Abstract: An adjustable slurry dispensing device for use with a chemical mechanical polishing apparatus is disclosed. The slurry arm is pivotally connected to the polishing apparatus and has a slurry delivery assembly that is translatable along the length of the arm. This combination of adjustments allows the user to deposit polishing slurry at a desired location on the polishing pad of the polishing apparatus. The dispensing device may be motorized, in which case the slurry arm may be automatically pivotable and the slurry delivery assembly may be automatically translatable along the slurry arm. The motors may be controlled by a computer, or they may be manually adjusted by the user. A method of using the apparatus is also disclosed.

Abstract: A method for off-line testing a polishing head used in a CMP polishing apparatus is disclosed. The method utilizes at least two sets of pressurizing/vacuuming/venting devices for the independent testing of at least two fluid chambers which may include a membrane chamber, a retaining ring chamber and an innertube chamber normally found in a CMP polishing head. The present invention further discloses an off-line testing apparatus for a chemical mechanical polishing head which includes at least two independent sets of pressurizing/vacuuming/venting devices for testing a CMP head that is equipped with at least two fluid chambers such as a membrane chamber, a retaining ring chamber and an innertube chamber. The method and apparatus can be used advantageously for testing a variety of defects in a CMP polishing head prior to the installation of the head into a CMP apparatus. The defects include leakage between the fluid chambers, loss of vacuum seal in the fluid chambers, and binding between the fluid chambers.

Abstract: An apparatus for calibrating the centering of polishing heads in a polishing machine that is equipped with a plurality of spindles onto which polishing heads are mounted and a method for using such apparatus are disclosed. In the apparatus, a calibration disc is provided which has a hollow shaft mounted at a center of the bottom surface of the disc. A centering pin slidingly engaging an elongated cavity in the hollow shaft such that its protruded tip portion may be adjusted by using a locking device such as a set screw for different calibration procedures. The present invention novel apparatus can be used to calibrate the positioning of a polishing head mounted in a spindle with a pedestal in a load cup that is equipped with a center alignment aperture. The calibration can be conducted not only in the X, Y direction (or in the circumferential direction) of the spindle movement, but also in the Z direction (or a sweep direction) of the traversing spindle that occurs during a polishing operation.