Patents by Inventor Fanghua Mei

Fanghua Mei has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230172808
    Abstract: A storage system for storing a drug includes a container, at least one passive cooling system, and an active cooling system. The container includes an interior volume to accommodate at least one drug. The at least one passive cooling system is disposed within the container and includes a phase change material. The active cooling system is operably coupled with the container and, when in an operational mode, maintains a desired temperature within the interior volume of the container.
    Type: Application
    Filed: May 17, 2021
    Publication date: June 8, 2023
    Inventors: Rey T. Chern, Fanghua Mei, Loic Barbedette
  • Patent number: 9891006
    Abstract: Compression molding of metals is used to make microchannel heat exchangers. Heat transfer can be improved by employing controlled microchannel surface roughness. Flux-free bonding is achieved using a eutectic thin-film intermediate layer. Seals are leak-tight, mechanically strong, and uniform across multiple contact areas. The metal heat exchangers may be mass-produced inexpensively, and are useful for applications including the cooling of computer chips and other high-power electronic devices, air conditioning, refrigeration, condenser plates, radiators, fuel cell heat management, and instant water heating.
    Type: Grant
    Filed: January 29, 2016
    Date of Patent: February 13, 2018
    Assignee: BOARD OF SUPERVISORS OF LOUISIANA STATE UNIVERSITY AND AGRICULTURAL AND MECHANICAL COLLEGE
    Inventors: Wen Jin Meng, Fanghua Mei
  • Publication number: 20160161195
    Abstract: Compression molding of metals is used to make microchannel heat exchangers. Heat transfer can be improved by employing controlled microchannel surface roughness. Flux-free bonding is achieved using a eutectic thin-film intermediate layer. Seals are leak-tight, mechanically strong, and uniform across multiple contact areas. The metal heat exchangers may be mass-produced inexpensively, and are useful for applications including the cooling of computer chips and other high-power electronic devices, air conditioning, refrigeration, condenser plates, radiators, fuel cell heat management, and instant water heating.
    Type: Application
    Filed: January 29, 2016
    Publication date: June 9, 2016
    Applicant: BOARD OF SUPERVISORS OF LOUISIANA STATE UNIVERSITY AND AGRICULTURAL AND MECHANICAL COLLEGE
    Inventors: Wen Jin Meng, Fanghua Mei
  • Patent number: 8857234
    Abstract: A process is disclosed for producing metal-based, high-aspect-ratio microscale structures (HARMs), for example microchannels in a heat exchanger. The preferred manufacturing method operates in a continuous mode, and employs low-temperature rolling of metals. A process is disclosed for bonding metal microchannel sheets or plates to flat metal sheets or plates to form single-, double-, and multiple-layered microchannel structures. The process can operate at much lower temperatures than prior methods of compression microscale molding of metals, at room temperature or even lower.
    Type: Grant
    Filed: January 14, 2011
    Date of Patent: October 14, 2014
    Assignee: Board of Supervisors of Louisiana State University and Agricultural and Mechanical College
    Inventors: Wen Jin Meng, Fanghua Mei
  • Publication number: 20110174040
    Abstract: A process is disclosed for producing metal-based, high-aspect-ratio microscale structures (HARMs), for example microchannels in a heat exchanger. The preferred manufacturing method operates in a continuous mode, and employs low-temperature rolling of metals. A process is disclosed for bonding metal microchannel sheets or plates to flat metal sheets or plates to form single-, double-, and multiple-layered microchannel structures. The process can operate at much lower temperatures than prior methods of compression microscale molding of metals, at room temperature or even lower.
    Type: Application
    Filed: January 14, 2011
    Publication date: July 21, 2011
    Inventors: Wen Jin Meng, Fanghua Mei
  • Publication number: 20100288479
    Abstract: Compression molding of metals is used to make microchannel heat exchangers. Heat transfer can be improved by employing controlled microchannel surface roughness. Flux-free bonding is achieved using a eutectic thin-film intermediate layer. Seals are leak-tight, mechanically strong, and uniform across multiple contact areas. The metal heat exchangers may be mass-produced inexpensively, and are useful for applications including the cooling of computer chips and other high-power electronic devices, air conditioning, refrigeration, condenser plates, radiators, fuel cell heat management, and instant water heating.
    Type: Application
    Filed: January 13, 2009
    Publication date: November 18, 2010
    Inventors: Wen Jin Meng, Fanghua Mei