Patents by Inventor Fangbin FU

Fangbin FU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11275200
    Abstract: An array substrate and a manufacturing method thereof, a display panel and a display device are disclosed. The array substrate includes a transparent base substrate and an electrode structure provided on the transparent base substrate, the electrode structure including an anti-reflective layer and a first electrode layer, the anti-reflective layer being located between the first electrode layer and the transparent base substrate.
    Type: Grant
    Filed: July 24, 2019
    Date of Patent: March 15, 2022
    Assignees: BEIJING BOE DISPLAY TECHNOLOGY CO., LTD., BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Shoukun Wang, Huibin Guo, Hao Han, Fangbin Fu, Yihe Jia, Yongzhi Song, Zhichang Liu, Jiantao Liu
  • Patent number: 11189641
    Abstract: An array substrate, a manufacturing method thereof, and a display apparatus are provided. The array substrate includes a display area and a non-display area in the periphery of the display area, the display area includes pixel regions, the display and non-display areas are provided with via holes, wherein each pixel region is provided, at a side facing a display side, with a reflection layer configured to reflect light irradiated thereon from an external light source to form a display image; and an anti-deterioration layer in contact with the reflection layer is provided in the via holes in the display and non-display areas. Thus, by using a new material, utilization of external light source is improved without additional masking process, and connection in via holes in the display area, and especially in the non-display area is achieved, which prevents deterioration of the via holes and poor contact resistance.
    Type: Grant
    Filed: July 5, 2018
    Date of Patent: November 30, 2021
    Assignees: BOE TECHNOLOGY GROUP CO., LTD., BEIJING BOE DISPLAY TECHNOLOGY CO., LTD.
    Inventors: Shoukun Wang, Huibin Guo, Hao Han, Fangbin Fu, Yongzhi Song
  • Publication number: 20210366940
    Abstract: The present disclosure discloses a manufacturing method of an array substrate, an array substrate, a display panel and a display device. The manufacturing method includes: forming a metal layer on a base substrate; forming a protective layer on the side, away from the base substrate, of the metal layer, wherein the protective layer is configured to protect the metal layer; forming photoresist on the side, away from the base substrate, of the protective layer; and processing the base substrate, on which the metal layer, the protective layer and the photoresist are formed, by means of a photoetching process to obtain a metal pattern.
    Type: Application
    Filed: November 7, 2018
    Publication date: November 25, 2021
    Inventors: Fangbin Fu, Huibin Guo, Jinchao Bai, Shoukun Wang, Hao Han, Yihe Jia, Yongzhi Song
  • Publication number: 20210223440
    Abstract: An array substrate and a manufacturing method thereof, a display panel and a display device are disclosed. The array substrate includes a transparent base substrate and an electrode structure provided on the transparent base substrate, the electrode structure including an anti-reflective layer and a first electrode layer the anti-reflective layer being located between the first electrode layer and the transparent base substrate.
    Type: Application
    Filed: July 24, 2019
    Publication date: July 22, 2021
    Inventors: Shoukun WANG, Huibin GUO, Hao HAN, Fangbin FU, Yihe JIA, Yongzhi SONG, Zhichang LIU, Jiantao LIU
  • Patent number: 10868275
    Abstract: The present disclosure relates to a display panel. The display panel may include an OILED device and a package structure on the OLED device. The package structure may include a first water-oxygen absorbing layer comprising a first water-oxygen absorbing material. The first water-oxygen absorbing material may include first transition metal nanoparticles and a first metal organic framework coated on a surface of the first transition metal nanoparticles.
    Type: Grant
    Filed: June 10, 2019
    Date of Patent: December 15, 2020
    Assignees: BEIJING BOE DISPLAY TECHNOLOGY CO., LTD., BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Yihe Jia, Xiangqian Ding, Xiaoxiang Zhang, Hao Han, Fangbin Fu, Yongzhi Song
  • Patent number: 10847554
    Abstract: A method for fabricating an array substrate motherboard, an array substrate motherboard and a detection method are provided. The method for fabricating an array substrate motherboard includes depositing a first film on a substrate, wherein a first gap is present between the edge of the first film and the edge of the substrate, coating photoresist on the substrate on which the first film is deposited, and exposing and developing the photoresist to form a first scale pattern from the photoresist. One end of the first scale pattern is flush with the edge of the substrate and the other end covers the first film.
    Type: Grant
    Filed: May 2, 2018
    Date of Patent: November 24, 2020
    Assignees: BEIJING BOE DISPLAY TECHNOLOGY CO., LTD., BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Fangbin Fu, Huibin Guo, Shoukun Wang, Hao Han, Yongzhi Song
  • Publication number: 20200251687
    Abstract: The present disclosure relates to a display panel. The display panel may include an OILED device and a package structure on the OLED device. The package structure may include a first water-oxygen absorbing layer comprising a first water-oxygen absorbing material. The first water-oxygen absorbing material may include first transition metal nanoparticles and a first metal organic framework coated on a surface of the first transition metal nanoparticles.
    Type: Application
    Filed: June 10, 2019
    Publication date: August 6, 2020
    Applicants: BEIJING BOE DISPLAY TECHNOLOGY CO., LTD., BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Yihe Jia, Xiangqian Ding, Xiaoxiang Zhang, Hao Han, Fangbin Fu, Yongzhi Song
  • Publication number: 20190363111
    Abstract: A method for fabricating an array substrate motherboard, an array substrate motherboard and a detection method are provided. The method for fabricating an array substrate motherboard includes depositing a first film on a substrate, wherein a first gap is present between the edge of the first film and the edge of the substrate, coating photoresist on the substrate on which the first film is deposited, and exposing and developing the photoresist to form a first scale pattern from the photoresist. One end of the first scale pattern is flush with the edge of the substrate and the other end covers the first film.
    Type: Application
    Filed: May 2, 2018
    Publication date: November 28, 2019
    Inventors: Fangbin FU, Huibin GUO, Shoukun WANG, Hao HAN, Yongzhi SONG
  • Publication number: 20190103419
    Abstract: An array substrate, a manufacturing method thereof, and a display apparatus are provided. The array substrate includes a display area and a non-display area in the periphery of the display area, the display area includes pixel regions, the display and non-display areas are provided with via holes, wherein each pixel region is provided, at a side facing a display side, with a reflection layer configured to reflect light irradiated thereon from an external light source to form a display image; and an anti-deterioration layer in contact with the reflection layer is provided in the via holes in the display and non-display areas. Thus, by using a new material, utilization of external light source is improved without additional masking process, and connection in via holes in the display area, and especially in the non-display area is achieved, which prevents deterioration of the via holes and poor contact resistance.
    Type: Application
    Filed: July 5, 2018
    Publication date: April 4, 2019
    Inventors: Shoukun WANG, Huibin GUO, Hao HAN, Fangbin FU, Yongzhi SONG