Patents by Inventor Fangbo ZHU

Fangbo ZHU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Moderated deformation of a vapor chamber to match a shape of a heat source
    Patent number: 11437297
    Abstract: Systems, apparatuses, processes, and techniques are provided which are related to a vapor chamber (750) having a first side and a second side opposite the first side, where the first side is to thermally couple to a heat sink (708) and the second side to thermally couple to a heat source. The vapor chamber (750) may include a compressible mechanism disposed within the vapor chamber (750) coupled with the first side and the second side where the second side, when coupled to the heat source, is to deform at least partially to match a shape of the heat source. The compressible mechanism within the vapor chamber (750) may moderate the deformation of the second side.
    Type: Grant
    Filed: September 28, 2018
    Date of Patent: September 6, 2022
    Assignee: Intel Corporation
    Inventors: Guoliang Ying, Jun Lu, Guangying Zhang, Xinglong Xu, Wei Liao, Fangbo Zhu
  • PACKAGE PROTECTOR WITH INTEGRATED GUIDE PIN
    Publication number: 20220200177
    Abstract: Herein described are apparatuses and systems for facilitating alignment of computer component connectors. A package protector may include a body to at least partially surround an integrated circuit package of a circuit card when the package protector is mounted to the circuit card. The package protector may further include a guide pin component that extends from a side of the body, wherein the guide pin component is to be located adjacent to a header of the circuit card when the package protector is mounted to the circuit card, wherein a connector uses the guide pin component to align with the header via a guide pin.
    Type: Application
    Filed: December 2, 2021
    Publication date: June 23, 2022
    Inventors: Jun LU, Wei LIAO, Guangying ZHANG, Liguang DU, Guoliang YING, Fangbo ZHU, Song Kok HANG, Juan A. OROZCO RAMIREZ, Wesley B. MORGAN
  • Package protector with integrated guide pin
    Patent number: 11201420
    Abstract: Herein described are apparatuses and systems for facilitating alignment of computer component connectors. A package protector may include a body to at least partially surround an integrated circuit package of a circuit card when the package protector is mounted to the circuit card. The package protector may further include a guide pin component that extends from a side of the body, wherein the guide pin component is to be located adjacent to a header of the circuit card when the package protector is mounted to the circuit card, wherein a connector uses the guide pin component to align with the header via a guide pin.
    Type: Grant
    Filed: June 22, 2018
    Date of Patent: December 14, 2021
    Assignee: Intel Corporation
    Inventors: Jun Lu, Wei Liao, Guangying Zhang, Liguang Du, Guoliang Ying, Fangbo Zhu, Song Kok Hang, Juan A. Orozco Ramirez, Wesley B. Morgan
  • MODERATED DEFORMATION OF A VAPOR CHAMBER TO MATCH A SHAPE OF A HEAT SOURCE
    Publication number: 20210280496
    Abstract: Systems, apparatuses, processes, and techniques are provided which are related to a vapor chamber (750) having a first side and a second side opposite the first side, where the first side is to thermally couple to a heat sink (708) and the second side to thermally couple to a heat source. The vapor chamber (750) may include a compressible mechanism disposed within the vapor chamber (750) coupled with the first side and the second side where the second side, when coupled to the heat source, is to deform at least partially to match a shape of the heat source. The compressible mechanism within the vapor chamber (750) may moderate the deformation of the second side.
    Type: Application
    Filed: September 28, 2018
    Publication date: September 9, 2021
    Inventors: Guoliang YING, Jun LU, Guanying ZHANG, Xinglong XU, Wei LIAO, Fangbo ZHU
  • PACKAGE PROTECTOR WITH INTEGRATED GUIDE PIN
    Publication number: 20210143566
    Abstract: Herein described are apparatuses and systems for facilitating alignment of computer component connectors. A package protector may include a body to at least partially surround an integrated circuit package of a circuit card when the package protector is mounted to the circuit card. The package protector may further include a guide pin component that extends from a side of the body, wherein the guide pin component is to be located adjacent to a header of the circuit card when the package protector is mounted to the circuit card, wherein a connector uses the guide pin component to align with the header via a guide pin.
    Type: Application
    Filed: June 22, 2018
    Publication date: May 13, 2021
    Inventors: Jun LU, Wei LIAO, Guangying ZHANG, Liguang DU, Guoliang YING, Fangbo ZHU, Song Kok HANG, Juan A. OROZCO RAMIREZ, Wesley B. MORGAN