Patents by Inventor Fanghui Ren

Fanghui Ren has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Printed circuit board configuration to facilitate a surface mount double density QSFP connector footprint in a belly-to-belly alignment
    Patent number: 11153971
    Abstract: An electronic device includes a printed circuit board (PCB). The PCB includes first and second grids disposed at a top surface and a bottom surface of the PCB, respectively. Each grid includes a plurality of footprint pins, and a plurality of vias extending through the PCB to the top and bottom surfaces. Each footprint pin includes a connecting end and a free end that opposes the connecting end. Each via includes a contact end located at one of grids and is in electrical contact with the connecting end of one of the footprint pins, and each via further includes a non-contact end that is located at the other of the grids and is not in electrical contact with any of the footprint pins. First and second connectors are mounted to the PCB top and bottom surfaces and connect with the footprint pins of the first and second grids.
    Type: Grant
    Filed: August 24, 2020
    Date of Patent: October 19, 2021
    Assignee: CISCO TECHNOLOGY, INC.
    Inventors: Fanghui Ren, Liang Xue
  • PRINTED CIRCUIT BOARD CONFIGURATION TO FACILITATE A SURFACE MOUNT DOUBLE DENSITY QSFP CONNECTOR FOOTPRINT IN A BELLY-TO-BELLY ALIGNMENT
    Publication number: 20210076495
    Abstract: An electronic device includes a printed circuit board (PCB). The PCB includes first and second grids disposed at a top surface and a bottom surface of the PCB, respectively. Each grid includes a plurality of footprint pins, and a plurality of vias extending through the PCB to the top and bottom surfaces. Each footprint pin includes a connecting end and a free end that opposes the connecting end. Each via includes a contact end located at one of grids and is in electrical contact with the connecting end of one of the footprint pins, and each via further includes a non-contact end that is located at the other of the grids and is not in electrical contact with any of the footprint pins. First and second connectors are mounted to the PCB top and bottom surfaces and connect with the footprint pins of the first and second grids.
    Type: Application
    Filed: August 24, 2020
    Publication date: March 11, 2021
    Inventors: Fanghui Ren, Liang Xue
  • Printed circuit board configuration to facilitate a surface mount double density QSFP connector footprint in a belly-to-belly alignment
    Patent number: 10791629
    Abstract: An electronic device includes a printed circuit board (PCB). The PCB includes first and second grids disposed at a top surface and a bottom surface of the PCB, respectively. Each grid includes a plurality of footprint pins, and a plurality of vias extending through the PCB to the top and bottom surfaces. Each footprint pin includes a connecting end and a free end that opposes the connecting end. Each via includes a contact end located at one of grids and is in electrical contact with the connecting end of one of the footprint pins, and each via further includes a non-contact end that is located at the other of the grids and is not in electrical contact with any of the footprint pins. First and second connectors are mounted to the PCB top and bottom surfaces and connect with the footprint pins of the first and second grids.
    Type: Grant
    Filed: November 13, 2019
    Date of Patent: September 29, 2020
    Assignee: CISCO TECHNOLOGY, INC.
    Inventors: Fanghui Ren, Liang Xue