacturing the same are provided. The composite golf club head has a carbon fiber composite body and a striking face. The carbon fiber composite body is formed by multiple carbon fiber prepreg materials or multiple composite prepreg materials including carbon fiber with stacking, a positive pressure, a vacuum negative pressure, and heating. The striking face is made of a carbon fiber composite or metal material, and is fixedly glued to a front opening portion of the carbon fiber composite body. A weight of the carbon fiber composite body is reduced. Center of gravity and moment of inertia can be adjusted easily according to striking distances or feel of striking of different golf club heads for enhancing a striking performance of the composite golf club head.
    Type: Grant
    Filed: January 29, 2021
    Date of Patent: April 25, 2023
    Assignee: O-TA PRECISION INDUSTRY CO., LTD.
    Inventors: Chi-Wen Ling, Wei-Hsiang Chou, Fang-Yu Liu
  • Publication number: 20230077331
    Abstract: Semiconductor processing apparatuses and methods are provided in which an electrostatic discharge (ESD) prevention layer is utilized to prevent or reduce ESD events from occurring between a semiconductor wafer and one or more components of the apparatuses. In some embodiments, a semiconductor processing apparatus includes a wafer handling structure that is configured to support a semiconductor wafer during processing of the semiconductor wafer. The apparatus further includes an ESD prevention layer on the wafer handling structure. The ESD prevention layer includes a first material and a second material, and the second material has an electrical conductivity that is greater than an electrical conductivity of the first material.
    Type: Application
    Filed: November 15, 2022
    Publication date: March 16, 2023
    Inventors: Tsai-Hao HUNG, Ping-Cheng KO, Tzu-Yang LIN, Fang-Yu LIU, Cheng-Han WU
  • Patent number: 11532499
    Abstract: Semiconductor processing apparatuses and methods are provided in which an electrostatic discharge (ESD) prevention layer is utilized to prevent or reduce ESD events from occurring between a semiconductor wafer and one or more components of the apparatuses. In some embodiments, a semiconductor processing apparatus includes a wafer handling structure that is configured to support a semiconductor wafer during processing of the semiconductor wafer. The apparatus further includes an ESD prevention layer on the wafer handling structure. The ESD prevention layer includes a first material and a second material, and the second material has an electrical conductivity that is greater than an electrical conductivity of the first material.
    Type: Grant
    Filed: February 23, 2021
    Date of Patent: December 20, 2022
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Tsai-Hao Hung, Ping-Cheng Ko, Tzu-Yang Lin, Fang-Yu Liu, Cheng-Han Wu
  • Patent number: 11195737
    Abstract: An apparatus for storing and transporting semiconductor elements includes a first portion and a second portion. The first portion includes a first front side wall, a first rear side wall, a top wall, and at least one pin holder integrally extending from the first rear side wall. The second portion includes a second front side wall, a second rear side wall, a bottom wall, and at least one pivotal pin structure integrally coupled with and extending from the second rear side wall. The at least one pivotal pin structure comprises a shaft, and a head connected with the shaft. The at least one pin holder defines a cavity sized and shaped to accept the head of the at least one pivotal pin structure. The first portion and the second portion are pivotally movable between an open configuration and a closed container configuration.
    Type: Grant
    Filed: September 20, 2019
    Date of Patent: December 7, 2021
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Ming-Sung Kuo, Jhih-Yuan Yang, Po-Wei Chen, Fang-yu Liu, Ping-Cheng Ko, Chung-Cheng Chen