Abstract: Techniques are provided for system level modeling of two-phase cooling systems. In one example, a computer-implemented method comprises determining, by a system operatively coupled to a processor, respective sets of steady state values for parameters at inlet-outlet junctions using a system model, wherein the determining is based on first user input specifying a cooling system design comprising a plurality of part objects, wherein adjacent part objects in a flow direction are connected at the inlet-outlet junctions. The computer-implemented method can also comprise generating, by the system, a graphical display that depicts the respective sets of parameter values at the inlet-outlet junctions.

Abstract: Techniques that facilitate two-phase liquid cooling of an electronic device are provided. In one example, an apparatus, such as a cold plate device, comprises a first stackable layer and a second stackable layer. The first stackable layer comprises a first channel formed within the first stackable layer. The first channel comprises a first channel width and the first channel receives a coolant fluid via an inlet port of the apparatus. The second stackable layer comprises a second channel that provides a path for the coolant fluid to flow between the first channel and an outlet port of the apparatus. A width of the second channel increases along a flow direction of the coolant fluid that flows between the inlet port and the outlet port.

Abstract: A cold plate structure in a two-phase cooling system is provided. The cold plate, where the cold plate structure has at least one microchannel with a cross-sectional area along a radial direction, wherein the cross-sectional area expands in a first direction that is substantially tangential to the radial direction and expands in a second direction that is substantially tangential to the radial direction and substantially tangential to the first direction.

Abstract: Techniques that facilitate two-phase liquid cooling of an electronic device are provided. In one example, an apparatus, such as a cold plate device, comprises a first stackable layer and a second stackable layer. The first stackable layer comprises a first channel formed within the first stackable layer. The first channel comprises a first channel width and the first channel receives a coolant fluid via an inlet port of the apparatus. The second stackable layer comprises a second channel that provides a path for the coolant fluid to flow between the first channel and an outlet port of the apparatus. A width of the second channel increases along a flow direction of the coolant fluid that flows between the inlet port and the outlet port.

Abstract: Techniques are provided for system level modeling of two-phase cooling systems. In one example, a computer-implemented method comprises determining, by a system operatively coupled to a processor, respective sets of steady state values for parameters at inlet-outlet junctions using a system model, wherein the determining is based on first user input specifying a cooling system design comprising a plurality of part objects, wherein adjacent part objects in a flow direction are connected at the inlet-outlet junctions. The computer-implemented method can also comprise generating, by the system, a graphical display that depicts the respective sets of parameter values at the inlet-outlet junctions.

Abstract: Techniques that facilitate two-phase liquid cooling of an electronic device are provided. In one example, an apparatus, such as a cold plate device, comprises a first stackable layer and a second stackable layer. The first stackable layer comprises a first channel formed within the first stackable layer. The first channel comprises a first channel width and the first channel receives a coolant fluid via an inlet port of the apparatus. The second stackable layer comprises a second channel that provides a path for the coolant fluid to flow between the first channel and an outlet port of the apparatus. A width of the second channel increases along a flow direction of the coolant fluid that flows between the inlet port and the outlet port.

Abstract: Devices that have integrated cooling structures for counterflow, two-phase cooling and systems thereof are provided. In one example, a first structure can comprise a first cooling channel. The first cooling channel can have a first value of width that increases as the first cooling channel extends from a first side of a heat transfer area towards a second side of the heat transfer area. Also, a second structure can comprise a second cooing channel. The second cooling channel can have a second value of width that increases as the second cooling channel extends from the second side of the heat transfer area towards the first side of the heat transfer area.

Abstract: Techniques are provided for system level modeling of two-phase cooling systems. In one example, a computer-implemented method comprises determining, by a system operatively coupled to a processor, respective sets of steady state values for parameters at inlet-outlet junctions using a system model, wherein the determining is based on first user input specifying a cooling system design comprising a plurality of part objects, wherein adjacent part objects in a flow direction are connected at the inlet-outlet junctions. The computer-implemented method can also comprise generating, by the system, a graphical display that depicts the respective sets of parameter values at the inlet-outlet junctions.

Abstract: A method of forming metallic pillars between a fluid inlet and outlet for two-phase fluid cooling. The method may include; forming an arrangement of metallic pillars between two structures, the metallic pillars are electrically connected to metallic connecting lines that run through each of the two structures, the arrangement of metallic pillars located between a fluid inlet and a fluid channel, the fluid channel having channel walls running between arrangements of the metallic pillars and a fluid outlet, whereby a fluid passes through the arrangement of metallic pillars to flow into the fluid channel.

Abstract: A cold plate structure in a two-phase cooling system is provided. The cold plate, where the cold plate structure has at least one microchannel with a cross-sectional area along a radial direction, wherein the cross-sectional area expands in a first direction that is substantially tangential to the radial direction and expands in a second direction that is substantially tangential to the radial direction and substantially tangential to the first direction.

Abstract: Techniques that facilitate two-phase liquid cooling of an electronic device are provided. In one example, an apparatus, such as a cold plate device, comprises a first stackable layer and a second stackable layer. The first stackable layer comprises a first channel formed within the first stackable layer. The first channel comprises a first channel width and the first channel receives a coolant fluid via an inlet port of the apparatus. The second stackable layer comprises a second channel that provides a path for the coolant fluid to flow between the first channel and an outlet port of the apparatus. A width of the second channel increases along a flow direction of the coolant fluid that flows between the inlet port and the outlet port.

Abstract: Devices that have integrated cooling structures for counterflow, two-phase cooling and systems thereof are provided. In one example, a first structure can comprise a first cooling channel. The first cooling channel can have a first value of width that increases as the first cooling channel extends from a first side of a heat transfer area towards a second side of the heat transfer area. Also, a second structure can comprise a second cooing channel. The second cooling channel can have a second value of width that increases as the second cooling channel extends from the second side of the heat transfer area towards the first side of the heat transfer area.

Abstract: Microfluidic devices, along with methods of their fabrication, are provided. The microfluidic device can include a substrate defining a microchannel formed between a pair of side walls and a bottom surface and a plurality of nanotips positioned within the microchannel and proximate to each side wall such that a boundary layer is formed along each side wall between the plurality of nanotips and the side wall upon addition of a liquid into the microchannel.

Abstract: Devices that have integrated cooling structures for counterflow, two-phase cooling and systems thereof are provided. In one example, a first structure can comprise a first cooling channel. The first cooling channel can have a first value of width that increases as the first cooling channel extends from a first side of a heat transfer area towards a second side of the heat transfer area. Also, a second structure can comprise a second cooing channel. The second cooling channel can have a second value of width that increases as the second cooling channel extends from the second side of the heat transfer area towards the first side of the heat transfer area.

Abstract: Techniques that facilitate two-phase liquid cooling of an electronic device are provided. In one example, an apparatus, such as a cold plate device, comprises a first stackable layer and a second stackable layer. The first stackable layer comprises a first channel formed within the first stackable layer. The first channel comprises a first channel width and the first channel receives a coolant fluid via an inlet port of the apparatus. The second stackable layer comprises a second channel that provides a path for the coolant fluid to flow between the first channel and an outlet port of the apparatus. A width of the second channel increases along a flow direction of the coolant fluid that flows between the inlet port and the outlet port.

Abstract: A method of forming metallic pillars between a fluid inlet and outlet for two-phase fluid cooling. The method may include; forming an arrangement of metallic pillars between two structures, the metallic pillars are electrically connected to metallic connecting lines that run through each of the two structures, the arrangement of metallic pillars located between a fluid inlet and a fluid channel, the fluid channel having channel walls running between arrangements of the metallic pillars and a fluid outlet, whereby a fluid passes through the arrangement of metallic pillars to flow into the fluid channel.

Abstract: A cold plate structure in a two-phase cooling system is provided. The cold plate, where the cold plate structure has at least one microchannel with a cross-sectional area along a radial direction, wherein the cross-sectional area expands in a first direction that is substantially tangential to the radial direction and expands in a second direction that is substantially tangential to the radial direction and substantially tangential to the first direction.

Abstract: Techniques that facilitate two-phase liquid cooling of an electronic device are provided. In one example, an apparatus, such as a cold plate device, comprises a first stackable layer and a second stackable layer. The first stackable layer comprises a first channel formed within the first stackable layer. The first channel comprises a first channel length and the first channel receives a coolant fluid via an inlet port of the apparatus. The second stackable layer comprises a second channel that provides a path for the coolant fluid to flow between the first channel and an outlet port of the apparatus. The second channel comprise a second channel length that is different than the first channel length.

Abstract: A method of forming metallic pillars between a fluid inlet and outlet for two-phase fluid cooling. The method may include; forming an arrangement of metallic pillars between two structures, the metallic pillars are electrically connected to metallic connecting lines that run through each of the two structures, the arrangement of metallic pillars located between a fluid inlet and a fluid channel, the fluid channel having channel walls running between arrangements of the metallic pillars and a fluid outlet, whereby a fluid passes through the arrangement of metallic pillars to flow into the fluid channel.

Abstract: A method of forming metallic pillars between a fluid inlet and outlet for two-phase fluid cooling. The method may include; forming an arrangement of metallic pillars between two structures, the metallic pillars are electrically connected to metallic connecting lines that run through each of the two structures, the arrangement of metallic pillars located between a fluid inlet and a fluid channel, the fluid channel having channel walls running between arrangements of the metallic pillars and a fluid outlet, whereby a fluid passes through the arrangement of metallic pillars to flow into the fluid channel.