Patents by Inventor Fang-Jun Liao
Fang-Jun Liao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 7909617Abstract: An electrical connector (1) for connecting a land grid array (LGA) chip with a printed circuit board (PCB) includes a housing (10), and terminals (11) received in passageways (104) of the housing. The housing has a base (100) and sidewalls (12, 14), the base and the sidewalls cooperatively defining a space therebetween for retaining the LGA chip. The base has a multiplicity of walls respectively between every two adjacent passageways along a length thereof, and four raised portions (102) extending upwardly around the base. A multiplicity of protrusions (106) is respectively extended upwardly from the walls. When a force is exerted down the LGA chip to make the LGA chip engage with the terminals, the protrusions and the four raised portions can support the force for separate the force without making the LGA chip deforming downwardly. This ensures that engagement between the connector and the LGA chip is accurate and reliable.Type: GrantFiled: July 16, 2009Date of Patent: March 22, 2011Assignee: Hon Hai Precision Ind. Co., Ltd.Inventors: Fang-Jun Liao, Ming-Lun Szu
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Patent number: 7682160Abstract: A Land Grid Array connector (1) comprises an socket (2) having opposite upper and lower surfaces, a plurality of contacts (4) received in the socket and a retention frame (3) assembled with the socket. Each contact comprises upper and lower contacting sections (41, 42) extending beyond the upper and lower surfaces of the socket adapted for electrically connecting with a Central Processing Unit and Printed Circuit Board. The retention frame comprises a base portion (31) defining an opening to interferentially receive the outer periphery of the socket and four sidewalls (32) extending upwardly beyond the base portion. The socket fills up the opening after assembled to the retention frame and forms a receiving space together with the base portion and the four sidewalls of the retention frame which is originally communicating with the opening before the socket is assembled to the retention frame adapted for accommodating the Central Processing Unit.Type: GrantFiled: December 26, 2007Date of Patent: March 23, 2010Assignee: Hon Hai Precision Ind. Co., Ltd.Inventor: Fang-Jun Liao
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Publication number: 20090280660Abstract: An electrical connector (1) for connecting a land grid array (LGA) chip with a printed circuit board (PCB) includes a housing (10), and terminals (11) received in passageways (104) of the housing. The housing has a base (100) and sidewalls (12, 14), the base and the sidewalls cooperatively defining a space therebetween for retaining the LGA chip. The base has a multiplicity of walls respectively between every two adjacent passageways along a length thereof, and four raised portions (102) extending upwardly around the base. A multiplicity of protrusions (106) is respectively extended upwardly from the walls. When a force is exerted down the LGA chip to make the LGA chip engage with the terminals, the protrusions and the four raised portions can support the force for separate the force without making the LGA chip deforming downwardly. This ensures that engagement between the connector and the LGA chip is accurate and reliable.Type: ApplicationFiled: July 16, 2009Publication date: November 12, 2009Inventors: Fang-Jun Liao, Ming-Lun Szu
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Patent number: 7578684Abstract: A socket assembly (100) adapted for being sucked by a vacuum pickup device has a housing (10) and a vacuum pickup cap (20) mounted to the housing. The vacuum pickup cap has a smooth upper face (21) adapted for being sucked by the vacuum pickup device and a pair of connecting portions (22) respectively disposed at a pair of opposite edges thereof. The vacuum pickup cap includes a pair of projecting portions (23) respectively extending from the connecting portion. Each projecting portion has a touching portion (231) extending upwardly from an upper side thereof and a protrusion (24) formed at a lower side thereof for coupling with the housing.Type: GrantFiled: December 18, 2007Date of Patent: August 25, 2009Assignee: Hon Hai Precision Ind. Co., Ltd.Inventor: Fang-Jun Liao
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Patent number: 7572136Abstract: A ZIF (Zero Insertion Force) socket (1) for electrically connecting a chip module with a printed circuit board (9) comprises a bottom stationary base (11) comprising a base portion (114) and an accommodating portion (113) at one side of the base portion, a top movable cover (12) slidrably assembled to the base and comprising a body portion (121) defining a plurality of through slots (1220) aligning with contact-receiving slots (1120) and a head portion (122) covering the accommodating portion, and an actuator (15) assembled to the base and the cover and is capable of being actuated to drive the cover to slide between open and closed positions relative to the base. The accommodating portion defines a base receiving cavity (1130) therethrough. The head portion defines a cover receiving cavity (1220) therethrough.Type: GrantFiled: February 5, 2008Date of Patent: August 11, 2009Assignee: Hon Hai Precision Ind. Co., Ltd.Inventor: Fang-Jun Liao
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Patent number: 7563107Abstract: An electrical connector (1) for connecting a land grid array (LGA) chip with a printed circuit board (PCB) includes a housing (10), and terminals (11) received in passageways (104) of the housing. The housing has a base (100) and sidewalls (12, 14), the base and the sidewalls cooperatively defining a space therebetween for retaining the LGA chip. The base has a multiplicity of walls respectively between every two adjacent passageways along a length thereof, and four raised portions (102) extending upwardly around the base. A multiplicity of protrusions (106) is respectively extended upwardly from the walls. When a force is exerted down the LGA chip to make the LGA chip engage with the terminals, the protrusions and the four raised portions can support the force for separate the force without making the LGA chip deforming downwardly. This ensures that engagement between the connector and the LGA chip is accurate and reliable.Type: GrantFiled: May 13, 2008Date of Patent: July 21, 2009Assignee: Hon Hai Precision Ind. Co., Ltd.Inventors: Fang-Jun Liao, Ming-Lun Szu
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Patent number: 7556506Abstract: An electrical connector assembly (5) includes an insulative housing, a number of electrical contacts (7) retained in the insulative housing, a chip module disposed above the insulative housing and comprising a number of connecting elements (80) to electrically connect the electrical contacts, and a printed circuit board (6) disposed below the insulative housing and comprising a number of conductive elements (60) to electrically connect the electrical contacts. The central axis of each connecting element of the chip module is aligned with the central axis of the conductive element of the printed circuit board in up-to-down direction.Type: GrantFiled: September 17, 2007Date of Patent: July 7, 2009Assignee: Hon Hai Precision Ind. Co., Ltd.Inventor: Fang-Jun Liao
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Patent number: 7547216Abstract: An electrical connector assembly (100) includes a frame (2) defining a central cavity (21) therein. A connector assembled to the central cavity and at least one alignment post (3) assembled to the frame (2). Each alignment post (3) defining a middle stop section (32) and an upper latching section (33) consisting of number of latching ribs (331) symmetrically arranged around a circle and a lower engaging section formed with a plurality of ribs around outer periphery; and the frame (2) defining at least one locating hole (23) for said alignment post (3) extending through. The frame (2) is sandwiched between the latching section (33) and the stop section (32) of the at least alignment post.Type: GrantFiled: January 18, 2008Date of Patent: June 16, 2009Assignee: Hon Hai Precision Ind. Co., Ltd.Inventors: Igor Polnyl, Fang-Jun Liao
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Patent number: 7542307Abstract: An electrical connector (100) comprises a frame (12) having a center opening (122) thereof and a bearing surface (1211) on a top end thereof, a housing (11) engaging with the opening (122) of the frame (11) having a top surface (111) and a bottom surface (112), and defining a plurality of passageways (113), a plurality of terminals (114) received in the passageways (113) of the housing (11), wherein in assembly, the housing (11) is interfering engaging with inner sides of the opening (122) with the top surface (111) higher than the bearing surface (1211).Type: GrantFiled: August 1, 2007Date of Patent: June 2, 2009Assignee: Hon Hai Precision Ind. Co., Ltd.Inventor: Fang-Jun Liao
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Patent number: 7534114Abstract: A land grid array (LGA) connector assembly (1), comprising: a stiffener (2) defining locating members (4) around the respective corners for receiving and holding the electronics package in position; an insulative housing (3), the housing defining a plurality of contact segments (31, 32, 33, 34) for engaging respective connection sections of an electronics package; a plurality of electrical contacts received in the contact segments (31, 32, 33, 34) of the housing (3); a pick up cap (5) removeably attached to the stiffener (2), providing a smooth flat top surface (501) facilitating to be capable of being handled by a device, thereby manipulating the LGA connector assembly (1) to a desired location on a substrate circuit.Type: GrantFiled: August 20, 2007Date of Patent: May 19, 2009Assignee: Hon Hai Precision Ind. Co., Ltd.Inventor: Fang-Jun Liao
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Patent number: 7534113Abstract: A conduct (3) includes a retention portion (31), a contacting portion (334) extending upwardly from the retention portion (3), a tail portion (34) formed on a distal end of the retention portion. The tail portion (34) has a relatively larger bottom surface vertical to the major surface of the base defining a multilateral-shaped recess (340) adapted to engage a solder member, e.g. solder ball, thereby establishing electrical engagement between the contact and the PCB.Type: GrantFiled: November 26, 2007Date of Patent: May 19, 2009Assignee: Hon Hai Precision Ind. Co., Ltd.Inventors: Fang-Jun Liao, Wen-Chun Chen
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Patent number: 7530822Abstract: An electrical connector assembly (1) includes an electrical connector including an insulative housing (2) having an upper and a lower surfaces, and a number of contacts received in the insulative housing, an pick-up cap (3) assembled to the insulative housing. Four pairs of latching sections (36) extend from four edges of the body portion (30) of the pick-up cap toward the insulative housing (2), and the insulative housing (2) defines four pairs of recesses (224) to latch with the latching sections (36).Type: GrantFiled: February 5, 2008Date of Patent: May 12, 2009Assignee: Hon Hai Precision Ind. Co., Ltd.Inventor: Fang-Jun Liao
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Patent number: 7527507Abstract: An electrical connector assembly (1) includes an electrical connector including an insulative housing (2) having opposite upper and lower surfaces, and a number of contacts received in the insulative housing and partially exposed beyond said upper and lower surfaces of the insulative housing to form upper and lower exposed sections, an upper cover (3) assembled to the upper surface of the insulative housing, and a lower cover (4) assembled to the lower surface of the insulative housing. The contacts are wholly received between the upper and lower covers without exposed outside.Type: GrantFiled: December 26, 2007Date of Patent: May 5, 2009Assignee: Hon Hai Precision Ind. Co., Ltd.Inventors: Fang-Jun Liao, Chun-Yi Chang
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Patent number: 7484984Abstract: An electrical connector (5) includes a plurality of housings (52), a plurality of contacts received in each housing (52), a bracket (51) defining a plurality of sections (511) for receiving the housings (52) therein. Relative to the related art, the electrical connector (5) defines a plurality of separately housings (52) and a bracket (51) having a number of receiving section (511) for receiving the housings (52) therein, which simplifies the mold process and improves the insulative material injected quality.Type: GrantFiled: August 8, 2007Date of Patent: February 3, 2009Assignee: Hon Hai Precision Ind. Co., Ltd.Inventors: Fang-Jun Liao, Chi-Nan Liao
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Patent number: 7476107Abstract: A socket connector (100) includes an insulative housing (1) and a frame (3). The housing defines a mating interface (101), a mounting interface (102) opposite to the mating interface and periphery faces between the mating interface and the mounting interface. The frame has an opening (31) therein to accommodate the housing. At least one retaining device (11) includes a stopper portion (111) and a resilient claw portion (113) unitarily formed on the periphery face of the housing. One face of the frame is supported by the stopper portion and the opposite face is abutted against by the resilient claw potion while the housing is assembled in the opening of the frame.Type: GrantFiled: September 4, 2007Date of Patent: January 13, 2009Assignee: Hon Hai Precision Ind. Co., Ltd.Inventor: Fang-Jun Liao
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Patent number: 7473106Abstract: An electrical connector of the present invention includes at least an wafer (10) mounting a plurality of conductive terminals (30) therein and a plurality of through holes (106) thereon and a frame member (20) receiving the at least a wafer (10). The frame member (20) defines a plurality of retaining portions (206) corresponding with the through holes (106). The retaining portions (206) are retained in the through holes (106) and each retaining portion (206) has a hollow structure (207).Type: GrantFiled: November 16, 2007Date of Patent: January 6, 2009Assignee: Hon Hai Precision Ind. Co., Ltd.Inventors: Fang-Jun Liao, Shuo-Hsiu Hsu
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Patent number: 7473105Abstract: An electrical connector (1) includes a connector body (51) holding a plurality of contacts (52). The connector body includes a base section (511) with four side walls (512) surrounded thereby to form an interior cavity adapted to receive an IC package. A datum protrusion (5120) is provided on each of two adjacent side walls and configured to laterally invade the interior cavity. A chamfered surface (513) is formed along a joint between each of two adjacent side walls and the base section, and further adjacent each of the datum protrusions, thereby avoiding stress generation around the joint between each side wall and the base section.Type: GrantFiled: June 6, 2007Date of Patent: January 6, 2009Assignee: Hon Hai Precision Ind. Co., Ltd.Inventors: Fang-Jun Liao, Jia-Hau Liu, Shuo-Hsiu Hsu
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Patent number: 7473103Abstract: An electrical connector (100) for mounting on a board (3) includes an insulative housing (2) defining a number of passageways (20) and a number of contacts (1) received in corresponding passageways. Each contact includes a base portion (10), a tail portion (12) extending from one side of the base portion and electrically connecting to the board, a contact portion (16) projecting beyond an upper opening (21) of the passageway, and an intermediate portion (15) interconnecting the contact portion and the base portion in such a manner that the contact portion extends along a direction defining an angle with respect to both the base portion and the intermediate portion.Type: GrantFiled: September 4, 2007Date of Patent: January 6, 2009Assignee: Hon Hai Precision Co., Ltd.Inventors: Chi-Nan Liao, Ke-Hao Chen, Fang-Jun Liao
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Patent number: 7435100Abstract: An connector (1) includes an insulative housing (2), and a multiplicity of conductive contacts (3) received in the housing. The housing comprises a mating surface (20) and a mounting surface (21) opposite to the mating surface. The housing defines a plurality of passageways (23) extending vertically therethrough to receive corresponding contacts therein. A seriate stand-offs (24) extends from the two opposite lateral sides of the adjacent passageways on the mounting surface.Type: GrantFiled: March 14, 2007Date of Patent: October 14, 2008Assignee: Hon Hai Precision Ind. Co., Ltd.Inventors: Chun-Yi Chang, Fang-Jun Liao
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Publication number: 20080220628Abstract: An electrical connector (1) for connecting a land grid array (LGA) chip with a printed circuit board (PCB) includes a housing (10), and terminals (11) received in passageways (104) of the housing. The housing has a base (100) and sidewalls (12, 14), the base and the sidewalls cooperatively defining a space therebetween for retaining the LGA chip. The base has a multiplicity of walls respectively between every two adjacent passageways along a length thereof, and four raised portions (102) extending upwardly around the base. A multiplicity of protrusions (106) is respectively extended upwardly from the walls. When a force is exerted down the LGA chip to make the LGA chip engage with the terminals, the protrusions and the four raised portions can support the force for separate the force without making the LGA chip deforming downwardly. This ensures that engagement between the connector and the LGA chip is accurate and reliable.Type: ApplicationFiled: May 13, 2008Publication date: September 11, 2008Inventors: Fang-Jun Liao, Ming-Lun Szu