Patents by Inventor Fangchou Yang

Fangchou Yang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20130082893
    Abstract: Provided herein are devices, systems and techniques for establishing a coincident-phased dual polarization array aperture enabling a wide scan capability, while also presenting a bandwidth of at least about 40%. Radiating elements of such an array include a first ground plane extending between lower and upper edges and a first radiating element positioned above the upper edge of the first ground plane. The array elements also include a second ground plane extending between respective lower and upper edges and disposed substantially orthogonal to the first ground plane. A second radiating element is positioned above the upper edge of the second ground plane, such that the first and second radiating elements have different polarizations. Parallel ground planes of adjacent antenna elements of an array of like elements enhance array performance by providing isolation between such radiating elements and backplane ground by way of a phenomenon generally known as waveguide-below-cutoff.
    Type: Application
    Filed: September 30, 2011
    Publication date: April 4, 2013
    Applicant: RAYTHEON COMPANY
    Inventors: Allen Wang, Fangchou Yang, Hee Kyung Kim
  • Patent number: 8390520
    Abstract: A dual-patch antenna includes a ground plane, a first patch plate parallel to and separated from the ground plane by a separation distance, and a second patch plate separated from the ground plane by the separation distance. The first and second patch plates are coplanar and separated by a radiating slot. An excitation probe isolatedly passes through the ground plane and connects to the first patch plate. A first wall connects an edge of the first patch plate to the ground plane. The first wall is located approximately ¼ wavelength of a mid-band operating frequency from the radiating slot. A second wall connects an edge of the second patch plate to the ground plane. The second wall is located approximately ¼ wavelength of the mid-band operating frequency from the radiating slot. The dual-patch antennas may be organized in an array.
    Type: Grant
    Filed: March 11, 2010
    Date of Patent: March 5, 2013
    Assignee: Raytheon Company
    Inventors: Jar J. Lee, Fangchou Yang, Stan W. Livingston, Jeffrey B. Weber
  • Patent number: 8362856
    Abstract: A radio frequency (RF) transition for a three dimensional molded RF structure is provided. In one embodiment, the invention relates to a radio frequency (RF) transition for an RF structure, the RF transition includes an assembly having a first flexible layer, a second flexible layer, and a third flexible layer, wherein a first section of the assembly includes a microstrip transmission line, wherein a second section of the assembly includes a dielectric stripline transmission line, and wherein a third section of the assembly includes a suspended substrate stripline transmission line.
    Type: Grant
    Filed: November 17, 2009
    Date of Patent: January 29, 2013
    Assignee: Raytheon Company
    Inventors: Clifton Quan, Fangchou Yang, Hee Kyung Kim, Alberto F. Viscarra
  • Patent number: 8274443
    Abstract: A light weight stowable antenna lens array assembly is provided. In one embodiment, the invention relates to a stowable lens antenna array including at least one antenna pair including a transmit antenna on a first layered composite, a receive antenna on a second layered composite, a ground plane on a third layered composite, the ground plane being between and spaced apart from the transmit antenna and the receive antenna, and a balanced transmission line coupling the transmit antenna to the receive antenna, and an articulating structure attached to at least one of the first layered composite, the second layered composite and the third layered composite, the articulating structure having a collapsed configuration and an expanded configuration, wherein at least one of the first layered composite, the second layered composite and the third layered composite includes a polymeric film.
    Type: Grant
    Filed: March 16, 2009
    Date of Patent: September 25, 2012
    Assignee: Raytheon Company
    Inventors: Mark Hauhe, Clifton Quan, Gregg M. Tanakaya, Rohn Sauer, Fangchou Yang
  • Publication number: 20120013514
    Abstract: Systems and methods for exciting long slot radiators of an RF antenna are provided. In one embodiment, the invention relates to a radiator transition assembly for exciting a long slot radiator of an antenna, the transition assembly including a folded flexible circuit substrate including at least two folds forming a long slot radiator, an excitation circuitry configured to generate signals for exciting the long slot radiator, and a microstrip transmission line coupled to the excitation circuitry and positioned along the folded flexible circuit substrate, where the microstrip transmission line extends across an opening of the long slot radiator.
    Type: Application
    Filed: July 14, 2010
    Publication date: January 19, 2012
    Inventors: Fangchou Yang, Hee Kyung Kim, Shahrokh Hashemi-Yeganeh, Clifton Quan, Alberto F. Viscarra, Robert W. Ladera
  • Patent number: 8059049
    Abstract: An exemplary embodiment of a dual band antenna array includes a folded thin circuit board structure with a thin dielectric layer and a conductor layer pattern formed on a first surface of the dielectric layer, the circuit board structure folded in a plurality of folds to form a pleated structure. A first array of radiator structures on the first surface is configured for operation in a first frequency band in a first polarization sense. A second array of radiator structures is configured for operation in a second frequency band in a second polarization sense. A conductor trace pattern is formed on the folded circuit board to carry control signals, DC power and RF signals. Active RF circuit devices are attached to the folded circuit board in signal communication with the conductor trace pattern.
    Type: Grant
    Filed: March 12, 2009
    Date of Patent: November 15, 2011
    Assignee: Raytheon Company
    Inventors: Clifton Quan, Fangchou Yang
  • Patent number: 8043464
    Abstract: Systems and methods for assembling lightweight RF antenna structures are provided. In one embodiment, the invention relates to a process for forming a lightweight antenna including a process for forming a first feed assembly for the antenna, the process for forming the first feed assembly including providing a flat flexible circuit substrate, providing a formed flexible circuit substrate, applying an adhesive to a plurality of locations on a surface of the flat substrate or the formed substrate, joining the flat substrate and the formed substrate using the adhesive, and heating the joined flat substrate and the formed substrate to bond the substrates.
    Type: Grant
    Filed: November 17, 2009
    Date of Patent: October 25, 2011
    Assignee: Raytheon Company
    Inventors: Hee Kyung Kim, Fangchou Yang, Alberto F. Viscarra, Clifton Quan, Derek Pruden
  • Publication number: 20110233324
    Abstract: A radio frequency transparent photovoltaic cell includes a back contact layer formed of an electrically conductive material, at least one aperture formed in the back contact layer, and at least one photovoltaic cell section disposed on the back contact layer. An airship includes one or more radio frequency antennas disposed in an interior of the airship. One or more radio frequency transparent photovoltaic cells are disposed on an outer surface of the airship.
    Type: Application
    Filed: March 25, 2010
    Publication date: September 29, 2011
    Inventors: Daniel F. Sievenpiper, Michael Wechsberg, Fangchou Yang
  • Publication number: 20110221644
    Abstract: A dual-patch antenna includes a ground plane, a first patch plate parallel to and separated from the ground plane by a separation distance, and a second patch plate separated from the ground plane by the separation distance. The first and second patch plates are coplanar and separated by a radiating slot. An excitation probe isolatedly passes through the ground plane and connects to the first patch plate. A first wall connects an edge of the first patch plate to the ground plane. The first wall is located approximately ¼ wavelength of a mid-band operating frequency from the radiating slot. A second wall connects an edge of the second patch plate to the ground plane. The second wall is located approximately ¼ wavelength of the mid-band operating frequency from the radiating slot. The dual-patch antennas may be organized in an array.
    Type: Application
    Filed: March 11, 2010
    Publication date: September 15, 2011
    Inventors: Jar J. Lee, Fangchou Yang, Stan W. Livingston, Jeffrey B. Weber
  • Publication number: 20110115578
    Abstract: A radio frequency (RF) transition for a three dimensional molded RF structure is provided. In one embodiment, the invention relates to a radio frequency (RF) transition for an RF structure, the RF transition includes an assembly having a first flexible layer, a second flexible layer, and a third flexible layer, wherein a first section of the assembly includes a microstrip transmission line, wherein a second section of the assembly includes a dielectric stripline transmission line, and wherein a third section of the assembly includes a suspended substrate stripline transmission line.
    Type: Application
    Filed: November 17, 2009
    Publication date: May 19, 2011
    Inventors: Clifton Quan, Fangchou Yang, Hee Kyung Kim, Alberto F. Viscarra
  • Publication number: 20110114242
    Abstract: Systems and methods for assembling lightweight RF antenna structures are provided. In one embodiment, the invention relates to a process for forming a lightweight antenna including a process for forming a first feed assembly for the antenna, the process for forming the first feed assembly including providing a flat flexible circuit substrate, providing a formed flexible circuit substrate, applying an adhesive to a plurality of locations on a surface of the flat substrate or the formed substrate, joining the flat substrate and the formed substrate using the adhesive, and heating the joined flat substrate and the formed substrate to bond the substrates.
    Type: Application
    Filed: November 17, 2009
    Publication date: May 19, 2011
    Inventors: Hee Kyung Kim, Fangchou Yang, Alberto F. Viscarra, Clifton Quan, Derek Pruden
  • Publication number: 20110024160
    Abstract: A multi-layer microwave corrugated printed circuit board is provided. In one embodiment, the invention relates to a method for interconnecting components of a corrugated printed circuit board, the components including a first flexible layer having a first signal line on a surface of the first flexible layer and a second flexible layer having a second signal line on a surface of the second flexible layer, the method including forming at least one first hole in the first flexible layer, forming a conductive pad on the second flexible layer, forming at least one second hole in a non-conductive adhesive layer, aligning the at least one second hole with the at least one first hole and the conductive pad, bonding the first flexible layer and the second flexible layer, with the non-conductive adhesive layer disposed there between, and filling the at least one first hole and the at least one second hole with a conductive paste to electrically couple the first signal line with the second signal line.
    Type: Application
    Filed: July 31, 2009
    Publication date: February 3, 2011
    Inventors: Clifton Quan, Hee Kyung Kim, Fangchou Yang, Kevin C. Rolston, Edward Marsh Jackson
  • Publication number: 20100231479
    Abstract: A light weight stowable antenna lens array assembly is provided. In one embodiment, the invention relates to a stowable lens antenna array including at least one antenna pair including a transmit antenna on a first layered composite, a receive antenna on a second layered composite, a ground plane on a third layered composite, the ground plane being between and spaced apart from the transmit antenna and the receive antenna, and a balanced transmission line coupling the transmit antenna to the receive antenna, and an articulating structure attached to at least one of the first layered composite, the second layered composite and the third layered composite, the articulating structure having a collapsed configuration and an expanded configuration, wherein at least one of the first layered composite, the second layered composite and the third layered composite includes a polymeric film.
    Type: Application
    Filed: March 16, 2009
    Publication date: September 16, 2010
    Inventors: Mark Hauhe, Clifton Quan, Gregg M. Tanakaya, Rohn Sauer, Fangchou Yang
  • Publication number: 20090231226
    Abstract: An exemplary embodiment of a dual band antenna array includes a folded thin circuit board structure with a thin dielectric layer and a conductor layer pattern formed on a first surface of the dielectric layer, the circuit board structure folded in a plurality of folds to form a pleated structure. A first array of radiator structures on the first surface is configured for operation in a first frequency band in a first polarization sense. A second array of radiator structures is configured for operation in a second frequency band in a second polarization sense. A conductor trace pattern is formed on the folded circuit board to carry control signals, DC power and RF signals. Active RF circuit devices are attached to the folded circuit board in signal communication with the conductor trace pattern.
    Type: Application
    Filed: March 12, 2009
    Publication date: September 17, 2009
    Inventors: Clifton Quan, Fangchou Yang
  • Patent number: 6781554
    Abstract: A unit element of a periodically loaded edge slot array includes a reduced-height waveguide section having top and bottom walls and opposed first and second sidewalls defining a waveguide space. A slot is formed in the first side wall at an angle with respect to a waveguide longitudinal axis. At least one conductive post protrudes from the top wall into the waveguide space. The unit element can be incorporated into sticks of an electronically scanned antenna.
    Type: Grant
    Filed: August 14, 2002
    Date of Patent: August 24, 2004
    Assignee: Raytheon Company
    Inventors: Kuan M. Lee, Reinhardt W. Krueger, Fangchou Yang
  • Publication number: 20040032374
    Abstract: A unit element of a periodically loaded edge slot array includes a reduced-height waveguide section having top and bottom walls and opposed first and second sidewalls defining a waveguide space. A slot is formed in the first side wall at an angle with respect to a waveguide longitudinal axis. At least one conductive post protrudes from the top wall into the waveguide space. The unit element can be incorporated into sticks of an electronically scanned antenna.
    Type: Application
    Filed: August 14, 2002
    Publication date: February 19, 2004
    Inventors: Kuan M. Lee, Reinhardt W. Krueger, Fangchou Yang